Abstract: The invention relates to a method for operating an electrical energy store, comprising a storage cell for storing electrical energy and a control unit, wherein a safety switch is provided which is designed to interrupt an electrical line of the electrical energy store, wherein a current flowing through the electrical line is detected and an actuation of the safety switch only occurs if the current is below a predefinable threshold value.

Abstract: A tissue clip application fitting set or retrofitting set includes a cap attachment for placement on the distal head of a medical endoscope, which has a placement section and a tissue clip holding section. The cap attachment is notched at least at two angular positions forming at least two notches/slots/grooves. A working channel leads into the hollow chamber and exits the hollow chamber radially in a region distal to the placement section and proximal to the radially supported tissue clip. A first guiding or leading element is arranged after the working channel belonging to the retrofitting set, as seen in the distal direction. A corresponding second guiding or leading element is arranged within the hollow chamber at an angular distance from the first guiding or leading element so as to be oriented in extension to a working channel belonging to the endoscope.

Abstract: Printed circuit board module (30) having a printed circuit board (50) and a heatsink (40), and, provided between the printed circuit board (50) and the heatsink (40), a two-dimensional heat-conducting element (10) comprising a ceramic carrier (12) coated with a phase change material (14, 16). In the printed circuit board (50) or the heatsink (40), a through-bore (59) may be provided to accommodate a screw (80) and one end of the screw (86) may mesh into a receiving hole (49) which preferably has a mating thread and is formed in the heatsink (40) or the printed circuit board (50), wherein a screw head (84) of the screw (80) especially has a sprung washer element (90) beneath it.

Abstract: The present invention is directed to an endoscopic implant cutting and/or fragmenting apparatus of the bipolar type, operating on direct current, comprising an endoscope instrument having at least two opposing electrodes at its distal instrument head forming a cutting gap inbetween for receiving an electrically conductive implant or implant section to generate punctiform physical contact with the implant, and a DC-impulse generator connected to a control device adapted to generate a direct current in a pulsed way such that in a first phase of physical contact, the current pulse is adjusted to induce electric energy into the implant material being sufficient to melt the implant material exclusively in the area of the contact portion and in a second phase of physical noncontact, the current pulse is adjusted to generate an electric arc between at least one electrode and the melted implant material being sufficient to cut the melted implant material.

Abstract: A conductor structural element includes an electronic component which is inserted into a dielectric layer and connected to a conductor pattern structure consisting of an electrically conductive material applied to an electrically conductive base layer by electroplating, wherein at least one contacting element of the electronic component is inserted into an assigned mounting area, which is formed as a recess in the conductor track structure, the at least one contacting element and the conductor track structure being connected to each other in an electrically conductive manner.

Abstract: The disclosure relates to a spacer in the form of an attachment (15) to be mounted to an endoscope (1), said attachment being formed like a cap, enclosing a spatial volume (16) and being made of an insulating material. The attachment (15) is further equipped with a mounting device/adapter (6) designed to be coupled to a distal end of the endoscope (1). The attachment (15) comprises an area (11) designed to be in contact with a target tissue and further forms an aperture (12) enclosing a surface area (12a). Within the spatial volume, there is arranged an electrode (9) comprising a distal (9b) and a proximal (9a) end, the distal (9b) end of the electrode (9) having a predetermined minimum distance to the closest point of the surface area (12a).

Abstract: A power-electronic metal-ceramic module (10) comprising a metal-ceramic substrate (12) made of a ceramic carrier (14) having a metal top and bottom ply (16, 18), which is joined on or in the metal top ply (16) and/or the metal bottom ply (18) with a metal layer (16, 18, 22, 23) forming a frame (24) for accommodating at least one electronic component (30) and at least one electronic component (30) accommodated in the frame (24).

Abstract: A tissue clip application fitting set or retrofitting set includes a cap attachment for placement on the distal head of a medical endoscope, which has a placement section and a tissue clip holding section. The cap attachment is notched at least at two angular positions forming at least two notches/slots/grooves. A working channel leads into the hollow chamber and exits the hollow chamber radially in a region distal to the placement section and proximal to the radially supported tissue clip. A first guiding or leading element is arranged after the working channel belonging to the retrofitting set, as seen in the distal direction. A corresponding second guiding or leading element is arranged within the hollow chamber at an angular distance from the first guiding or leading element so as to be oriented in extension to a working channel belonging to the endoscope.

Abstract: A minimally invasive surgical implant-cutting instrument of the bipolar type, operated with direct current, with an instrument head which is located at the distal end of an instrument shank, wherein at least two mutually opposing instrument branches, preferably of the linear type, are arranged on the instrument head and between them define a cutting gap for receiving an electrically conductive implant or implant section between them. The electrodes are formed on the mutually facing longitudinal sides of the branches or these are each equipped with at least one electrode, which electrodes are in turn shaped at their mutually facing longitudinal sides to form a cutting edge in order to effect a quasi-linear or punctiform physical contact engagement with the electrically conductive implant or implant section for an electrical short circuit of the mutually opposing electrodes.

Abstract: A method for contacting a metallic contact pad embedded in a printed circuit board layer sequence, comprising the steps of producing a first hole matrix having a plurality of holes in a surface of the printed circuit board layer sequence in order to partly expose the metallic contact pad, of applying a metal layer in order to at least partly fill the holes of the first hole matrix, of producing a second hole matrix having a plurality of holes in the surface of the printed circuit board layer sequence in order to partly expose the metallic contact pad, wherein the holes of the second hole matrix are arranged in a manner offset relative to the holes of the first hole matrix, and of applying a metal layer in order to at least partly fill the holes of the second hole matrix, and a correspondingly produced printed circuit board.

Abstract: A method for producing a radio frequency transmitting/receiving element comprising at least one radio frequency antenna and at least one radio frequency chip, and to a corresponding radio frequency transmitting/receiving element made by the method. The method comprises the following steps: providing a temporary rigid carrier; applying a conductor pattern structure comprising the antenna structure of the at least one radio frequency antenna and connection contacts—connected thereto via leads—for the at least one radio frequency chip; arranging the at least one radio frequency chip on the connection contacts of the conductor pattern structure; applying an electrically insulating layer on the conductor pattern structure, such that the at least one radio frequency chip is surrounded by the electrically insulating layer; and removing the temporary rigid carrier.

Abstract: An electronic switching element includes at least one semiconductor switch inserted into a layer sequence of a conductor structure element; and at least two busbars which are configured to contact-connect the at least one semiconductor switch, wherein the at least two busbars run substantially above one another in the layer sequence of the conductor structure element.

Abstract: A method for producing a radio-frequency antenna in a conductor structural element with an encompassing layer sequence, including: providing a rigid carrier having an underside and a top side; defining an antenna assignment section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the antenna assignment section is exposed; placing a radio-frequency substrate above the antenna assignment section with formation of a cavity between the rigid carrier and the radio-frequency substrate; aligning and fixing the radio-frequency substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the radio-frequency substrate with the cavity being left free; cutting the antenna assignment section out of the rigid carrier from the outer underside (remote from the layer construction) of the rigid carrier.

Abstract: Method for producing a conductor structural element with a layer sequence having an internal layer substrate, including the steps: providing a rigid carrier having an underside and a top side; defining a cut-out section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the cut-out section is exposed; placing an internal layer substrate above the cut-out section with formation of a cavity between the rigid carrier and the internal layer substrate; aligning and fixing the internal layer substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the internal layer substrate with the cavity being left free; producing a cut-out by cutting the cut-out section out of the rigid carrier from the outer underside of the rigid carrier.

Abstract: A power-electronic metal-ceramic module (10) comprising a metal-ceramic substrate (12) made of a ceramic carrier (14) having a metal top and bottom ply (16, 18), which is joined on or in the metal top ply (16) and/or the metal bottom ply (18) with a metal layer (16, 18, 22, 23) forming a frame (24) for accommodating at least one electronic component (30) and at least one electronic component (30) accommodated in the frame (24).

Abstract: A printed circuit board element (LP) having at least one electronic switching element (12.1, 12.2, 12.3) integrated in the printed circuit board element (LP), which switching element comprises two semiconductor switches (14, 16) introduced into a layer sequence of the printed circuit board element (LP) and at least two busbars (20, 22, 24) formed to contact the semiconductor switches (14, 16), wherein the busbars (20, 22, 24) run substantially above one another in the layer sequence of the printed circuit board element (LP) and at least one intermediate circuit capacitor (C; C1, C2, C3, C4) arranged between the two busbars (20, 22) is introduced into the layer sequence of the printed circuit board element (LP).

Abstract: Electronic component having a first lead frame consisting of an electrically conductive material. The first lead frame carries a first semiconductor component. In the plane of the lead frame a shunt element is arranged, wherein the shunt element comprises a resistor body arranged between a first terminal contact and a second terminal contact. An electrically conducting connection extends from a terminal of the first semiconductor component through the first lead frame to the first terminal contact of the shunt element. A current measurement with good accuracy is facilitated.

Abstract: A printed circuit board element (LP) having at least one electronic switching element (12.1, 12.2, 12.3) integrated in the printed circuit board element (LP), which switching element comprises two semiconductor switches (14, 16) introduced into a layer sequence of the printed circuit board element (LP) and at least two busbars (20, 22, 24) formed to contact the semiconductor switches (14, 16), wherein the busbars (20, 22, 24) run substantially above one another in the layer sequence of the printed circuit board element (LP) and at least one intermediate circuit capacitor (C; C1, C2, C3, C4) arranged between the two busbars (20, 22) is introduced into the layer sequence of the printed circuit board element (LP).

Abstract: An electronic sub-assembly (36) comprising at least one electronic component (14) embedded in a sequence of layers, wherein the electronic component (14) is arranged in a recess of an electrically conductive central layer (16) and directly adjoins a resin layer (12, 20) on each side.

Abstract: An electronic assembly group comprising a printed circuit board structure in a multilayer configuration that has at least two electrically conductive layers. The electronic assembly group also comprises an additional passive component that is connected to the two electrically conductive layers, each of which has at least one segment that extends beyond the multilayer structure to form connection regions, the passive component making contact directly at the connection regions.