Abstract: Electronic component having a first lead frame consisting of an electrically conductive material. The first lead frame carries a first semiconductor component. In the plane of the lead frame a shunt element is arranged, wherein the shunt element comprises a resistor body arranged between a first terminal contact and a second terminal contact. An electrically conducting connection extends from a terminal of the first semiconductor component through the first lead frame to the first terminal contact of the shunt element. A current measurement with good accuracy is facilitated.

Abstract: A method for contacting a metallic contact pad embedded in a printed circuit board layer sequence, comprising the steps of producing a first hole matrix having a plurality of holes in a surface of the printed circuit board layer sequence in order to partly expose the metallic contact pad, of applying a metal layer in order to at least partly fill the holes of the first hole matrix, of producing a second hole matrix having a plurality of holes in the surface of the printed circuit board layer sequence in order to partly expose the metallic contact pad, wherein the holes of the second hole matrix are arranged in a manner offset relative to the holes of the first hole matrix, and of applying a metal layer in order to at least partly fill the holes of the second hole matrix, and a correspondingly produced printed circuit board.

Abstract: The invention relates to an electronic component, namely a printed circuit board element comprising a first semiconductor component (14) which is arranged on an upper side of an electrically conductive intermediate plate (16) such that a connector pad (18) of the semiconductor component (14) is electrically contacted with the intermediate plate (16) and comprising a second semiconductor component (15) which is arranged on a lower side of the intermediate plate (16). The second semiconductor component (15) comprises a first connector pad (17) and a second connector pad (19), wherein both connector pads (17, 19) are aligned in the direction of the intermediate plate (16) and wherein the first connector pad (17) is contacted with the intermediate plate (16), and wherein the second connector pad (19) is not contacted with the intermediate plate (16). Moreover, the invention relates to a method for producing such a printed circuit board element.

Abstract: Method for producing a conductor structural element with a layer sequence having an internal layer substrate, including the steps: providing a rigid carrier having an underside and a top side; defining a cut-out section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the cut-out section is exposed; placing an internal layer substrate above the cut-out section with formation of a cavity between the rigid carrier and the internal layer substrate; aligning and fixing the internal layer substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the internal layer substrate with the cavity being left free; producing a cut-out by cutting the cut-out section out of the rigid carrier from the outer underside of the rigid carrier.

Abstract: An electronic switching element includes at least one semiconductor switch inserted into a layer sequence of a conductor structure element; and at least two busbars which are configured to contact-connect the at least one semiconductor switch, wherein the at least two busbars run substantially above one another in the layer sequence of the conductor structure element.

Abstract: A method for producing a radio-frequency antenna in a conductor structural element with an encompassing layer sequence, including: providing a rigid carrier having an underside and a top side; defining an antenna assignment section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the antenna assignment section is exposed; placing a radio-frequency substrate above the antenna assignment section with formation of a cavity between the rigid carrier and the radio-frequency substrate; aligning and fixing the radio-frequency substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the radio-frequency substrate with the cavity being left free; cutting the antenna assignment section out of the rigid carrier from the outer underside (remote from the layer construction) of the rigid carrier.

Abstract: Electronic sub-assembly comprising a carrier layer and a mounting area with at least one electronic component, wherein the carrier layer has at least in portions a material with a low coefficient of thermal expansion to adjust the coefficient of thermal expansion of the carrier layer, and wherein at least one compensation layer is provided on the carrier layer adjacent to the installation area, on which compensation layer an electrically insulating, thermally conductive layer and at least one electrically conductive layer are provided.

Abstract: The present invention is directed to an endoscopic implant cutting and/or fragmenting apparatus of the bipolar type, operating on direct current, comprising an endoscope instrument having at least two opposing electrodes at its distal instrument head forming a cutting gap inbetween for receiving an electrically conductive implant or implant section to generate punctiform physical contact with the implant, and a DC-impulse generator having or connected to a control device adapted to generate a direct current in a pulsed way being controlled by the control device such that in a first phase of physical contact, the current pulse is adjusted preferably by controlling the current value at the electrodes to induce electric energy into the implant material being sufficient to melt the implant material exclusively in the area of the contact portion and in a second phase of physical noncontact, the current pulse is adjusted preferably by controlling the voltage value at the electrodes to generate an electric arc betwe

Abstract: The invention relates to an electronic component, namely a printed circuit board element comprising a first semiconductor component (14) which is arranged on an upper side of an electrically conductive intermediate plate (16) such that a connector pad (18) of the semiconductor component (14) is electrically contacted with the intermediate plate (16) and comprising a second semiconductor component (15) which is arranged on a lower side of the intermediate plate (16). The second semiconductor component (15) comprises a first connector pad (17) and a second connector pad (19), wherein both connector pads (17, 19) are aligned in the direction of the intermediate plate (16) and wherein the first connector pad (17) is contacted with the intermediate plate (16), and wherein the second connector pad (19) is not contacted with the intermediate plate (16). Moreover, the invention relates to a method for producing such a printed circuit board element.

Abstract: A method for producing a radio frequency transmitting/receiving element comprising at least one radio frequency antenna and at least one radio frequency chip, and to a corresponding radio frequency transmitting/receiving element made by the method. The method comprises the following steps: providing a temporary rigid carrier; applying a conductor pattern structure comprising the antenna structure of the at least one radio frequency antenna and connection contacts—connected thereto via leads—for the at least one radio frequency chip; arranging the at least one radio frequency chip on the connection contacts of the conductor pattern structure; applying an electrically insulating layer on the conductor pattern structure, such that the at least one radio frequency chip is surrounded by the electrically insulating layer; and removing the temporary rigid carrier.

Abstract: A method of producing a printed circuit board (10) with a plurality of inlays (21, 22, 23, 24), having the following steps: supplying a plurality of inlays (21, 22, 23, 24), of which at least one inlay has at least one positioning element (21.1, 21.2; 22.1 to 22.7; 23.1, 23.2; 24.1, 24.2); building up a layer sequence from a plurality of printed-circuit-board layers, with at least one recess (14) for accommodating inlays, wherein, prior to the step of the plurality of inlays (21, 22, 23, 24) being inserted, the recess (14) is defined in an uppermost layer (12) by a frame made of non-conductive printed-circuit-board material; inserting the plurality of inlays (21, 22, 23, 24) into the recess (14) defined by the frame; covering the inlays (21, 22, 23, 24) with a non-conductive printed-circuit-board material; laminating the layer sequence, and removing at least the positioning elements (21.1, 21.2; 22.1 to 22.7; 23.1, 23.2; 24.1, 24.2) which establish a conductive contact between neighboring inlays.

Abstract: An electronic assembly group comprising a printed circuit board structure in a multilayer configuration that has at least two electrically conductive layers. The electronic assembly group also comprises an additional passive component that is connected to the two electrically conductive layers, each of which has at least one segment that extends beyond the multilayer structure to form connection regions, the passive component making contact directly at the connection regions.

Abstract: The present invention relates to a method for producing a conductor structural element, comprising providing a rigid substrate, electrodepositing a copper coating on the rigid substrate, applying a conductor pattern structure to the copper coating, then possibly mounting components, laminating the substrate with at least one electrically insulating layer, detaching the rigid substrate, at least partially removing the remaining copper coating of the rigid substrate in such a way that the conductor pattern structure is exposed.

Abstract: The disclosure relates to a spacer in the form of an attachment (15) to be mounted to an endoscope (1), said attachment being formed like a cap, enclosing a spatial volume (16) and being made of an insulating material. The attachment (15) is further equipped with a mounting device/adapter (6) designed to be coupled to a distal end of the endoscope (1). The attachment (15) comprises an area (11) designed to be in contact with a target tissue and further forms an aperture (12) enclosing a surface area (12a). Within the spatial volume, there is arranged an electrode (9) comprising a distal (9b) and a proximal (9a) end, the distal (9b) end of the electrode (9) having a predetermined minimum distance to the closest point of the surface area (12a).

Abstract: A resection device comprising a cup-shaped cap for a shaft-type inserting means is disclosed which is fixed at the distal end of the shaft-type inserting means or is formed at the same and includes an expanding sleeve portion to which a spring-biased tissue clip is attached which can be withdrawn by means of a releasing or withdrawing device over the distal front edge of the cap. In accordance with the invention, inside the expanding sleeve portion a cutting device is arranged which is held at the inner wall of the expanding sleeve portion at a predetermined axial distance from the distal front edge of the cap.

Abstract: A surgical implant-cutting instrument of the bipolar type, operated with direct current, is disclosed, with an instrument head which is located at the distal end of an instrument shank and which is provided for minimally invasive insertion of the instrument into a patient's body, wherein at least two mutually opposing instrument branches, preferably of the linear type, are arranged on the instrument head and between them define a cutting gap for receiving an electrically conductive implant or implant section between them. According to the invention electrodes are formed on the mutually facing longitudinal sides of the branches or these are each equipped with at least one electrode, which electrodes are in turn shaped at their mutually facing longitudinal sides to form a cutting edge in order to effect a quasi linear or punctiform physical contact engagement with the electrically conductive implant or implant section for an electrical short circuit of the mutually opposing electrodes.

Abstract: An electronic sub-assembly (36) comprising at least one electronic component (14) embedded in a sequence of layers, wherein the electronic component (14) is arranged in a recess of an electrically conductive central layer (16) and directly adjoins a resin layer (12, 20) on each side.

Abstract: Electronic sub-assembly comprising a carrier layer and a mounting area with at least one electronic component, wherein the carrier layer has at least in portions a material with a low coefficient of thermal expansion to adjust the coefficient of thermal expansion of the carrier layer, and wherein at least one compensation layer is provided on the carrier layer adjacent to the installation area, on which compensation layer an electrically insulating, thermally conductive layer and at least one electrically conductive layer are provided.

Abstract: A printed circuit board multilayer construction comprising a layer stack composed of plurality of electrically insulating and/or conductive layers arranged one above another and a cavity in the interior of the layer stack, which extends laterally only in a partial region of the areal extent of the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction through an opening provided in the layer stack and is sealed relative to ingress of liquid. Furthermore, the present invention relates to a method suitable for producing a printed circuit board multilayer construction of this type.

Abstract: A magnetic guiding device (robotics) for an intracorporeal object includes a motor-driven positioning device having a maximum of three degrees of freedom to be activated for translational motion of a connecting interface of the positioning device to which a magnetic end effector is connected or connectable, the latter including a maximum of two degrees of freedom to be activated for rotational motion of a magnetic field generator. At least one of the two degrees of freedom of the magnetic end effector is encased in an effector housing.