Patents by Inventor Thomas Hantschel

Thomas Hantschel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8872230
    Abstract: A tunnel Field Effect Transistor is provided comprising an interface between a source and a channel, the source side of this interface being a layer of a first crystalline semiconductor material being substantially uniformly doped with a metal to the solubility level of the metal in the first crystalline material and the channel side of this interface being a layer of this first crystalline semiconductor material doped with this metal, the concentration decreasing towards the channel.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: October 28, 2014
    Assignee: IMEC
    Inventors: Anne S. Verhulst, Thomas Hantschel, Wilfried Vandervorst, Cedric Huyghebaert
  • Patent number: 8749549
    Abstract: Prospect assessment and play chance mapping tools are provided. For assessing potential resources, example systems provide dynamically linked chance maps, transformed in real time from geological properties. Input geological maps or other data are dynamically linked to resulting chance maps, so that changes in the input maps automatically update the chance map in real time. Users can generate a custom risk matrix dynamically linking geological maps with chance maps via interface tools, dropping maps directly into the matrix. A transform may programmatically convert the geologic domain to the chance domain. The user can navigate input maps, select areas of interest, and drag-and-drop geologic properties into an uncertainty engine and distribution builder for uncertainty assessment based on geologic reality. A merge tool can programmatically unify multiple geological interpretations of a prospect. The merge tool outputs a single chance of success value for multiple geologic property values at each grid node.
    Type: Grant
    Filed: October 12, 2011
    Date of Patent: June 10, 2014
    Assignee: Schlumberger Technology Corporation
    Inventors: Thomas Hantschel, Alexander Martin Wilson, Nicola Tessen, Glenn Koller, Martin Neumaier
  • Patent number: 8617407
    Abstract: Systems and methods may provide electrical contacts to an array of substantially vertically aligned nanorods. The nanorod array may be fabricated on top of a conducting layer that serves as a bottom contact to the nanorods. A top metal contact may be applied to a plurality of nanorods of the nanorod array. The contacts may allow I/V (current/voltage) characteristics of the nanorods to be measured.
    Type: Grant
    Filed: April 28, 2008
    Date of Patent: December 31, 2013
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Thomas Hantschel, Noble M. Johnson, Peter Kiesel, Christian G. Van de Walle, William S. Wong
  • Patent number: 8484761
    Abstract: An atomic force microscopy probe configuration and a method for manufacturing the same are disclosed. In one aspect, the probe configuration includes a cantilever, and a planar tip attached to the cantilever. The cantilever only partially overlaps the planar tip, and extends along a longitudinal direction thereof. The planar tip is of a two-dimensional geometry having at least one corner remote from the cantilever, which corner during use contacts a surface to be scanned.
    Type: Grant
    Filed: June 11, 2009
    Date of Patent: July 9, 2013
    Assignee: IMEC
    Inventors: Thomas Hantschel, Wilfried Vandervorst, Kai Arstila
  • Patent number: 8435612
    Abstract: Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
    Type: Grant
    Filed: September 29, 2011
    Date of Patent: May 7, 2013
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Thomas Hantschel, Sven Kosgalwies, Eugene M. Chow, Gordon Todd Jagerson, Jr.
  • Publication number: 20120317478
    Abstract: Prospect assessment and play chance mapping tools are provided. For assessing potential resources, example systems provide dynamically linked chance maps, transformed in real time from geological properties. Input geological maps or other data are dynamically linked to resulting chance maps, so that changes in the input maps automatically update the chance map in real time. Users can generate a custom risk matrix dynamically linking geological maps with chance maps via interface tools, dropping maps directly into the matrix. A transform may programmatically convert the geologic domain to the chance domain. The user can navigate input maps, select areas of interest, and drag-and-drop geologic properties into an uncertainty engine and distribution builder for uncertainty assessment based on geologic reality. A merge tool can programmatically unify multiple geological interpretations of a prospect. The merge tool outputs a single chance of success value for multiple geologic property values at each grid node.
    Type: Application
    Filed: October 12, 2011
    Publication date: December 13, 2012
    Inventors: Thomas Hantschel, Alexander Martin Wilson, Nicola Tessen, Glenn Koller, Martin Neumaier
  • Publication number: 20120316847
    Abstract: Prospect assessment and play chance mapping tools are provided. For assessing potential resources, example systems provide dynamically linked chance maps, transformed in real time from geological properties. Input geological maps or other data are dynamically linked to resulting chance maps, so that changes in the input maps automatically update the chance map in real time. Users can generate a custom risk matrix dynamically linking geological maps with chance maps via interface tools, dropping maps directly into the matrix. A transform may programmatically convert the geologic domain to the chance domain. The user can navigate input maps, select areas of interest, and drag-and-drop geologic properties into an uncertainty engine and distribution builder for uncertainty assessment based on geologic reality. A merge tool can programmatically unify multiple geological interpretations of a prospect. The merge tool outputs a single chance of success value for multiple geologic property values at each grid node.
    Type: Application
    Filed: October 12, 2011
    Publication date: December 13, 2012
    Inventors: Thomas Hantschel, Alexander Martin Wilson, Nicola Tessen, Glenn Koller, Martin Neumaier
  • Patent number: 8287744
    Abstract: Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.
    Type: Grant
    Filed: May 6, 2010
    Date of Patent: October 16, 2012
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Thomas Hantschel, David K. Fork, Eugene M. Chow, Dirk De Bruyker, Michel A. Rosa
  • Patent number: 8271243
    Abstract: The invention provides a system and method for integrating petroleum system and geomechanical computer models for use in oil and gas exploration. In one embodiment, the invention provides a petroleum system model capable of analyzing data relating to a subterranean formation and calculating the geometry and geochemistry of each layer of the formation through geologic time. The present invention also provides a geomechanical model in communication with the petroleum system model such that information concerning each layer of the subterranean formation may be shared and cross-referenced as an iterative operation prior to the analysis of subsequent layers. At each step of the iterative operation, results are calculated, validated, and cross-referenced in order to produce improved reliability estimates of petroleum charge and mechanical seal integrity for the subterranean formation.
    Type: Grant
    Filed: January 26, 2010
    Date of Patent: September 18, 2012
    Assignee: Schlumberger Technology Corporation
    Inventors: Nikolaos Constantinos Koutsabeloulis, Stephen Alexander Hope, John Fuller, Melissa Suman, Thomas Hantschel, Michael De Lind Van Wijngaarden, Ian David Bryant, Rodney Laver
  • Patent number: 8241509
    Abstract: Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.
    Type: Grant
    Filed: April 22, 2009
    Date of Patent: August 14, 2012
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Thomas Hantschel, David K. Fork, Eugene M. Chow, Dirk De Bruyker, Michel A. Rosa
  • Publication number: 20120021170
    Abstract: Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
    Type: Application
    Filed: September 29, 2011
    Publication date: January 26, 2012
    Applicant: Palo Alto Research Center Incorporated
    Inventors: Thomas Hantschel, Sven Kosgalwies, Eugene M. Chow, Gordon Todd Jagerson, JR.
  • Patent number: 8080221
    Abstract: Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.
    Type: Grant
    Filed: May 6, 2010
    Date of Patent: December 20, 2011
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Thomas Hantschel, David K. Fork, Eugene M. Chow, Dirk De Bruyker, Michel A. Rosa
  • Patent number: 8080293
    Abstract: Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
    Type: Grant
    Filed: March 19, 2010
    Date of Patent: December 20, 2011
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Thomas Hantschel, Sven Kosgalwies, Eugene M. Chow, Gordon Todd Jagerson, Jr.
  • Patent number: 8021167
    Abstract: A method of forming spring structures using a single lithographic operation is described. In particular, a single lithographic operation both defines the spring area and also defines what areas of the spring will be uplifted. By eliminating a second lithographic operation to define a spring release area, processing costs for spring fabrication can be reduced.
    Type: Grant
    Filed: January 27, 2010
    Date of Patent: September 20, 2011
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Thomas Hantschel, David K. Fork
  • Patent number: 7985081
    Abstract: A method for mounting the micro spring structures onto cables or contact structures includes forming a spring island having an “upside-down” stress bias on a first release material layer or directly on a substrate, forming a second release material over at least a portion of the spring island, and then forming a base structure over the second release material layer. The micro spring structure is then transferred in an unreleased state, inverted such that the base structure contacts a surface of a selected apparatus, and then secured (e.g., using solder reflow techniques) such that the micro spring structure becomes attached to the apparatus. The spring structure is then released by etching or otherwise removing the release material layer(s).
    Type: Grant
    Filed: July 3, 2008
    Date of Patent: July 26, 2011
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Koenraad Van Schuylenbergh, Thomas Hantschel
  • Patent number: 7943504
    Abstract: According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
    Type: Grant
    Filed: October 22, 2008
    Date of Patent: May 17, 2011
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Thomas Hantschel, Sven Kosgalwies, David K. Fork, Eugene M. Chow
  • Publication number: 20100252104
    Abstract: A solar cell structure formed by extruding/dispensing materials on a substrate such that centrally disposed conductive high aspect ratio line structures (gridlines) are formed on the substrate surface with localized support structures coincidentally disposed on opposing side surfaces of the gridlines such that the gridlines are surrounded or otherwise supported by the localized support structures. In one embodiment the localized support structures are transparent, remain on the substrate after the co-extrusion process, and are covered by a layer of material. In another embodiment, the localized support structures are sacrificial support structures that are removed as part of the solar cell structure manufacturing process. In both cases the co-extrusion process is performed such that both the central gridline and the localized support structures are in direct contact with the surface of the substrate.
    Type: Application
    Filed: June 18, 2010
    Publication date: October 7, 2010
    Applicant: Palo Alto Research Center Incorporated
    Inventors: David K. Fork, Thomas Hantschel
  • Publication number: 20100252105
    Abstract: A cell structure (e.g., a battery or solar cell) is formed by extruding/dispensing materials on a substrate such that centrally disposed conductive high aspect ratio line structures (gridlines) are formed on the substrate surface such that each gridline has an aspect ratio greater than 2:1. Each gridline is formed with localized support structures coincidentally disposed on opposing side surfaces of the gridlines such that the gridlines are surrounded or otherwise supported by the localized support structures. The localized support structures are sacrificial in the sense that they are removed as part of the solar cell structure manufacturing process (e.g., after subsequent processing hardens the gridline material). In one embodiment each gridline has a width in the range of 100 nanometers to 100 microns. The co-extrusion process is performed such that both the central gridline and the localized support structures are in direct contact with the surface of the substrate.
    Type: Application
    Filed: June 18, 2010
    Publication date: October 7, 2010
    Applicant: Palo Alto Research Center Incorporated
    Inventors: David K. Fork, Thomas Hantschel
  • Patent number: 7799371
    Abstract: A method for extruding composite materials on a substrate includes feeding a first material into a first channel and a second material, used to maintain a shape of the first material, into one or more second channels residing on at least one side of the first channel, merging the flows of the first and second materials into a single flow in which the second material surrounds the first material, applying the single flow to a substrate to produce at least one composite material, and post-processing the composite material to form a solid.
    Type: Grant
    Filed: November 17, 2005
    Date of Patent: September 21, 2010
    Assignee: Palo Alto Research Center Incorporated
    Inventors: David K. Fork, Thomas Hantschel
  • Patent number: 7800388
    Abstract: A curved spring structure includes a base section extending parallel to the substrate surface, a curved cantilever section bent away from the substrate surface, and an elongated section extending from the base section along the substrate surface under the cantilevered section. The spring structure includes a spring finger formed from a self-bending material film (e.g., stress-engineered metal, bimorph/bimetallic) that is patterned and released. A cladding layer is then electroplated and/or electroless plated onto the spring finger for strength. The elongated section is formed from plating material deposited simultaneously with cladding layers. To promote the formation of the elongated section, a cementation layer is provided under the spring finger to facilitate electroplating, or the substrate surface is pre-treated to facilitate electroless plating.
    Type: Grant
    Filed: October 12, 2006
    Date of Patent: September 21, 2010
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Thomas Hantschel, Eugene M. Chow