Abstract: A localization apparatus includes: a time-of-flight circuit configured to emit a first modulated light signal and to receive reflections of the first modulated light signal from at least three devices; a processing circuit configured to determine, based on the first modulated light signal and the reflections, positions of the at least three devices in a first coordinate system associated with the apparatus; and a receive circuit configured to receive second modulated signals from the at least three devices, the second modulated signals including data indicating positions of the at least three devices in a second coordinate system. The processing circuit is further configured to determine a position and orientation of the apparatus in the second coordinate system based on the positions of the at least three devices in the first coordinate system and the data indicating the positions of the at least three devices in the second coordinate system.

Abstract: A localization apparatus includes: a time-of-flight circuit configured to emit a first modulated light signal and to receive reflections of the first modulated light signal from at least three devices; a processing circuit configured to determine, based on the first modulated light signal and the reflections, positions of the at least three devices in a first coordinate system associated with the apparatus; and a receive circuit configured to receive second modulated signals from the at least three devices, the second modulated signals including data indicating positions of the at least three devices in a second coordinate system. The processing circuit is further configured to determine a position and orientation of the apparatus in the second coordinate system based on the positions of the at least three devices in the first coordinate system and the data indicating the positions of the at least three devices in the second coordinate system.

Abstract: An apparatus for localizing a first device includes a time of flight circuit configured to emit a first modulated light signal and receive a reflection of the first modulated light signal from the first device. The apparatus further includes a processing circuit configured to determine, based on the first modulated light signal and the reflection, a position of the first device in a first coordinate system associated with the apparatus. The processing circuit is further configured to determine, based on the position of the first device in the first coordinate system, a position of the apparatus in a second coordinate system and an orientation of the apparatus in the second coordinate system. The apparatus further includes a transmit circuit configured to emit a second modulated signal to the first device, wherein the second modulated signal includes data indicating the position of the first device in the second coordinate system.

Abstract: An apparatus for localizing a first device includes a time of flight circuit configured to emit a first modulated light signal and receive a reflection of the first modulated light signal from the first device. The apparatus further includes a processing circuit configured to determine, based on the first modulated light signal and the reflection, a position of the first device in a first coordinate system associated with the apparatus. The processing circuit is further configured to determine, based on the position of the first device in the first coordinate system, a position of the apparatus in a second coordinate system and an orientation of the apparatus in the second coordinate system. The apparatus further includes a transmit circuit configured to emit a second modulated signal to the first device, wherein the second modulated signal includes data indicating the position of the first device in the second coordinate system.

Abstract: A functional skin patch having a first surface and a second surface opposite the first surface is provided. The functional skin patch includes a functional unit having a thermo harvester and an antenna unit. The thermo harvester has a first terminal thermally connected to the first surface and a second terminal. The antenna unit has a first terminal thermally connected to the second terminal of the thermo harvester and a second terminal thermally connected to the second surface. The antenna unit has a stacked layer structure including, in this sequence, a metal layer thermally connected to the second terminal of the thermo harvester, a ferrite layer thermally connected to the metal layer, and an antenna layer thermally connected to the ferrite layer.

Abstract: A semiconductor device includes a semiconductor substrate having an upper first main face and first and second recess areas formed in the upper first main face, a battery arranged at the first recess area and one or more of a shock sensor and an acceleration sensor arranged at the second recess area. The shock sensor or the acceleration sensor includes a movable mass, a cantilever connected to the moveable mass, a piezoelectric layer applied to the cantilever, and a wiring connected to the piezoelectric layer. The wiring has first and second terminals. The moveable mass and part of the cantilever are arranged above the second recess area, so that the shock sensor or the acceleration sensor delivers a voltage between the first and second terminals, a strength of the voltage being dependent on a strength of a shock or acceleration exerted on the semiconductor device.

Abstract: A communication arrangement may include a communication device, which may include an application processor, a mobile radio circuit, and a near-field communication (NFC) circuit configured according to an NFC technology for transmission of data and energy for operating a circuit external to the communication device. The arrangement may include a flexible carrier mounted detachably on the communication device. The carrier may include a radio circuit, an NFC circuit configured according to an NFC technology, a circuit coupled to the NFC circuit and the radio circuit, which is configured to be operated with energy which is received by means of the NFC circuit according to the NFC technology, the circuit configured for converting data coded in accordance with the NFC technology into data coded in accordance with the radio technology, or for converting data coded in accordance with the radio technology into data coded in accordance with the NFC technology.

Abstract: A communication arrangement may include a communication device, which may include an application processor, a mobile radio circuit, and a near-field communication (NFC) circuit configured according to an NFC technology for transmission of data and energy for operating a circuit external to the communication device. The arrangement may include a flexible carrier mounted detachably on the communication device. The carrier may include a radio circuit, an NFC circuit configured according to an NFC technology, a circuit coupled to the NFC circuit and the radio circuit, which is configured to be operated with energy which is received by means of the NFC circuit according to the NFC technology, the circuit configured for converting data coded in accordance with the NFC technology into data coded in accordance with the radio technology, or for converting data coded in accordance with the radio technology into data coded in accordance with the NFC technology.

Abstract: A semiconductor device includes a semiconductor substrate having an upper first main face and first and second recess areas formed in the upper first main face, a battery arranged at the first recess area and one or more of a shock sensor and an acceleration sensor arranged at the second recess area. The shock sensor or the acceleration sensor includes a movable mass, a cantilever connected to the moveable mass, a piezoelectric layer applied to the cantilever, and a wiring connected to the piezoelectric layer. The wiring has first and second terminals. The moveable mass and part of the cantilever are arranged above the second recess area, so that the shock sensor or the acceleration sensor delivers a voltage between the first and second terminals, a strength of the voltage being dependent on a strength of a shock or acceleration exerted on the semiconductor device.

Abstract: A semiconductor device includes a semiconductor substrate, a battery attached to the semiconductor substrate, and a sensor attached to the semiconductor substrate. The battery is electrically connected to the sensor and configured to supply the sensor with electrical power.

Abstract: According to one embodiment, a communication device is described including an oscillator configured to provide a frequency signal, a first transceiver circuit, a second transceiver circuit configured to transmit and receive signals based on the frequency signal and a calibration circuit configured to generate a calibration signal representing the carrier frequency of a signal received by the first transceiver circuit and to calibrate the oscillator based on the calibration signal.

Abstract: A functional skin patch having a first surface and a second surface opposite the first surface is provided. The functional skin patch includes a functional unit having a thermo harvester and an antenna unit. The thermo harvester has a first terminal thermally connected to the first surface and a second terminal. The antenna unit has a first terminal thermally connected to the second terminal of the thermo harvester and a second terminal thermally connected to the second surface. The antenna unit has a stacked layer structure including, in this sequence, a metal layer thermally connected to the second terminal of the thermo harvester, a ferrite layer thermally connected to the metal layer, and an antenna layer thermally connected to the ferrite layer.

Abstract: Various embodiments provide a chip. The chip has a carrier, an integrated circuit formed above the carrier, and an energy storage element. The energy storage element has a first electrode and a second electrode and is used to supply the integrated circuit with electrical energy. The carrier, the integrated circuit and the energy storage element are monolithically formed, the first electrode being formed from the carrier.

Abstract: An integrated circuit chip includes an output node, receiver front ends, and control logic. The receiver front ends are configured to receive an input signal. Each of the receiver front ends is configured to receive the input signal and provide an output signal at the output node. At least one of the receiver front ends is configured to selectively consume less power. The control logic is configured to select the number of receiver front ends providing an output signal to the output node based on a received signal strength indication.

Abstract: In various embodiments, a chip arrangement includes a first chip having a first antenna which is monolithically integrated in the first chip and is intended to communicate with at least one of an external reader or an external writer; a second chip having a second antenna which is monolithically integrated in the second chip and is intended to communicate with the at least one of the external reader or the external writer; and a booster antenna which is coupled to the first antenna in a first coupling area in order to increase a range of the first antenna and is coupled to the second antenna in a second coupling area in order to increase a range of the second antenna.

Abstract: Various embodiments provide a chip. The chip has a carrier, an integrated circuit formed above the carrier, and an energy storage element. The energy storage element has a first electrode and a second electrode and is used to supply the integrated circuit with electrical energy. The carrier, the integrated circuit and the energy storage element are monolithically formed, the first electrode being formed from the carrier.

Abstract: In various embodiments, a chip arrangement includes a first chip having a first antenna which is monolithically integrated in the first chip and is intended to communicate with at least one of an external reader or an external writer; a second chip having a second antenna which is monolithically integrated in the second chip and is intended to communicate with the at least one of the external reader or the external writer; and a booster antenna which is coupled to the first antenna in a first coupling area in order to increase a range of the first antenna and is coupled to the second antenna in a second coupling area in order to increase a range of the second antenna.

Abstract: A semiconductor device includes a semiconductor substrate, a battery attached to the semiconductor substrate, and a sensor attached to the semiconductor substrate. The battery is electrically connected to the sensor and configured to supply the sensor with electrical power.

Abstract: One embodiment of the present invention relates to an analog correlation unit comprising a plurality of parallel correlation components configured to operating according to an advanced switched-capacitor low pass filter principle that increases coding gain of the unit. Each correlation component comprises a sampling stage and a correlation stage. The sampling stage may comprise a switched capacitor configured to sample a received baseband signal to determine a value (e.g., polarity) of the baseband signal. The sampled baseband signal is provided to the correlation stages, which may respectively comprise a plurality of switched integrators configured to selectively receive and integrate the sampled baseband signal over time depending upon values (e.g., polarity) of the correlation code to generate voltage potential values. The analog correlation result is evaluated by a comparison of an adjustable threshold voltage with the difference between the output voltage potential values.

Abstract: One embodiment of the present invention relates to an analog correlation unit comprising a plurality of parallel correlation components configured to operating according to an advanced switched-capacitor low pass filter principle that increases coding gain of the unit. Each correlation component comprises a sampling stage and a correlation stage. The sampling stage may comprise a switched capacitor configured to sample a received baseband signal to determine a value (e.g., polarity) of the baseband signal. The sampled baseband signal is provided to the correlation stages, which may respectively comprise a plurality of switched integrators configured to selectively receive and integrate the sampled baseband signal over time depending upon values (e.g., polarity) of the correlation code to generate voltage potential values. The analog correlation result is evaluated by a comparison of an adjustable threshold voltage with the difference between the output voltage potential values.