Abstract: Embodiments of heat spreaders with integrated preforms, and related devices and methods, are disclosed herein. In some embodiments, a heat spreader may include: a frame formed of a metal material, wherein the metal material is a zinc alloy or an aluminum alloy; a preform secured in the frame, wherein the preform has a thermal conductivity higher than a thermal conductivity of the metal material; and a recess having at least one sidewall formed by the frame. The metal material may have an equiaxed grain structure. In some embodiments, the equiaxed grain structure may be formed by squeeze-casting or rheocasting the metal material.

Abstract: Disclosed herein are embodiments of sintered heat spreaders with inserts and related devices and methods. In some embodiments, a heat spreader may include: a frame including aluminum and a polymer binder; an insert disposed in the frame, wherein the insert has a thermal conductivity higher than a thermal conductivity of the frame; and a recess having at least one sidewall formed by the frame. The polymer binder may be left over from sintering frame material and insert material to form the heat spreader.

Abstract: Embodiments of heat spreaders with integrated preforms, and related devices and methods, are disclosed herein. In some embodiments, a heat spreader may include: a frame formed of a metal material, wherein the metal material is a zinc alloy or an aluminum alloy; a preform secured in the frame, wherein the preform has a thermal conductivity higher than a thermal conductivity of the metal material; and a recess having at least one sidewall formed by the frame. The metal material may have an equiaxed grain structure. In some embodiments, the equiaxed grain structure may be formed by squeeze-casting or rheocasting the metal material.

Abstract: Embodiments of heat spreaders with integrated preforms, and related devices and methods, are disclosed herein. In some embodiments, a heat spreader may include: a frame formed of a metal material, wherein the metal material is a zinc alloy or an aluminum alloy; a preform secured in the frame, wherein the preform has a thermal conductivity higher than a thermal conductivity of the metal material; and a recess having at least one sidewall formed by the frame. The metal material may have an equiaxed grain structure. In some embodiments, the equiaxed grain structure may be formed by squeeze-casting or rheocasting the metal material.

Abstract: Embodiments of heat spreaders with integrated preforms, and related devices and methods, are disclosed herein. In some embodiments, a heat spreader may include: a frame formed of a metal material, wherein the metal material is a zinc alloy or an aluminum alloy; a preform secured in the frame, wherein the preform has a thermal conductivity higher than a thermal conductivity of the metal material; and a recess having at least one sidewall formed by the frame. The metal material may have an equiaxed grain structure. In some embodiments, the equiaxed grain structure may be formed by squeeze-casting or rheocasting the metal material.

Abstract: A multi-component heat spreader comprising a top component having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof. The multi-component heat spreader further includes at least one additional component, such as a footing component or a spacer component, having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof, which is opposite from the top component cavity/projection. The additional component is attached to the top component, such as by brazing, wherein the top component cavity/projection is mated to the additional component cavity/projection.

Abstract: A multi-component heat spreader comprising a top component having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof. The multi-component heat spreader further includes at least one additional component, such as a footing component or a spacer component, having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof, which is opposite from the top component cavity/projection. The additional component is attached to the top component, such as by brazing, wherein the top component cavity/projection is mated to the additional component cavity/projection.

Abstract: One particular implementation of the present invention may take the form of a mobile set configured to include one or more projection devices to display a media presentation to a viewer. The mobile set may be configured to follow a fixed path or may move through autonomous navigation. In one embodiment, the mobile set may be included as part of an amusement park ride to interact with the ride patrons and provide them with a greater entertainment experience. For example, the mobile projected set may be synchronized to move with a carrier vehicle carrying the ride patrons and project a presentation or display to the ride patrons during the ride. Placing the projected scene on a mobile set allows the patrons to interact with the projected scene for a longer period of time then if the projected scene was stationary. Further, the mobile sets may be used to configure and control sightlines through the ride to provide a more dynamic environment for the amusement park ride.

Abstract: Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a polymer solder hybrid. The heat dissipating device also includes surface perturbations.

Abstract: Waste-processing and transportation systems and methods are described. An exemplary waste processing and transportation system (10) comprises a receiving area (20) where loose waste (28) is delivered, a baler (22) for processing the loose waste (28) into waste bales (34), and a loading area (26) where the waste bales (34) are loaded onto a transport vehicle (e.g., a barge 36). A loader (32a) may operate in the receiving area (20) to load the loose waste (28) into the baler (22). At least one material handler (42a) may be configured to move the waste bales (34) onto the transport vehicle (36) for transport to a waste transfer facility (14). The waste bales (34) are configured such that the waste bales are unloaded from the transport vehicle (36) at the waste transfer facility (14) and loaded onto other transport vehicles (e.g., railcars 38) without further processing of the waste bales (34).

Abstract: One particular implementation of the present invention may take the form of a mobile set configured to include one or more projection devices to display a media presentation to a viewer. The mobile set may be configured to follow a fixed path or may move through autonomous navigation. In one embodiment, the mobile set may be included as part of an amusement park ride to interact with the ride patrons and provide them with a greater entertainment experience. For example, the mobile projected set may be synchronized to move with a carrier vehicle carrying the ride patrons and project a presentation or display to the ride patrons during the ride. Placing the projected scene on a mobile set allows the patrons to interact with the projected scene for a longer period of time then if the projected scene was stationary. Further, the mobile sets may be used to configure and control sightlines through the ride to provide a more dynamic environment for the amusement park ride.

Abstract: An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.

Abstract: Waste-processing and transportation systems and methods are described. An exemplary waste processing and transportation system (10) comprises a receiving area (20) where loose waste (28) is delivered, a baler (22) for processing the loose waste (28) into waste bales (34), and a loading area (26) where the waste bales (34) are loaded onto a transport vehicle (e.g., a barge 36). A loader (32a) may operate in the receiving area (20) to load the loose waste (28) into the baler (22). At least one material handler (42a) may be configured to move the waste bales (34) onto the transport vehicle (36) for transport to a waste transfer facility (14). The waste bales (34) are configured such that the waste bales are unloaded from the transport vehicle (36) at the waste transfer facility (14) and loaded onto other transport vehicles (e.g., railcars 38) without further processing of the waste bales (34).

Abstract: An integrated heat spreader and die coupled with solder are disclosed herein. The heat spreader may have solder reservoirs. Additionally, the heat spreader and die may be coupled during a reflow process where the gaseous pressure surrounding the integrated heat spreader and the die is varied.

Abstract: Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a polymer solder hybrid. The heat dissipating device also includes surface perturbations.

Abstract: Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a polymer solder hybrid. The heat dissipating device also includes surface perturbations.

Abstract: The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire sandwiched between indium foil which acts as solder when heated by the intervening wire.

Abstract: Embodiments include electronic packages and methods for forming electronic packages. One method includes providing a die and a thermal interface material on the die. A metal body is adapted to fit over the die. A wetting layer of a material comprising indium is formed on the metal body. The thermal interface material on the die is brought into contact with the wetting layer of material comprising indium. The thermal interface material is heated to form a bond between the thermal interface material and the wetting layer so that the thermal interface material is coupled to the metal body, and to form a bond between the thermal interface material and the die so that the thermal interface material is coupled to the die.

Abstract: The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire sandwiched between indium foil which acts as solder when heated by the intervening wire.

Abstract: Embodiments include electronic packages and methods for forming electronic packages. One method includes providing a die and a thermal interface material on the die. A metal body is adapted to fit over the die. A wetting layer of a material comprising indium is formed on the metal body. The thermal interface material on the die is brought into contact with the wetting layer of material comprising indium. The thermal interface material is heated to form a bond between the thermal interface material and the wetting layer so that the thermal interface material is coupled to the metal body, and to form a bond between the thermal interface material and the die so that the thermal interface material is coupled to the die.