Abstract: A heat spreader includes a body (110) having a first surface (111) and a second surface (112), a first metal layer (120) coating substantially all of the body, a second metal layer (130) over a portion of the first metal layer, and a lip (140) protruding from the second surface. In a particular manifestation, the heat spreader is a microchannel (200, 400, 500) including a base plate (210) and a cover (220, 410, 510), where the base plate includes spaced-apart first and second surfaces (211), (212) and a plurality of fins (213) at the second surface, and the cover includes a third surface (221) having a cavity (222) therein capable of receiving the plurality of fins, a fourth surface (223, 411, 511) spaced apart from the third surface, and a lip or other grip (224, 412, 512) adjacent to the fourth surface.

Abstract: A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built compensate for deformations resulting from (1) physical manipulation during assembly (2) thermal gradients during operation and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

Abstract: Integrated heat spreader and die coupled with solder. The heat spreader may have solder reservoirs. Additionally, the heat spreader and die may be coupled during a reflow process where the gaseous pressure surrounding the integrated heat spreader and the die is varied.

Abstract: A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermally coupled to a heat spreader coated with an organic surface protectant, where the die is part of an IC package or is directly attached to the PCB. A method of making a coated heat spreader includes coating the organic surface protectant onto a surface of the heat spreader.

Abstract: An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.

Abstract: A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built compensate for deformations resulting from (1) physical manipulation during assembly (2) thermal gradients during operation and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

Abstract: Devices and systems including a heat spreader with possibly controlled thermal expansion. For example, an integral heat spreader may include an insert formed of a high thermal conductivity material with a first coefficient of thermal expansion, and a ring formed of a stiff material with a second coefficient of thermal expansion, wherein the second coefficient of thermal expansion is smaller or significantly smaller than the first coefficient of thermal expansion. An integral heat spreader may optionally include, for example, a plating, a coating, or a patch, and may be included, for example, in a semiconductor device.

Abstract: A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built to compensate for deformations resulting from (1) physical manipulation during assembly, (2) thermal gradients during operation, and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

Abstract: Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a polymer solder hybrid. The heat dissipating device also includes surface perturbations.

Abstract: An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die substrate. The heat spreader is located above the die and has left and right inclined faces. The left inclined face tapers from a point near a center of the die to a point upward and to the left of the upper surface. The right inclined face tapers from a point near the center upward and to the right above the upper surface. A solidified solder material fills regions between the upper surface and the inclined faces of the lower surface.

Abstract: A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermally coupled to a heat spreader coated with an organic surface protectant, where the die is part of an IC package or is directly attached to the PCB. A method of making a coated heat spreader includes coating the organic surface protectant onto a surface of the heat spreader.

Abstract: A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermally coupled to a heat spreader coated with an organic surface protectant, where the die is part of an IC package or is directly attached to the PCB. A method of making a coated heat spreader includes coating the organic surface protectant onto a surface of the heat spreader.

Abstract: A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermally coupled to a heat spreader coated with an organic surface protectant, where the die is part of an IC package or is directly attached to the PCB. A method of making a coated heat spreader includes coating the organic surface protectant onto a surface of the heat spreader.

Abstract: A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built compensate for deformations resulting from (1) physical manipulation during assembly (2) thermal gradients during operation and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

Abstract: An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die substrate. The heat spreader is located above the die and has left and right inclined faces. The left inclined face tapers from a point near a center of the die to a point upward and to the left of the upper surface. The right inclined face tapers from a point near the center upward and to the right above the upper surface. A solidified solder material fills regions between the upper surface and the inclined faces of the lower surface.

Abstract: An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die substrate. The heat spreader is located above the die and has left and right inclined faces. The left inclined face tapers from a point near a center of the die to a point upward and to the left of the upper surface. The right inclined face tapers from a point near the center upward and to the right above the upper surface. A solidified solder material fills regions between the upper surface and the inclined faces of the lower surface.

Abstract: An electronic assembly including a die, having an integrated circuit formed therein, a thermally conductive heat spreader, and indium located between the die and the heat spreader, is described. The heat spreader has a layer of nickel. A gold layer is formed on the nickel layer, and provides better wetting of indium than nickel. A better structural connection between the indium and the heat spreader is provided, especially during thermal cycling.

Abstract: The invention provides a method for producing a microcellular foam of a curable material by replicating a dissolvable particle preform and leaching away the dissolvable particle preform to yield the microcellular foam. The foam can be a preceramic polymer microcellular foam which can be pyrolyzed to form a ceramic microcellular foam. A method for making a composite including steps of producing a ceramic microcellular foam which is subsequently infiltrated to form the composite is also provided as are microcellular foams, ceramic microcellular foams and composites prepared according to the method of the invention.

Abstract: A rheological fluid composition which is responsive to a magnetic field. The composition comprises a vehicle, magnetizable particles suspended in the vehicle and a dispersant. The dispersant comprises particles having no dimension greater than 10 nanometers. The dispersant is preferably carbon.

Abstract: A method and apparatus for determining if matching units of an electronic system or a subsystem are assembled includes a single scratchpad memory which is addressed by the units on alternate cycles. A microprogram stored in one unit operates in synchronism with a microprogram in the other unit to write into and to test the contents of a location in scratchpad memory to determine if the two units would be operational with each other during normal operation.