Abstract: A system and method for generating a netlist for a printed circuit board. In some embodiments, the method includes capturing image data of a circuit board from a plurality of sensors to generate a set of captured data for each of the plurality of sensors; extracting a plurality of features from the image data using machine learning; and generating a design associated with the circuit board from the plurality of features.

Abstract: In an approach to inspecting integrated circuits, a system includes a first detection system and a second detection system for measuring electroluminescent (EL) images from a device under test (DUT); and a controller. The controller is configured to: measure EL emissions from the DUT with the first and the second detection systems to obtain a first and a second EL test data; compare the first and the second EL test data to a reference model of a reference device, the reference model developed based on measured EL reference data, synthetic EL reference data, or a combination thereof obtained from the reference device or a reference design of the reference device; and determine whether the DUT is in accordance with the reference device, based at least in part on the comparison of the first and the second EL test data to the reference model of the reference device.

Abstract: The present disclosure provides a method for generating a spatially resolved netlist that includes generating a netlist based on integrated circuit (IC) layout data and standard cell library data, the netlist including cell and net definitions associated with the IC; determining position data for respective cells and nets based on the IC layout data; mapping the position data to respective cell and net definitions in the netlist; and generating a spatially resolved netlist that includes the mapped position data to respective cell and net definitions.

Abstract: An assembly for monitoring a semiconductor device under test comprising a mill configured to mill the device, a sensor configured to measure an electrical characteristic of the device, and a computer configured to determine the amount of strain in the device from the electrical characteristic when the mill is milling the device and detect an endpoint of milling at a circuit within the device. In use the endpoints of the milling process of the semiconductor device are detected measuring an electrical characteristic of the device with a sensor during milling determining the amount of strain in the device from the electrical characteristic and detecting an endpoint of the milling process within the device based on the amount of strain.

Abstract: An assembly for monitoring a semiconductor device under test comprising a mill configured to mill the device, a sensor configured to measure an electrical characteristic of the device, and a computer configured to determine the amount of strain in the device from the electrical characteristic when the mill is milling the device and detect an endpoint of milling at a circuit within the device. In use the endpoints of the milling process of the semiconductor device are detected measuring an electrical characteristic of the device with a sensor during milling determining the amount of strain in the device from the electrical characteristic and detecting an endpoint of the milling process within the device based on the amount of strain.

Abstract: Systems and methods for measuring unique microelectronic electromagnetic signatures are provided. A method includes injecting a nondestructive signal as input into a port of an object. The method may further include receiving as output from a signal path within the object a unique frequency dependent complex spectrum comprising a reflection spectrum or a transmission spectrum. The method may also include generating a unique object signature based upon the port and the received spectrum. The method may still further include differentiating the object from a different object based upon a comparison of the unique object signature of each.

Abstract: Systems and methods for measuring unique microelectronic electromagnetic signatures are provided. A method includes injecting a nondestructive signal as input into a port of an object. The method may further include receiving as output from a signal path within the object a unique frequency dependent complex spectrum comprising a reflection spectrum or a transmission spectrum. The method may also include generating a unique object signature based upon the port and the received spectrum. The method may still further include differentiating the object from a different object based upon a comparison of the unique object signature of each.

Abstract: A method of designing a robust integrated circuit that is not vulnerable to optical fault injection comprises training a variational autoencoder to identify regions in a target integrated circuit that are vulnerable to optical fault injection and altering the design of the target integrated circuit by altering the design of the vulnerable regions so that the target integrated circuit is no longer vulnerable to optical fault injection, thereby forming the robust integrated circuit.

Abstract: A method of designing a robust integrated circuit that is not vulnerable to optical fault injection comprises training a variational autoencoder to identify regions in a target integrated circuit that are vulnerable to optical fault injection and altering the design of the target integrated circuit by altering the design of the vulnerable regions so that the target integrated circuit is no longer vulnerable to optical fault injection, thereby forming the robust integrated circuit.

Abstract: A multimodal inspection system (MIS) is disclosed herein. The MIS may use one or more modalities to inspect a sample. Some of the modalities include, but are not limited to, Raman, visible (VIS), terahertz (THz) spectroscopy, longwave infrared (LWIR), shortwave infrared (SWIR), laser profilometry (LP), electromagnetic interference (EMI) near field probing, and/or, Millimeter Wave (MMW) radar.

Abstract: A multimodal inspection system (MIS) is disclosed herein. The MIS may use one or more modalities to inspect a sample. Some of the modalities include, but are not limited to, Raman, visible (VIS), terahertz (THz) spectroscopy, longwave infrared (LWIR), shortwave infrared (SWIR), laser profilometry (LP), electromagnetic interference (EMI) near field probing, and/or, Millimeter Wave (MMW) radar.

Abstract: Features are disclosed for charging a battery using a power supply in series with a diode. A power supply can be connected in series with a diode to restrict an inrush current resulting from connection of the power supply with a battery. In some embodiments, the power supply can further include a plurality of power supplies to restrict the amount of inrush current a single power supply can provide. In other embodiments, the power supply can also include a bypass capacitor that the power supply charges before supplying current to the battery. The power supply can regulate the amount of current that is applied to the battery and prevent inrush current from damaging the battery. Multiple power supplies add to overall reliability.

Abstract: A system and method for generating a netlist for a printed circuit board. In some embodiments, the method includes capturing image data of a circuit board from a plurality of sensors to generate a set of captured data for each of the plurality of sensors; extracting a plurality of features from the image data using machine learning; and generating a design associated with the circuit board from the plurality of features.

Abstract: A system and method for generating a netlist for a printed circuit board. In some embodiments, the method includes capturing image data of a circuit board from a plurality of sensors to generate a set of captured data for each of the plurality of sensors; extracting a plurality of features from the image data using machine learning; and generating a design associated with the circuit board from the plurality of features.

Abstract: A multimodal inspection system (MIS) is disclosed herein. The MIS may use one or more modalities to inspect a sample. Some of the modalities include, but are not limited to, Raman, visible (VIS), terahertz (THz) spectroscopy, longwave infrared (LWIR), shortwave infrared (SWIR), laser profilometry (LP), electromagnetic interference (EMI) near field probing, and/or, Millimeter Wave (MMW) radar.

Abstract: A multimodal inspection system (MIS) is disclosed herein. The MIS may use one or more modalities to inspect a sample. Some of the modalities include, but are not limited to, Raman, visible (VIS), terahertz (THz) spectroscopy, longwave infrared (LWIR), shortwave infrared (SWIR), laser profilometry (LP), electromagnetic interference (EMI) near field probing, and/or, Millimeter Wave (MMW) radar.

Abstract: In an approach to inspecting integrated circuits, a system includes a first detection system and a second detection system for measuring electroluminescent (EL) images from a device under test (DUT); and a controller. The controller is configured to: measure EL emissions from the DUT with the first and the second detection systems to obtain a first and a second EL test data; compare the first and the second EL test data to a reference model of a reference device, the reference model developed based on measured EL reference data, synthetic EL reference data, or a combination thereof obtained from the reference device or a reference design of the reference device; and determine whether the DUT is in accordance with the reference device, based at least in part on the comparison of the first and the second EL test data to the reference model of the reference device.

Abstract: Features are disclosed for charging a battery using a power supply in series with a diode. A power supply can be connected in series with a diode to restrict an inrush current resulting from connection of the power supply with a battery. In some embodiments, the power supply can further include a plurality of power supplies to restrict the amount of inrush current a single power supply can provide. In other embodiments, the power supply can also include a bypass capacitor that the power supply charges before supplying current to the battery. The power supply can regulate the amount of current that is applied to the battery and prevent inrush current from damaging the battery. Multiple power supplies add to overall reliability.

Abstract: A method of designing a robust integrated circuit that is not vulnerable to optical fault injection comprises training a variational autoencoder to identify regions in a target integrated circuit that are vulnerable to optical fault injection and altering the design of the target integrated circuit by altering the design of the vulnerable regions so that the target integrated circuit is no longer vulnerable to optical fault injection, thereby forming the robust integrated circuit.

Abstract: The present disclosure provides a method for generating a spatially resolved netlist that includes generating a netlist based on integrated circuit (IC) layout data and standard cell library data, the netlist including cell and net definitions associated with the IC; determining position data for respective cells and nets based on the IC layout data; mapping the position data to respective cell and net definitions in the netlist; and generating a spatially resolved netlist that includes the mapped position data to respective cell and net definitions.