Abstract: A ball grid array ceramic resonator including a substrate having one or more strips of conductive material on opposed first and second surfaces of the substrate. One or more conductive vias extend through the substrate and define termination ends in the respective substrate surfaces. In one embodiment, a plurality of conductive spheres/balls defining respective ground pads are disposed over the ends of said vias terminating in said one or more strips of conductive material on said first or second surface and another conductive sphere is disposed over one of the strips of conductive material to define an RF signal input pad.

Abstract: For fixedly implanting a device for material or signal delivery or acquisition or a part of such a device in a human or animal body, an opening is provided in hard tissue of the body, the opening reaching through a hard tissue layer, e.g. through a cortical bone layer into cancellous bone underneath. The device includes a plug portion (P) and/or a cover portion (C) which includes a ring of a material having thermoplastic properties extending around the plug portion (P) or on a tissue facing surface of the cover portion (C). The opening provided in the hard tissue has a cross section at least in the area of its mouth that is adapted to the plug or cover portion such that the plug portion (P) can be introduced through the mouth of the opening or the cover portion (C) can be positioned over the mouth of the opening such that the ring extends around the opening, along its wall and/or on the hard tissue surface around its mouth.

Abstract: An RF module adapted for direct surface mounting to the top surface of the front end of the motherboard of a wireless base station such as, for example, a femtocell. The module comprises a printed circuit board having a plurality of direct surface mounted electrical components defining respective signal transmit and receive sections for RF signals. The signal transmit section is defined by at least a power amplifier, a coupler, and a lowpass filter. The signal receive section is defined by at least a receive bandpass filter and a low-noise amplifier. A lid covers selected ones of the electrical components except for at least the power amplifier. An RF switch is located between and interconnects the respective transmit and receive sections to an antenna pin.

Abstract: An RF module for use in an RF signal transceiver system. In one embodiment, the RF module comprises a substrate having at least a duplexer filter, first and second bandpass filters and first and second low noise amplifiers mounted thereon. The substrate includes respective edges having respective RF signal input/output and supply voltage terminals defined therein. The overall dimensions of the substrate and/or the location of the respective terminals have been predetermined in a manner which allows the same size substrate with the same terminal locations to be used for several different air interfaces such as, for example, EGSM, GSM 850, DCS, and PCS applications, irrespective of a specific air interface need for differently sized and/or additional filters.

Abstract: A front end module for use in a wireless base station such as a picocell includes a housing defining a cavity for a substrate. A first section on the substrate defines a signal transmit path and includes at least the following discrete electronic components: a bandpass filter, a power amplifier, and a coupler. A second section on the substrate defines a signal receive path and includes at least the following discrete electronic components: a bandpass filter and a low-noise amplifier. A switch on the substrate interconnects the first and second sections to an antenna terminal and a wall in the housing extends through a slot in the substrate to isolate the components in the first and second sections. Terminals extend through an exterior wall of the housing and into contact with the substrate.

Abstract: A ball grid array ceramic filter including a substrate having a ground layer of conductive material disposed over one of the surfaces thereof and a plurality of strips of conductive material on the other of the substrate surfaces defining resonators adapted to receive and pass RF signals. A plurality of vias extend through the substrate and define opposed ends terminating in the respective substrate surfaces. In one embodiment, a plurality of conductive spheres defining respective ground and RF signal input/output pads are disposed on the substrate surface with the ground layer thereon. Certain of the vias couple the resonators to the ground layer while others of the vias couple the resonators to respective spheres adapted for coupling to the respective RF signal input/output contacts on the top surface of a printed circuit board to which the filter is adapted to be direct surface mounted.

Abstract: An implant or endoprosthesis suitable to be implanted in human or animal tissue comprises two (or more than two) parts to be joined in situ. Each one of the parts comprises a joining location, the two joining locations facing each other when the device parts are positioned for being joined together, wherein one of the joining locations comprises a material which is liquefiable by mechanical vibration and the other one of the joining locations comprises a material which is not liquefiable by mechanical vibration and a structure (e.g. undercut cavities or protrusions) suitable for forming a positive fit connection with the liquefiable material. The joining process is effected pressing the two device parts against each other and by applying vibration, e.g. ultrasonic vibration, to one of the device parts when the two parts are positioned relative to each other such that the two joining locations are in contact with each other.

Abstract: A voltage controlled oscillator (VCO) assembly and module incorporating a ball grid array resonator as part of the tank circuit of the voltage controlled oscillator. The VCO module preferably incorporates at least an oscillator circuit, the tank circuit, and an output buffer stage circuit all defined by a plurality of interconnected electrical/electronic components including the ball grid array resonator which are mounted to a printed circuit board. In another embodiment, the oscillator assembly also includes a phase-locked loop circuit defined at least in part by an integrated circuit mounted to the printed circuit board.

Abstract: A ball grid array resonator for use as, for example, a high “Q” inductive element in the tank circuit of a voltage controlled oscillator. The resonator comprises a ceramic substrate including opposed top and bottom surfaces, each having a continuous strip of conductive material formed thereon and, in one embodiment, at least two conductive vias which extend through the substrate and electrically interconnect the respective strips of conductive material to define a continuous and elongate path or transmission line for an RF signal. The respective strips of conductive material may be spiral-shaped, hook-shaped, serpentine-shaped, or otherwise suitably shaped depending upon the desired application. Conductive balls/spheres on the bottom surface define RF signal input/output pads and ground pads adapted for electrical connection to the printed circuit board or substrate of, for example, a voltage controlled oscillator.

Abstract: A piezoelectric element suitable for use as a sensor element in a hydrophone. In a preferred embodiment, the sensor element comprises a ceramic lead zirconate titanate substrate defining opposed ends and including at least first and second conductive strip electrodes on opposed top and bottom faces thereof. In accordance with the invention, at least one of the strip electrodes, and preferably at least the end of one of the strip electrodes disposed adjacent one of the opposed ends of the substrate, includes one or more spaced-apart laser cuts created during the manufacture of the sensor element for presetting the capacitance of the sensor element.

Abstract: A synthesizer module/oscillator assembly includes a voltage controlled oscillator with a coaxial resonator. In one embodiment, the module measures 20.3 mm×14.8 mm×3.9 mm and the coaxial resonator is positioned on the circuit board of the module between a phase locked loop integrated circuit and a main section of the voltage controlled oscillator. The phase locked loop circuit includes a loop filter and is adapted to receive the frequency signal generated by the voltage controlled oscillator and generate an adjusted frequency signal.

Abstract: An ovenized oscillator package including a ball grid array substrate seated on a circuit board, a heater and a temperature sensor mounted on the ball grid array substrate, and a crystal package mounted to the ball grid array substrate and overlying at least the heater. A layer of thermally conductive epoxy or adhesive material couples the heater to the crystal package. Stabilizer posts, which are made of an insulative adhesive or epoxy material, are formed between the ball grid array substrate and the circuit board for stabilizing and relieving the stress on the ball grid array substrate. A lid is seated on the circuit board and covers and defines an oven for the ball grid array substrate.

Abstract: An RF module adapted for direct surface mounting to the top surface of the front end of the motherboard of a wireless base station such as, for example, a femtocell. The module comprises a printed circuit board having a plurality of direct surface mounted electrical components defining respective signal transmit and receive sections for RF signals. The signal transmit section is defined by at least a power amplifier, a coupler, and a lowpass filter. The signal receive section is defined by at least a receive bandpass filter and a low-noise amplifier. A lid covers selected ones of the electrical components except for at least the power amplifier. An RF switch is located between and interconnects the respective transmit and receive sections to an antenna pin.

Abstract: A module for a surface acoustic wave oscillator includes a substrate having a top surface, a bottom surface and peripheral side faces. Several castellations are located about the outer peripheral side faces thereof. The castellations form an electrical connection between the top and bottom surfaces of the substrate. Connection pads are mounted on the top surface and are adapted for connection to the castellations. An oscillator circuit and a surface acoustic wave device are mounted on the top surface and connected to the connection pads. A cover is mounted over the substrate and has at least one tab adapted to be fitted within a respective one of the castellations. The overall module with the cover has a dimension of approximately 5 mm in width, 7 mm in length, and 2.7 mm in height.

Abstract: An oscillator assembly includes an oscillator circuit that is configured to generate a frequency signal. A temperature compensation circuit is in communication with the oscillator circuit and adapted to adjust the frequency signal in response to changes in temperature. The oscillator and temperature compensation circuits are located within an oven. A heater and a temperature sensor in communication with the heater are also both located in the oven. The temperature sensor is adapted to directly control the heater in response to changes in temperature. In one embodiment, the oscillator components are mounted to a ball grid array substrate which, in turn, is mounted on a printed circuit board. In this embodiment, a resonator overlies the ball grid array substrate and a lid covers and defines an oven and enclosure for the resonator and the ball grid array substrate. The oscillator and temperature compensation circuit are defined on the ball grid array substrate.

Abstract: A reduced-size VCO/PLL module including a circuit board having a plurality of components positioned, mounted and interconnected thereon in a manner allowing the same to fit in a 10.5 mm×14 mm×2.9 mm package. In one embodiment, an inner lid encloses the VCO portion of the module. In all embodiments, an outer lid is adapted to cover all of the components on the circuit board of the module. The inner and outer lids include tabs adapted to be fitted within respective apertures defined in the board. In a preferred embodiment, the VCO portion occupies one side of the module while an integrated circuit chip and a loop filter occupy an opposite side of the module.

Abstract: An RF Rx module adapted for direct surface mounting to the top surface of the front end of the motherboard of a picocell. The module comprises a printed circuit board having a plurality of direct surface mounted discrete electrical components defining a receive (Rx) section and path for RF signals. The signal receive section is defined by at least the following elements located under a lid which is attached to the surface of the board: a duplexer, a receive low pass filter, a low-noise amplifier, and a receive bandpass filter. At least one aperture in the board is adapted to accept a screw or the like for securing the module to the motherboard of the picocell.

Abstract: A voltage controlled oscillator (VCO) assembly and module incorporating a ball grid array resonator as part of the tank circuit of the voltage controlled oscillator. The VCO module preferably incorporates at least an oscillator circuit, the tank circuit, and an output buffer stage circuit all defined by a plurality of interconnected electrical/electronic components including the ball grid array resonator which are mounted to a printed circuit board. In another embodiment, the oscillator assembly also includes a phase-locked loop circuit defined at least in part by an integrated circuit mounted to the printed circuit board.

Abstract: A ball grid array ceramic resonator including a substrate having one or more strips of conductive material on opposed first and second surfaces of the substrate. One or more conductive vias extend through the substrate and define termination ends in the respective substrate surfaces. In one embodiment, a plurality of conductive spheres/balls defining respective ground pads are disposed over the ends of said vias terminating in said one or more strips of conductive material on said first or second surface and another conductive sphere is disposed over one of the strips of conductive material to define an RF signal input pad.

Abstract: A piezoelectric element suitable for use as a sensor element in a hydrophone. In a preferred embodiment, the sensor element comprises a ceramic lead zirconate titanate substrate defining opposed ends and including at least first and second conductive strip electrodes on opposed top and bottom faces thereof. In accordance with the invention, at least one of the strip electrodes, and preferably at least the end of one of the strip electrodes disposed adjacent one of the opposed ends of the substrate, includes one or more spaced-apart laser cuts created during the manufacture of the sensor element for presetting the capacitance of the sensor element.