Patents by Inventor Thomas Plach
Thomas Plach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11020952Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: March 20, 2019Date of Patent: June 1, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
-
Patent number: 11020950Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: March 19, 2019Date of Patent: June 1, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
-
Patent number: 10991609Abstract: A method and a device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates.Type: GrantFiled: August 12, 2016Date of Patent: April 27, 2021Assignee: EV GROUP E. THALLNER GMBHInventors: Dominik Zinner, Thomas Wagenleitner, Jurgen Markus Suss, Jurgen Mallinger, Thomas Plach
-
Publication number: 20210074544Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: November 4, 2020Publication date: March 11, 2021Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Patent number: 10861699Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: GrantFiled: July 8, 2020Date of Patent: December 8, 2020Assignee: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Patent number: 10825793Abstract: This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate with the following steps, especially the following sequence: forming a reservoir in a surface layer on the first contact surface, the first surface layer consisting at least largely of a native oxide material, at least partial filling of the reservoir with a first educt or a first group of educts, the first contact surface making contact with the second contact surface for formation of a prebond connection, forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.Type: GrantFiled: April 8, 2011Date of Patent: November 3, 2020Inventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
-
Publication number: 20200335341Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: July 8, 2020Publication date: October 22, 2020Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Patent number: 10748770Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: GrantFiled: March 17, 2020Date of Patent: August 18, 2020Assignee: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Publication number: 20200219726Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: March 17, 2020Publication date: July 9, 2020Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Patent number: 10707059Abstract: A device for bombarding at least one substrate with a plasma with a first electrode and a second electrode that can be arranged opposite thereto, which electrodes are formed together producing the plasma between the electrodes wherein at least one of the electrodes is formed from at least two electrode units. In addition, this invention relates to a corresponding method.Type: GrantFiled: May 9, 2014Date of Patent: July 7, 2020Assignee: EV Group E. Thallner GmbHInventors: Thomas Glinsner, Christoph Flotgen, Johann Bernauer, Thomas Wagenleitner, Thomas Wieser, Florian Schmid, Thomas Plach, Roman Anzengruber, Alexander Nones, Uwe Kriebisch
-
Publication number: 20200168580Abstract: A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates, wherein the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck, and wherein a plate is arranged between the second substrate and the second chuck, wherein the second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding. Furthermore, the present invention relates to a corresponding device and a corresponding plate.Type: ApplicationFiled: September 21, 2017Publication date: May 28, 2020Applicant: EV Group E. Thallner GmbHInventors: Dominik ZINNER, Thomas WAGENLEITNER, Jurgen Markus SUSS, Thomas PLACH, Jurgen MALLINGER
-
Patent number: 10636662Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: GrantFiled: October 29, 2019Date of Patent: April 28, 2020Assignee: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Publication number: 20200066529Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: October 29, 2019Publication date: February 27, 2020Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Publication number: 20200027768Abstract: A method and a device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates.Type: ApplicationFiled: August 12, 2016Publication date: January 23, 2020Applicant: EV GROUP E. THALLNER GMBHInventors: Dominik ZINNER, Thomas WAGENLEITNER, Jurgen Markus SUSS, Jurgen MALLINGER, Thomas PLACH
-
Patent number: 10504730Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: GrantFiled: September 6, 2018Date of Patent: December 10, 2019Assignee: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Publication number: 20190244816Abstract: A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.Type: ApplicationFiled: April 17, 2019Publication date: August 8, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Publication number: 20190217594Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: March 20, 2019Publication date: July 18, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
-
Publication number: 20190217595Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: March 20, 2019Publication date: July 18, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
-
Publication number: 20190210348Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: March 18, 2019Publication date: July 11, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
-
Publication number: 20190210350Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: March 19, 2019Publication date: July 11, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz