Patents by Inventor Thomas Plach
Thomas Plach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190210349Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: March 19, 2019Publication date: July 11, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 10279575Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: May 29, 2013Date of Patent: May 7, 2019Assignee: EV GROUP E. THALLNER GMBHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Publication number: 20190019677Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: September 6, 2018Publication date: January 17, 2019Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Publication number: 20190019678Abstract: A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.Type: ApplicationFiled: March 22, 2016Publication date: January 17, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Publication number: 20190006313Abstract: A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.Type: ApplicationFiled: August 21, 2018Publication date: January 3, 2019Applicant: EV GROUP E. THALLNER GMBHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flotgen
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Patent number: 10109487Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: GrantFiled: February 16, 2016Date of Patent: October 23, 2018Assignee: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Patent number: 10083933Abstract: A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.Type: GrantFiled: December 21, 2015Date of Patent: September 25, 2018Assignee: EV GROUP E. THALLNER GMBHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flotgen
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Publication number: 20180076037Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: February 16, 2016Publication date: March 15, 2018Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Publication number: 20180040495Abstract: A substrate holder having a fixing surface for holding a substrate, a system having such a substrate holder, a use of such a substrate holder, a method for bonding two substrates and a product, particularly a substrate stack, produced using such a method and also a use of such a substrate holder for such a method.Type: ApplicationFiled: April 10, 2015Publication date: February 8, 2018Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Thomas Plach, Jurgen Michael Suss, Jurgen Mallinger
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Publication number: 20170229423Abstract: This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate with the following steps, especially the following sequence: forming a first reservoir in a surface layer on the first contact surface and a second reservoir in a surface layer on the second contact surface, the surface layers of the first and second contact surfaces being comprised of respective native oxide materials of one or more second educts respectively contained in reaction layers of the first and second substrates, partially filling the first and second reservoirs with one or more first educts; and reacting the first educts filled in the first reservoir with the second educts contained in the reaction layer of the second substrate to at least partially strengthen a permanent bond formed between the first and second contact surfaces.Type: ApplicationFiled: April 27, 2017Publication date: August 10, 2017Applicant: EV GROUP E. THALLNER GmbHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flotgen
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Publication number: 20170047203Abstract: A device for bombarding at least one substrate with a plasma with a first electrode fiend a second electrode that can be arranged opposite thereto, which electrodes are formed together producing the plasma between the electrodes wherein at least one of the electrodes is formed from at least two electrode units. In addition, this invention relates to a corresponding method.Type: ApplicationFiled: May 9, 2014Publication date: February 16, 2017Applicant: EV Group E. Thallner GmbHInventors: Thomas Glinsner, Christoph Flotgen, Johann Bernauer, Thomas Wagenleitner, Thomas Wieser, Florian Schmid, Thomas Plach, Roman Anzengruber, Alexander Nones, Uwe Kriebisch
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Publication number: 20160111394Abstract: A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.Type: ApplicationFiled: December 21, 2015Publication date: April 21, 2016Applicant: EV GROUP E. THALLNER GMBHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flotgen
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Patent number: 9252042Abstract: A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.Type: GrantFiled: January 25, 2011Date of Patent: February 2, 2016Assignee: EV Group E. Thallner GmbHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Patent number: 9159717Abstract: This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate, the second substrate having at least one reaction layer, with the following steps, especially the following sequence: forming a reservoir in a reservoir formation layer on the first contact surface, at least partial filling of the reservoir with a first educt or a first group of educts, the first contact surface making contact with the second contact surface for formation of a prebond connection, thinning of the second substrate and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with the second educt contained in the reaction layer of the second substrate.Type: GrantFiled: April 8, 2011Date of Patent: October 13, 2015Assignee: EV Group E. Thallner GmbHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Publication number: 20150210057Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: May 29, 2013Publication date: July 30, 2015Applicant: EV GROUP E. THALLNER GMBHInventors: Thomas Wagenleithner, Markus Wimplinger, Paul Lindner, Thomas Plach, Florian Kurz
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Publication number: 20150165752Abstract: A method for bonding of a first contact area of a first substrate to a second contact area of a second substrate, the second substrate having a least one reaction layer, and a device for carrying out said method. The method comprises: (a) accommodating the substrates between a first electrode and a second electrode, or within a coil, (b) formation of a reservoir on the first contact area by exposing the first contact area to a plasma (c) at least partially filling of the reservoir with a first educt or a first group of educts, (d) contacting the first contact area with the second contact area for formation of a pre-bond interconnection, (e) forming a permanent bond between the first and second contact areas at least partially strengthened by the reaction of the first educt with a second educt which is contained in the reaction layer of the second substrate.Type: ApplicationFiled: July 24, 2012Publication date: June 18, 2015Applicant: EV Group E. Thallner GmbHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Patent number: 8975158Abstract: A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate. The method comprises: forming at least one reservoir in at least one reservoir formation layer on the first substrate and/or the second substrate, the reservoir comprised of an amorphous material, at least partial filling of the reservoir/reservoirs with a first educt or a first group of educts, forming or applying a reaction layer which contains a second educt or a second group of educts to the reservoir and/or the reservoir, the first contact surface making contact with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt or the first group with the second educt or the second group.Type: GrantFiled: April 8, 2011Date of Patent: March 10, 2015Assignee: EV Group E. Thallner GmbHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Publication number: 20140073112Abstract: A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate. The method comprises: forming at least one reservoir in at least one reservoir formation layer on the first substrate and/or the second substrate, the reservoir comprised of an amorphous material, at least partial filling of the reservoir/reservoirs with a first educt or a first group of educts, forming or applying a reaction layer which contains a second educt or a second group of educts to the reservoir and/or the reservoir, the first contact surface making contact with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt or the first group with the second educt or the second group.Type: ApplicationFiled: April 8, 2011Publication date: March 13, 2014Inventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Publication number: 20140051231Abstract: This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate, the second substrate having at least one reaction layer, with the following steps, especially the following sequence: forming a reservoir in a reservoir formation layer on the first contact surface, at least partial filling of the reservoir with a first educt or a first group of educts, the first contact surface making contact with the second contact surface for formation of a prebond connection, thinning of the second substrate and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with the second educt contained in the reaction layer of the second substrate.Type: ApplicationFiled: April 8, 2011Publication date: February 20, 2014Applicant: EV GROUP E. THALLNER GMBHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Publication number: 20140017877Abstract: This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate with the following steps, especially the following sequence: forming a reservoir in a surface layer on the first contact surface, the first surface layer consisting at least largely of a native oxide material, at least partial filling of the reservoir with a first educt or a first group of educts, the first contact surface making contact with the second contact surface for formation of a prebond connection, forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.Type: ApplicationFiled: April 8, 2011Publication date: January 16, 2014Inventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen