Abstract: Various embodiments may relate to a lighting module, including a first printed circuit board, on which at least one light source is arranged, a covering element, which at least partially covers the first printed circuit board, and at least one electronic component, which is integrated in the covering element and is electrically connected to the first printed circuit board.

Abstract: Various embodiments may relate to a lighting module, including a first printed circuit board, on which at least one light source is arranged, a covering element, which at least partially covers the first printed circuit board, and a second printed circuit board, on which at least one electronic component is arranged, wherein the second printed circuit board is fastened to the covering element and is electrically connected to the first printed circuit board.

Abstract: In various embodiments, a light emitting diode module is provided. The light emitting diode module may include at least one light emitting diode; wherein the at least one light emitting diode is connected in parallel with at least one first capacitor; wherein the at least one light emitting diode is arranged in a first structural unit, and the at least one first capacitor is arranged in a second structural unit, wherein the first structural unit and the second structural unit are electrically coupled to one another via a first cable.

Abstract: A light module (1; 14), comprising a carrier (8, 10) for mounting at least one semiconductor source (5), in particular a light emitting diode, wherein: the carrier (8, 10) has a flexible printed circuit board (10), the flexible printed circuit board (10) is bonded face-to face to at least one base plate, (8) and the carrier (8, 10) can be bent along at least one predetermined bending line (3; 3a-3e), the base plate (8) can be bent along the at least one bending line, (3; 3a-3e), the base plate (8) has at least one cutout (9) along the bending line (3; 3a-3e) and the flexible printed circuit board (10) has at least one strip (11; 15) which crosses at least one of the cutouts (9).

Abstract: A lighting module may include a housing having an open rear side, a light source substrate with at least one light source arranged thereon, a driver circuit board accommodated in the housing, at least one electrical connection element for electrically connecting the driver circuit board to the light source substrate, and a closure element for closing the open rear side, wherein the closure element is designed for feeding through at least one electrical connection.

Abstract: An LED lighting device may include an LED support, which is populated with at least one LED on a front side thereof and a rear side of which is fastened to a rest. The front side of the LED support may be overarched by an electrically insulating, light-permeable and diffusely scattering LED cover, and the LED cover may be overarched by a protection cover resting on the support.

Abstract: A semiconductor light-emitting device is disclosed. The device includes a plurality of semiconductor light sources and a driver with no galvanic isolation for operating the semiconductor light sources wherein the semiconductor light sources may be divided into at least two carriers, the carriers are applied on an electrically conductive substrate, and the driver, and current-conducting regions also provided on a surface of the carriers, are electrically insulated from the substrate.

Abstract: A lighting device, having at least one light outlet opening and at least two different fixing interfaces for the optional fixing of a respective attachment element optically upstream of the at least one light outlet opening.

Abstract: A multilayered LED printed circuit board with electrically insulating layers includes at least one electrically insulating material and electrically conductive layers consisting of an electrically conductive material, wherein at least one of the electrically conductive layers is structured with a conductor track structure, wherein the at least one structured electrically conductive layer is arranged on an upper side of the LED printed circuit board, and wherein a plurality of LEDs is arranged on the at least one structured electrically conductive layer on the upper side. The LED printed circuit board further includes: a thermally conducting element, and thermal paths comprising an electrically conductive material, which are arranged, in each case in contact-making fashion, between the LEDs and the thermally conducting element.

Abstract: A lighting device may include: at least one semiconductor light source, at least one printed circuit board which is populated with at least one component for operating the at least one semiconductor light source, wherein at least one component is embedded into the printed circuit board.

Abstract: A method for producing a striplight is disclosed. Said method utilizing at least the following steps: (a) providing a strip-shaped carrier, which is populated on at least one side with a plurality of semiconductor light sources; (b) arranging at least one electrical line on the carrier; and (c) casting the at least one electrical line on the carrier. A striplight which has: a strip-shaped carrier, populated on at least one side with a plurality of semiconductor light sources; at least one electrical line, which is arranged on the carrier; and joint casting of the carrier and the at least one electrical line, is likewise disclosed.

Abstract: In various embodiments, a light emitting diode module is provided. The light emitting diode module may include at least one light emitting diode; wherein the at least one light emitting diode is connected in parallel with at least one first capacitor; wherein the at least one light emitting diode is arranged in a first structural unit, and the at least one first capacitor is arranged in a second structural unit, wherein the first structural unit and the second structural unit are electrically coupled to one another via a first cable.

Abstract: A lighting device may include a heat sink, which has at least one carrier attached to the outside of the heat sink for at least one semiconductor light source; a recess for accommodating a driver; and at least one electrically insulating supply, which connects the recess to the outside of the heat sink; wherein the electrically insulating supply includes a contact surface that connects to the outside of the heat sink in a flush manner, the contact surface being at least partially covered by the carrier.

Abstract: A mounting structure for solid-state light sources, for example of the LED type, comprises a support board; a submount mounted on said support board and having at least one solid-state light radiation source mounted thereon; a drive board carrying drive circuitry for the light radiation source, the aforementioned drive board being mounted on the support board and extending peripherally with respect to the aforementioned submount; electrical interface connections between the submount and the drive board for connecting the light radiation source to the drive circuitry; and mechanical and thermal interface connections between the submount and the support board.

Abstract: A lighting device (1;15) comprising at least one flexible printed circuit board (3) which is populated with at least one semiconductor light source, comprising a potting material overlaid on at least one populated side of the printed circuit board so as to leave at least one emission surface of the semiconductor light source (2) exposed; an adhesive element at least partially covering a top side of the semiconductor light source, wherein the adhesive element (7) protrudes partially from the potting compound (10), is enclosed around its sides by the potting compound (10) in an adhesive manner and has better adhesion to the potting compound (10) than does the semiconductor light source.

Abstract: A fastening element for fastening a light source substrate to a support, wherein the fastening element is configured to be seated on the light source substrate, and includes at least one fastening means for fastening to the support.

Abstract: An LED lighting device may include an LED support, which is populated with at least one LED on a front side thereof and a rear side of which is fastened to a rest. The front side of the LED support may be overarched by an electrically insulating, light-permeable and diffusely scattering LED cover, and the LED cover may be overarched by a protection cover resting on the support.

Abstract: A semiconductor lamp may include at least one semiconductor light source and a driver for feeding the at least one semiconductor light source, wherein the driver is inductively coupled to the at least one semiconductor light source at least for the feeding.

Abstract: A lighting apparatus may include: a light source substrate, to the front side of which at least one semiconductor light source is fitted and the rear side of which is fitted to an electrically conductive carrier; wherein alongside the light source substrate at least two electrically conductive contact pins are led through the carrier and the contact pins are electrically connected to the at least one semiconductor light source; wherein the contact pins are in each case introduced into an electrically insulating sleeve and the respective sleeve is inserted into an associated cutout of the carrier.

Abstract: In various embodiments, a semiconductor lamp may include a driver cavity for accommodating driver electronics, and a light source substrate populated with at least one semiconductor light source, said driver cavity being closed by the light source substrate.