Abstract: An electronic module for an integrated mecatronic transmission control includes a housing cover and at least one multi-layer circuit board as an electrical connection between an interior of the housing and components located outside the housing. The multi-layer circuit board is a circuit carrier for electronic components of central control electronics and at the same time is a thermal connection to a base plate.

Abstract: A substrate (1; 11; 21) for a lighting module (M), said substrate comprising a plurality of light source mounting slots (DLn), and at least one resistor mounting slot (RLm) for a bridge resistor, wherein the at least one resistor mounting slot (RLm) is in each case connected in parallel with at least one of the light source mounting slots

Abstract: A lighting device, comprising a cooling body with at least one receiving area for a printed circuit board in each case, and at least one printed circuit board inserted into the at least one receiving area, with the at least one printed circuit board having a light source on its front face and with at least one part of a rear face making at least thermal contact with the cooling body. The at least one printed circuit board has a rotational locking means in each case which engages with at least one rotational locking mating means of its receiving area.

Abstract: A light emitting diode lamp may include a socket; a first circuit board; and at least one plug connector electrically connected to the socket; wherein the connector is connected to the circuit board by means of a plug section.

Abstract: A mounting structure for solid-state light sources, for example of the LED type, comprises a support board; a submount mounted on said support board and having at least one solid-state light radiation source mounted thereon; a drive board carrying drive circuitry for the light radiation source, the aforementioned drive board being mounted on the support board and extending peripherally with respect to the aforementioned submount; electrical interface connections between the submount and the drive board for connecting the light radiation source to the drive circuitry; and mechanical and thermal interface connections between the submount and the support board.

Abstract: An LED lighting module comprising: a printed circuit board (12), at least one LED (14) connected to said printed circuit board (12), a supply circuit (16) mounted on said printed circuit board (12), a protective casing (20), made of plastic, applied to said printed circuit board (12), wherein the protective casing (20) defines a light-emitting region (28) which surrounds said at least one LED (14) and a containment region (30) in which the components of said supply circuit (16) are enclosed, and a light sensor (34) arranged to receive the light emitted by said at least one LED (14) and connected to said supply circuit (16) in which said light sensor (34) is co-molded into said protective casing (20) and faces said light-emitting region (28).

Abstract: A lighting device, having at least one light outlet opening and at least two different fixing interfaces for the optional fixing of a respective attachment element optically upstream of the at least one light outlet opening.

Abstract: A lighting device (1; 50; 60; 70; 100; 100b), comprising: a body (4), having an outer contact surface (24); and a light source carrier (6), pressed onto the contact surface by at least one pressing element (43; 51; 61; 71; 101; 108; 220), wherein the pressing element is latched on the lighting device.

Abstract: A lighting device (1; 50; 60; 70; 80; 100; 100b) comprising: a body (4), particularly a heat sink, having an outer contact surface (24); and a light source carrier (6; 32; 61; 71; 81) pressed onto the contact surface by at least one pressing element (43; 51; 101), wherein the pressing element is adapted to be attached to the lighting device by at least one rotary motion.

Abstract: A lighting device (1;15) comprising at least one flexible printed circuit board (3) which is populated with at least one semiconductor light source, comprising a potting material overlaid on at least one populated side of the printed circuit board so as to leave at least one emission surface of the semiconductor light source (2) exposed; an adhesive element at least partially covering a top side of the semiconductor light source, wherein the adhesive element (7) protrudes partially from the potting compound (10), is enclosed around its sides by the potting compound (10) in an adhesive manner and has better adhesion to the potting compound (10) than does the semiconductor light source.

Abstract: A light module (1; 14), comprising a carrier (8, 10) for mounting at least one semiconductor source (5), in particular a light emitting diode, wherein: the carrier (8, 10) has a flexible printed circuit board (10), the flexible printed circuit board (10) is bonded face-to face to at least one base plate, (8) and the carrier (8, 10) can be bent along at least one predetermined bending line (3; 3a-3e), the base plate (8) can be bent along the at least one bending line, (3; 3a-3e), the base plate (8) has at least one cutout (9) along the bending line (3; 3a-3e) and the flexible printed circuit board (10) has at least one strip (11; 15) which crosses at least one of the cutouts (9).

Abstract: In various embodiments, a lighting system may comprise at least one connection element and at least one luminous band having at least one band-shaped unit circuit board, whereby the unit circuit board is equipped with at least two semiconductor light sources, and has at least one contact area arranged between at least two semiconductor light sources, whereby the contact area is configured so it can be severed and the contact area and the connection element are configured such that after severing of the contact area the connection element can be applied onto the contact area and at least one circuit can be closed on the unit circuit board by applying the connection element onto the contact area.

Abstract: A lighting device may include a heat sink, which has at least one carrier attached to the outside of the heat sink for at least one semiconductor light source; a recess for accommodating a driver; and at least one electrically insulating supply, which connects the recess to the outside of the heat sink; wherein the electrically insulating supply includes a contact surface that connects to the outside of the heat sink in a flush manner, the contact surface being at least partially covered by the carrier.

Abstract: In various embodiments, a rigid-flex mounting board for at least one semiconductor light source is provided. The mounting board may include at least one rigid support region configured to mount the at least one semiconductor light source; and a flexible support region, wherein the flexible support region has been produced by thinning of a rigid support region.

Abstract: An illumination device may include at least one light source; and at least two printed circuit boards arranged at least partially one above the other; wherein the at least two circuit boards are connected by means of at least one plug-connection element, with the plug-connection element being embodied on at least one side as a press-fit plug.

Abstract: A method for producing a flexible light strip having a substrate designed for bending and provided for fitting with light sources, is provided. The method may include singularizing the light strip from an endless intermediate product; and the endless intermediate product having at least one fiberglass composite layer.

Abstract: A housing concept for integrated control electronics, comprising a housing bottom, a circuit carrier populated with electronic components of the central control electronics, and a signal and current distribution component as the electric connection between the central control electronics and peripheral components. The housing bottom is configured in the shape of a basin, the circuit carrier for the electronic components of the central control electronics being disposed therein such that the same can be electrically connected on at least one upwardly curved edge region to the signal and current distribution component disposed above the same via contact points, and wherein the housing bottom may also be connected circumferentially to the signal and current distribution component.

Abstract: An electronic module for an integrated mecatronic transmission control includes a housing cover and at least one multi-layer circuit board as an electrical connection between an interior of the housing and components located outside the housing. The multi-layer circuit board is a circuit carrier for electronic components of central control electronics and at the same time is a thermal connection to a base plate.