Abstract: The system-on-chip camera comprises a semiconductor body with an integrated circuit, a sensor substrate, sensor elements arranged in the sensor substrate according to an array of pixels, a light sensor in the sensor substrate apart from the sensor elements, and a lens or an array of lenses on a surface of incidence. Filter elements, which may especially be interference filters for red, green or blue, are arranged between the sensor elements and the surface of incidence.

Abstract: It is proposed to use self-mixing interferometry for determining an absorption. The monitoring device for use in lateral flow testing for detecting presence or amount of an analyte in a liquid includes a housing, the housing including a carrier holder for holding a carrier for transport of the liquid; at least a first light source which is a resonant-cavity light source having a cavity; and an evaluation unit, operationally connected to at least the first light source for detecting a measurement signal. The first light source is structured and arranged to illuminate with light a test range in a test area of a carrier held in the carrier holder; and to couple back into the cavity of the first light source a portion of the light coming back from the test range.

Abstract: An apparatus for sound detection, sound localization and beam forming comprises a display and a plurality of microphone stacks, wherein the display surrounds each microphone stack in lateral directions. The apparatus further comprises a plurality of elastic connectors, wherein each elastic connector surrounds one respective microphone stack in lateral direction and mechanically connects the respective microphone stack with the display. Each microphone stack further comprises a microelectromechanical transducer array, the transducer array comprising a plurality of membranes, in particular nano-membranes, and corresponding integrated back-volumes, the back-volumes being arranged under the membranes. An optical reading device is configured to separately detect the displacement of each membrane.

Abstract: The system-on-chip camera comprises a semiconductor body with an integrated circuit, a sensor substrate, sensor elements arranged in the sensor substrate according to an array of pixels, a light sensor in the sensor substrate apart from the sensor elements, and a lens or an array of lenses on a surface of incidence. Filter elements, which may especially be interference filters for red, green or blue, are arranged between the sensor elements and the surface of incidence.

Abstract: The system-on-chip camera comprises a semiconductor body (1) with an integrated circuit (40), a sensor substrate (2), sensor elements (3) arranged in the sensor substrate according to an array of pixels, a light sensor (4) in the sensor substrate apart from the sensor elements, and a lens or an array of lenses (15) on a surface of incidence (30). Filter elements (11, 12, 13), which may especially be interference filters for red, green or blue, are arranged between the sensor elements and the surface of incidence.

Abstract: A hydraulic lifting column comprising a base structure, a head structure and a lifting structure. The lifting structure comprising a hydraulic power unit and hydraulic linear actuators extending between the base structure and the head structure, the hydraulic power unit acting on the hydraulic linear actuators. The lifting structure comprising four linear actuator units with a mutually parallel, vertically oriented working direction. Each linear actuator unit comprising a double cylinder having two-cylinder bores arranged next to one another and two piston structures with piston rods oriented parallel to one another and extendable in opposite directions from the double cylinder. The four lower piston rods are connected to the base structure at the corners of a first quadrilateral and the four upper piston rods are connected to the head structure at the corners of a second quadrilateral.

Abstract: At least one of the pixels of the image sensor is heated using at least one heater, and the temperature of this pixel is thus increased by a larger degree than the temperature of at least a further one of the pixels.

Abstract: A chassis of a transportable device including a base structure, four casters arranged thereon, four lowerable and raiseable support feet also mounted on the base structure, and a hydraulic support foot actuating device. The hydraulic support foot actuating device has a reservoir (1), a pump (2) manually operable by hand or foot, four support foot linear actuators (3) and a purely hydro-mechanical pipe and valve arrangement (4) which connects the reservoir (1), the pump (2) and the linear actuators (3) to one another. Therein, by means of hydraulic fluid delivered by the pump (2) from the reservoir (1) the two support feet assigned to two primary linear actuators (3a) can be fully extended until a mechanical stop is reached while raising the base structure by first applying pressure to the two primary linear actuators (3a) before applying pressure to the two other, secondary linear actuators (3b).

Abstract: A hydraulic lifting column comprising a base structure, a head structure and a lifting structure. The lifting structure comprising a hydraulic power unit and hydraulic linear actuators extending between the base structure and the head structure, the hydraulic power unit acting on the hydraulic linear actuators. The lifting structure comprising four linear actuator units with a mutually parallel, vertically oriented working direction. Each linear actuator unit comprising a double cylinder having two-cylinder bores arranged next to one another and two piston structures with piston rods oriented parallel to one another and extendable in opposite directions from the double cylinder. The four lower piston rods are connected to the base structure at the corners of a first quadrilateral and the four upper piston rods are connected to the head structure at the corners of a second quadrilateral.

Abstract: The invention relates to a method for determining at least one blood pressure value of a subject. According to the invention, a heartbeat signal of a subject, in particular an ECG, is determined by means of a heartbeat measuring arrangement and transmitted to a circulation parameter determination unit, wherein the circulation parameter determination unit determines at least one value of an autonomic tone, in particular a vagal tone and/or a heart rate variability and/or a sympathetic tone and/or an autonomic quotient, from a determined time profile of the heartbeat signal, wherein the circulation parameter determination unit determines the at least one blood pressure value taking into account the at least one value of the autonomic tone, and the determined blood pressure value is output.

Abstract: A chassis of a transportable device including a base structure, four casters arranged thereon, four lowerable and raiseable support feet also mounted on the base structure, and a hydraulic support foot actuating device. The hydraulic support foot actuating device has a reservoir (1), a pump (2) manually operable by hand or foot, four support foot linear actuators (3) and a purely hydro-mechanical pipe and valve arrangement (4) which connects the reservoir (1), the pump (2) and the linear actuators (3) to one another. Therein, by means of hydraulic fluid delivered by the pump (2) from the reservoir (1) the two support feet assigned to two primary linear actuators (3a) can be fully extended until a mechanical stop is reached while raising the base structure by first applying pressure to the two primary linear actuators (3a) before applying pressure to the two other, secondary linear actuators (3b).

Abstract: The system-on-chip camera comprises a semiconductor body (1) with an integrated circuit (40), a sensor substrate (2), sensor elements (3) arranged in the sensor substrate according to an array of pixels, a light sensor (4) in the sensor substrate apart from the sensor elements, and a lens or an array of lenses (15) on a surface of incidence (30). Filter elements (11, 12, 13), which may especially be interference filters for red, green or blue, are arranged between the sensor elements and the surface of incidence.

Abstract: At least one of the pixels of the image sensor is heated using at least one heater, and the temperature of this pixel is thus increased by a larger degree than the temperature of at least a further one of the pixels.

Abstract: The semiconductor image sensor comprises a plurality of pixels (1) with photo sensors (2). At least one heater (4) is integrated with the photo sensors and is arranged in at least one of the pixels or in the vicinity of at least one of the pixels. An appropriate operation of the heater will increase the temperature of the relevant pixel. Thus it is possible to achieve a local compensation of a temperature difference that may be due to the operation of an integrated readout circuit (3) or any other integrated component generating heat.

Abstract: The semiconductor image sensor comprises a plurality of pixels (1) with photo sensors (2). At least one heater (4) is integrated with the photo sensors and is arranged in at least one of the pixels or in the vicinity of at least one of the pixels. An appropriate operation of the heater will increase the temperature of the relevant pixel. Thus it is possible to achieve a local compensation of a temperature difference that may be due to the operation of an integrated readout circuit (3) or any other integrated component generating heat.

Abstract: A method for making a power semiconductor module and a module produced by that method, wherein the module includes a substrate, a connection device and load terminal elements, wherein power semiconductor components are arranged on a conductor track of the substrate and connected to one of the load terminal element by the connection device. The power semiconductor module has auxiliary contact pads which can be connected to an external printed circuit board. The primary production step in this case is cohesively connecting respective first contact areas of the first conductor tracks to at least one second contact area of a power semiconductor component and at least one third contact area of a load terminal element; afterwards, the assemblage composed of at least one power semiconductor component of a connection device and load terminal elements is arranged to form a housing of the power semiconductor module.

Abstract: A power semiconductor module comprising: a substrate, a plurality of conductor tracks arranged thereon, the conductor tracks being electrically insulated from one another, and including power semiconductor components arranged thereon; a connecting device, composed of an alternating layer sequence of at least two electrically conductive layers and at least one electrically insulating layer disposed therebetween, for the circuit-conforming connection of the power semiconductor components, the conductor tracks and/or external contact devices. The electrically conductive layers form connecting tracks and at least one transformer is formed integrally with, and thus from the constituent parts of, the connecting device. The transformer is composed of at least one transmitter coil and at least one receiver coil, which are in each case arranged coaxially with respect to one another and are formed with spiral windings.

Abstract: A connecting device for the electrically conductive connection of electronic components and a substrate. The connecting device is formed as a film composite formed of at least one insulating film and at least two electrically conductive films disposed on opposite sides of the insulating film. The film composite is formed as a layer construction of a conductive film alternating with an insulating film, wherein at least one conductive film is structured and thus forms conductor tracks. Furthermore, at least one conductive film of a main area of the film composite is made of a first metal and has at least one film section having a layer of a second metal that is thinner in comparison with the thickness of the first layer.

Abstract: A method for making a power semiconductor module and a module produced by that method, wherein the module includes a substrate, a connection device and load terminal elements, wherein power semiconductor components are arranged on a conductor track of the substrate and connected to one of the load terminal element by the connection device. The power semiconductor module has auxiliary contact pads which can be connected to an external printed circuit board. The primary production step in this case is cohesively connecting respective first contact areas of the first conductor tracks to at least one second contact area of a power semiconductor component and at least one third contact area of a load terminal element; afterwards, the assemblage composed of at least one power semiconductor component of a connection device and load terminal elements is arranged to form a housing of the power semiconductor module.

Abstract: A power semiconductor module comprising: a substrate, a plurality of conductor tracks arranged thereon, the conductor tracks being electrically insulated from one another, and including power semiconductor components arranged thereon; a connecting device, composed of an alternating layer sequence of at least two electrically conductive layers and at least one electrically insulating layer disposed therebetween, for the circuit-conforming connection of the power semiconductor components, the conductor tracks and/or external contact devices. The electrically conductive layers form connecting tracks and at least one transformer is formed integrally with, and thus from the constituent parts of, the connecting device. The transformer is composed of at least one transmitter coil and at least one receiver coil, which are in each case arranged coaxially with respect to one another and are formed with spiral windings.