Abstract: Mechanical transducers such as pressure sensors, resonators or other frequency-reference devices are implemented under conditions characterized by different temperatures. According to an example embodiment of the present invention, a combination of materials is implemented for mechanical transducer applications to mitigate temperature-related changes. In one application, a material property mismatch is used to facilitate single-anchor transducer applications, such as for resonators. Another application is directed to a Silicon-Silicon dioxide combination of materials.

Abstract: A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.

Abstract: A method of forming an adhesive force includes removing a seta from a living specimen, attaching the seta to a substrate, and applying the seta to a surface so as to establish an adhesive force between the substrate and the surface. The seta is applied to the surface with a force perpendicular to the surface. The seta is then pulled with a force parallel to the surface so as to preload the adhesive force of the seta.

Abstract: A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.

Abstract: A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.

Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles.

Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles.

Abstract: A miniaturized micromachined (MEMS) accelerometer-based sensor suitable for use in biological applications, such as a middle ear implant, is provided. An encapsulation layer is deposited on top of an accelerometer proof mass and flexure prior to release of the proof mass and flexure. The encapsulation layer protects the proof mass and flexure from subsequent processing steps, such as dicing and packaging, which enables fabrication of finished devices having reduced size. Surfaces within the accelerometer may be passivated after releasing the proof mass and flexure. Remote piezoresistive sensing is performed in order to provide low noise and reduced sensor head size.

Abstract: An electroosmotic pump and method of manufacturing thereof. The pump having a porous structure adapted to pump fluid therethrough, the porous structure comprising a first side and a second side, the porous structure having a plurality of fluid channels therethrough, the first side having a first continuous layer of electrically conductive porous material deposited thereon and the second side having a second continuous layer of electrically conductive porous material deposited thereon, the first second layers coupled to a power source, wherein the power source supplies a voltage differential between the first layer and the second layer to drive fluid through the porous structure at a desired flow rate. The continuous layer of electrically conductive porous material is preferably a thin film electrode, although a multi-layered electrode, screen mesh electrode and beaded electrode are alternatively contemplated.

Abstract: A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.

Abstract: A method of forming an adhesive force includes removing a seta from a living specimen, attaching the seta to a substrate, and applying the seta to a surface so as to establish an adhesive force between the substrate and the surface. The seta is applied to the surface with a force perpendicular to the surface. The seta is then pulled with a force parallel to the surface so as to preload the adhesive force of the seta.

Abstract: A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.

Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles.

Abstract: A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.

Abstract: A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.

Abstract: A new and versatile ultra-miniature pressure sensor comprises a very thin diaphragm of approximately one micron or less, e.g., 0.2 microns. In some embodiments, the diaphragm has a radius of 20 microns and the pressure sensor can detect signals at or near 0.1 Atm with 1% accuracy. The diaphragm is formed by epitaxial growth of silicon or by bonding and etching. A plurality of high sensitivity piezoresistive strain gauges measure strain of the diaphragm. Less than 0.1 microns thick, the piezoresistive strain gauges are embedded in the diaphragm by ion implantation or formed thereon by epitaxial growth. The ability to form ultra-thin piezoresistive layers on very thin diaphragms enables the miniaturization of the pressure sensor as well as any device that employs it.

Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles.

Abstract: An electroosmotic micropump having a plurality of planar features formed in a substrate to form an electroosmotic flow (EOF) pumping region. Inlet and outlet manifolds on either side of the pumping region to enable fluid to be pumped into and through the micropump. A cover is bonded to the substrate to seal the pumping region and manifolds. An insulating layer coating is applied to the formed substrate to reduce current flow when an electric filed is applied during pumping operation. An additional layer is applied on top of the insulating layer to provide electrochemistry at the liquid-solid interface in the electroosmotic micropump that enhances micropump performance.

Abstract: An electroosmotic pump used in a closed loop cooling system. The pump includes a fluid chamber, a pumping element, an inlet electrode, an outlet electrode, and means for providing electrical voltage to the inlet electrode and the outlet electrode to produce an electrical field therebetween. The pumping element is configured to pump fluid therethrough, and the pumping element is positioned to segment the fluid chamber into an inlet chamber including a fluid inlet port and an outlet chamber including a fluid outlet port. The size of the inlet chamber is proportional to a predetermined residence time of the inlet chamber. The inlet electrode is positioned within the inlet chamber and a predetermined distance from a first surface of the pumping element. The outlet electrode is positioned within the outlet chamber and a predetermined distance from a second surface of the pumping element.

Abstract: A mounting assembly comprises a rigid support bracket configured to substantially surround a heat source. The rigid support bracket is coupled to a circuit board. The mounting assembly also comprises a removable lid that is coupled to the rigid support bracket and configured to provide selective access to the heat source. The mounting assembly further comprises a heat exchanger coupled to the heat source, wherein the heat exchanger is positioned between the heat source and the removable lid. The removable lid is preferably configured and has a desired stiffness to urge the heat exchanger in contact by a substantially constant force with the heat source and prevents unwanted movement of the heat source. Further, the support bracket structure is configured to transfer the substantially constant force over a relatively large surface area on the circuit board thereby protecting the heat source from bending, breaking or collapsing from the substantially constant force.