Abstract: An integrated circuit (IC) chip carrier includes one or more memory devices therein. The memory is integrated into the carrier prior to the IC chip being connected to the carrier. Therefore, the IC chip may be connected to the memory at the same time as the IC chip is connected to the carrier. An access instruction may be sent from the IC chip to the memory through a wiring line of the IC chip carrier. Power potential may be sent from a system board to the memory through a vertical interconnect access (VIA). Alternatively, an access instruction may be sent from a first IC chip to the memory and power potential may be sent from a second IC chip to the memory.

Abstract: Articles and methods involving protected electrode structures are generally provided. In some embodiments, a protected electrode structure includes an electrode comprising an alkali metal and a protective structure directly adjacent the electrode. In some embodiments, the protective structure comprises elemental carbon and intercalated ions. In some embodiments, the protective structure is a composite protective structure. The composite structure may comprise an alloy comprising an alkali metal, an oxide of an alkali metal, and/or a fluoride salt of an alkali metal.

Abstract: The invention relates to a bending press (3) and to a method for bending sheet metal in relation to a work piece (2). The bending press (3) comprises a machine frame (7) on which lower and upper clamping jaws (5, 6) are arranged, having first and second reshaping edges. A bending tool (41) having a bending edge (42) is arranged on a bending bar (43). The bending tool (41) is mounted about a swivel axis (46) such that same can swivel. The swivel axis (46) can be moved into both a position above and a position below a work piece contact plane (40). In a position above the work piece contact plane (40), the bending edge (42) is oriented down-wards in the direction of a first reshaping edge, and in a position below the work piece contact plane (40), said bending edge is oriented upwards in the direction of the second reshaping edge. The invention also relates to a method for reshaping, in particular bending, sheet metal in relation to a work piece (2).

Abstract: An integrated circuit (IC) chip carrier includes one or more memory devices therein. The memory is integrated into the carrier prior to the IC chip being connected to the carrier. Therefore, the IC chip may be connected to the memory at the same time as the IC chip is connected to the carrier. Because the memory is integrated into the IC chip carrier, prior to the IC chip being attached thereto, reliability concerns that result from attaching the memory to the IC chip carrier affect the IC chip carrier and do not affect the yield of the relatively more expensive IC chip.

Abstract: An integrated circuit (IC) chip carrier includes one or more memory devices therein. The memory is integrated into the carrier prior to the IC chip being connected to the carrier. Therefore, the IC chip may be connected to the memory at the same time as the IC chip is connected to the carrier. Because the memory is integrated into the IC chip carrier, prior to the IC chip being attached thereto, reliability concerns that result from attaching the memory to the IC chip carrier affect the IC chip carrier and do not affect the yield of the relatively more expensive IC chip.

Abstract: An integrated circuit (IC) chip carrier includes one or more memory devices therein. The memory is integrated into the carrier prior to the IC chip being connected to the carrier. Therefore, the IC chip may be connected to the memory at the same time as the IC chip is connected to the carrier. Because the memory is integrated into the IC chip carrier, prior to the IC chip being attached thereto, reliability concerns that result from attaching the memory to the IC chip carrier affect the IC chip carrier and do not affect the yield of the relatively more expensive IC chip.

Abstract: An integrated circuit (IC) chip carrier includes one or more memory devices therein. The memory is integrated into the carrier prior to the IC chip being connected to the carrier. Therefore, the IC chip may be connected to the memory at the same time as the IC chip is connected to the carrier. Because the memory is integrated into the IC chip carrier, prior to the IC chip being attached thereto, reliability concerns that result from attaching the memory to the IC chip carrier affect the IC chip carrier and do not affect the yield of the relatively more expensive IC chip.

Abstract: A method of managing thermal warpage of a laminate which includes: assembling a stiffener and an adhesive on the laminate, the stiffener being a material that has a higher modulus of elasticity than the laminate; applying a force to deform the laminate a predetermined amount; heating the laminate, stiffener and adhesive to a predetermined temperature at which the adhesive cures to bond the stiffener to the laminate; cooling the laminate, stiffener and adhesive to a temperature below the predetermined temperature, the laminate maintaining its deformed shape.

Abstract: An electrical package may comprise a first substrate with a first substrate surface, and a microprocessor chip connected to the first substrate surface. The microprocessor chip may comprise a first chip surface that electrically connects to the first substrate surface, and a second chip surface located opposite the first chip surface. The electrical package may comprise a heat spreader assembly that comprises a lid section and a contact surface thermally connected to the second-chip surface. The electrical package may also comprise a pedestal between the contact surface and the lid section. The pedestal may comprise a first end that is located near the contact surface and a second end that is located near the lid section. The second end may be wider than the first end.

Abstract: A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.

Abstract: Articles and methods including additives in electrochemical cells, are generally provided. As described herein, such electrochemical cells may comprise an anode, a cathode, an electrolyte, and optionally a separator. In some embodiments, at least one of the anode, the cathode, the electrolyte, and/or the optional separator may comprise an additive and/or additive precursor. For instance, in some cases, the electrochemical cell comprises an electrolyte and an additive and/or additive precursor that is soluble with and/or is present in the electrolyte. In some embodiments, the additive precursor comprises a disulfide bond. In certain embodiments, the additive is a carbon disulfide salt. In some cases, the electrolyte may comprise a nitrate.

Abstract: A forming operation on a workpiece clamps the workpiece between a first clamping jaw with a first shaping edge, and an adjustable second clamping jaw with a second shaping edge so that a portion projects between the shaping edges and afterwards a bending edge of an adjustable bending bar is guided at a distance past the shaping edges, whereby the portion of the workpiece is angled away in relation to the part of the workpiece that is clamped between the clamping jaws. The bending edge is guided on angling along a straight path of movement of the bending edge, and after the bending edge has passed the shaping edges, the shaping edges are adjusted along an adjustment path which approaches the path of movement of the bending edge.

Abstract: A puncturing system has a carrier tape carrying multiple lancets, a device housing comprising a conveying facility for moving the lancets into a usage position consecutively by moving the carrier tape in a conveying direction, a puncturing drive for accelerating one of the lancets that is positioned in the usage position in a puncturing motion, an opening in the device housing for touching against a body part in which a puncture is to be made by the puncturing motion of one of the lancets, an actuation facility for driving the conveying facility, and an unlockable interlock comprising a stop that blocks further transport of the carrier tape as soon as one of the lancets has reached the usage position.

Abstract: Sheet-like product and method for authenticating a security tag including a section of the sheet-like product. The sheet-like product includes at least one security feature having optical properties that change with the viewing angle and, and at least one marker, wherein each marker is uniquely attributable to a position on the sheet-like product. The position of the at least one security feature on the sheet-like product is predetermined relative to the position of the at least one marker on the sheet-like product.

Abstract: The invention relates to a bending press (18) for carrying out a forming operation on a workpiece (1), comprising a first clamping beam (27), which has a first clamping jaw (2) with a first forming edge (5), and an adjustable second clamping beam (28), which has a second clamping jaw (3) with a second forming edge (6), and also at least one bending beam (7, 38), which is adjustable in relation to the machine frame (19) along a bending beam guide (33) and has at least one bending edge (8, 39), the path of movement (12) of which passes by the forming edges (5, 6) at a distance (10) and with which a portion (4) of the workpiece (1) can be angled away in relation to the part of the workpiece (1) that is clamped between the clamping jaws (2, 3).

Abstract: A rear (1) of a motor vehicle has a bumper (2) configured as a beam and arranged in a transverse direction (Y) of the motor vehicle. A trim panel (3) covers the bumper (2), and an end plate (4) is provided for at least one end pipe (5) of an exhaust gas system of the motor vehicle. An opening (7) penetrates the trim panel (3) below the bumper (2), and the end plate (4) penetrates the opening (7). Supports (8) are connected to the bumper (2) behind the trim panel (3) and extend down from the bumper (2). The trim panel (3) is mounted in the supports (8) below the bumper (2), and the end plate (4) is mounted in the trim panel (3).

Abstract: Assembly apparatuses and processes are provided which include a pressure cure fixture. The pressure cure fixture is sized to reside within a container, such as an electronic enclosure, and facilitate applying pressure to an adhesive disposed over an inner surface of the container. The pressure cure fixture is formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and is sized to correspond, at least in part, to an inner space of the container while allowing for the adhesive and a surface-mount element to be disposed between the pressure cure fixture and the inner surface of the container. When heated, the pressure cure fixture expands greater than the container and imparts the pressure to the surface-mount element and the adhesive to facilitate securing the surface-mount element to the inner surface of the container.

Abstract: Articles and methods including additives in electrochemical cells, are generally provided. As described herein, such electrochemical cells may comprise an anode, a cathode, an electrolyte, and optionally a separator. In some embodiments, at least one of the anode, the cathode, the electrolyte, and/or the optional separator may comprise an additive and/or additive precursor. For instance, in some cases, the electrochemical cell comprises an electrolyte and an additive and/or additive precursor that is soluble with and/or is present in the electrolyte. In some embodiments, the additive precursor comprises a disulfide bond. In certain embodiments, the additive is a carbon disulfide salt. In some cases, the electrolyte may comprise a nitrate.

Abstract: A side component is provided for fastening to a vehicle frame. The side component has a receiving region for a vehicle trim panel, in particular a rear trim panel, and a receiving region for a wheel arch liner. The side component further is configured for receiving an air filter.

Abstract: An electrical package may comprise a first substrate with a first substrate surface, and a microprocessor chip connected to the first substrate surface. The microprocessor chip may comprise a first chip surface that electrically connects to the first substrate surface, and a second chip surface located opposite the first chip surface. The electrical package may comprise a heat spreader assembly that comprises a lid section and a contact surface thermally connected to the second-chip surface. The electrical package may also comprise a pedestal between the contact surface and the lid section. The pedestal may comprise a first end that is located near the contact surface and a second end that is located near the lid section. The second end may be wider than the first end.