Abstract: Disclosed is a puncturing system for generating a puncture wound for obtaining a sample of a body fluid, comprising a press-on part to be pressed onto a body part in which a puncture wound is to be generated, a trigger, by the actuation of which a user can trigger a puncturing motion of a puncturing element after the press-on part is pressed on, and a testing facility for determining at least one test parameter on which a sample-obtaining probability depends. A securing facility is also provided that, in a locked state, locks the trigger such that no puncturing motion can be triggered, and, in a triggering state, releases the trigger such that a puncturing motion can be triggered by actuation thereof, whereby the securing facility is transitioned from the locked state to the triggering state by the testing facility when the test parameter determined by the testing facility meets defined minimum requirements.

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s).

Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, and a tamper-respondent detector. The glass enclosure includes stressed glass with a compressively-stressed surface layer, and the tamper-respondent detector monitors, at least in part, the stressed glass to facilitate defining the secure volume. The stressed glass fragments with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detects the fragmenting of the stressed glass. In certain embodiments, the stressed glass may be a machined glass enclosure that has undergone ion-exchange processing, and the compressively-stressed surface layer of the stressed glass may be compressively-stressed to ensure that the stressed glass fragments into glass particles of fragmentation size less than 1000 ?m with the intrusion event.

Abstract: Tamper-respondent assemblies, electronic packages and fabrication methods are provided which incorporate a vent structure. The tamper-respondent assembly includes an electronic enclosure to enclose, at least in part, an electronic component(s) to be protected. The electronic enclosure includes an inner surface, and an air vent. A tamper-respondent electronic circuit structure is provided which includes a tamper-respondent sensor disposed to cover, at least part, the inner surface of the electronic enclosure, and define, at least in part, a secure volume about the electronic component(s). The vent structure includes at least one air passage coupling in fluid communication the secure volume and the air vent of the electronic enclosure to allow air pressure within the secure volume to equalize with air pressure external to the tamper-respondent assembly.

Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

Abstract: Articles and methods involving protective membranes for electrochemical cells are generally provided. In some embodiments, a composite protective layer comprising particles and a polymeric binder may be disposed on an electroactive material. The particles may be reactive with lithium, may capable of intercalating lithium, and/or may comprise intercalated lithium. In some embodiments, the electroactive material may be in the form of a first electroactive layer, and a second electroactive layer may be disposed on the composite protective layer. Certain embodiments relate to activating a composite protective layer by intercalating lithium into particles within the layer and/or by reacting the particles with lithium metal.

Abstract: A lancing device comprises a lancet drive to cause a lancet to effect a puncturing movement, a housing that encloses the lancet drive, and a touching element with an opening for applying a part of a body in which a prick wound is to be produced, the touching element being movable relative to the lancet drive for the purpose of adjusting the puncturing depth in a puncturing direction. The touching element is connected rotatably by means of a screw thread to an intermediate piece and is movable in the puncturing direction, while the intermediate piece is rotatable and movable relative to the housing. A guide prevents rotation of the touching element relative to the housing, and the touching element is enclosed by the intermediate piece at least over part of its length.

Abstract: Copolymer comprising polyarylene ether blocks and hydrophilic-hydrophobic blocks, wherein said hydrophilic-hydrophobic blocks comprise polyisobutene blocks.

Abstract: A rail vehicle has a bogie, which is covered in such a way that a bogie cavity exists, which is formed in the under floor region of the rail vehicle by a cover assembly and walls adjacent to the bogie. A device for producing pressurized air is connected, with respect to flow, to an air inlet device in the walls of the bogie cavity in such a way that the air can be blown into the bogie cavity.

Abstract: The invention relates to a method for preparing polyarylethersulfone-polyalkylene oxide block copolymers (PPC) comprising the polycondensation of a reaction mixture (RG) comprising the components: (A1) at least one aromatic dihalogen compound, (B1) at least one aromatic dihydroxyl compound, (B2) at least one polyalkylene oxide having at least two hydroxyl groups, (C) at least one aprotic polar solvent and (D) at least one metal carbonate, where the reaction mixture (RG) does not comprise any substance which forms an azeotrope with water.

Abstract: Methods of fabricating tamper-respondent assemblies are provided which include an electronic enclosure, a tamper-respondent electronic circuit structure, and at least one security element. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner surface. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure, and the at least one security element overlies and physically secures in place, at least in part, the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure.

Abstract: A motor vehicle rear spoiler arrangement includes a spoiler wing movable between a retracted inoperative position and an extended working position; a supporting body structure that defines a body recess; a recess cover that at least partially closes the body recess; and a support arrangement configured to support the spoiler wing (in its inoperative position on the recess cover. The support arrangement includes an elastic buffer element on a lower side of the spoiler wing, a support surface on an upper side of the recess cover, wherein the buffer element rests in the inoperative position on the support surface, and a separate supporting body arranged in the body recess and that supports a lower side of the recess cover in a region of the support surface on the body structure.

Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

Abstract: A method and structure for joining a semiconductor device and a laminate substrate or two laminate substrates where the joint is formed with lead free solders and lead free compositions. The various lead free solders and lead free compositions are chosen so that there is a sufficient difference in liquidus temperatures such that some components may be joined to, or removed from, the laminate substrate without disturbing other components on the laminate substrate.

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.

Abstract: Method and system for confirming the integrity of a tamper-evident seal based on a comparison of the value of at least one parameter describing the physical structure of a predetermined breaking point provided in the seal, which value is determined from at least one captured image of the seal, with a pre-determined reference parameter value.

Abstract: Block copolymer comprising polyarylene ether blocks and polyalkylene oxide blocks, wherein said block copolymer comprises at least two polyalkylene oxide blocks that are endcapped with different endcapping groups.

Abstract: A rear (1) of a motor vehicle has a bumper (2) configured as a beam and arranged in a transverse direction (Y) of the motor vehicle. A trim panel (3) covers the bumper (2), and an end plate (4) is provided for at least one end pipe (5) of an exhaust gas system of the motor vehicle. An opening (7) penetrates the trim panel (3) below the bumper (2), and the end plate (4) penetrates the opening (7). Supports (8) are connected to the bumper (2) behind the trim panel (3) and extend down from the bumper (2). The trim panel (3) is mounted in the supports (8) below the bumper (2), and the end plate (4) is mounted in the trim panel (3).

Abstract: The invention relates to compounds for use in the treatment of telomere related diseases and/or telomere related medical conditions, particularly wherein said telomere related diseases and/or telomere related medical conditions are cancer and cellular ageing. Particularly, herein is disclosed 37 kDa/67 kDa laminin receptor precursor/high affinity laminin receptor (LRP/LR) and/or a fragment thereof for use in the treatment and/or prevention of cellular ageing.

Abstract: Membrane comprising a block copolymer comprising polyarylene ether blocks and polyalkylene oxide blocks, wherein said polyalkylene oxide blocks comprise at least one polyethylene oxide segment and at least one segment of at least one polyalkylene oxide that is different from polyethylene oxide