Patents by Inventor Thorsten Meyer

Thorsten Meyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10734352
    Abstract: A metallic interconnection and a semiconductor arrangement including the same are described, wherein a method of manufacturing the same may include: providing a first structure including a first metallic layer having protruding first microstructures; providing a second structure including a second metallic layer having protruding second microstructures; contacting the first and second microstructures to form a mechanical connection between the structures, the mechanical connection being configured to allow fluid penetration; removing one or more non-metallic compounds on the first metallic layer and the second metallic layer with a reducing agent that penetrates the mechanical connection and reacts with the one or more non-metallic compounds; and heating the first metallic layer and the second metallic layer at a temperature causing interdiffusion of the first metallic layer and the second metallic layer to form the metallic interconnection between the structures.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: August 4, 2020
    Assignee: Infineon Technologies AG
    Inventors: Irmgard Escher-Poeppel, Khalil Hosseini, Johannes Lodermeyer, Joachim Mahler, Thorsten Meyer, Georg Meyer-Berg, Ivan Nikitin, Reinhard Pufall, Edmund Riedl, Klaus Schmidt, Manfred Schneegans, Patrick Schwarz
  • Patent number: 10707158
    Abstract: A package comprising a chip carrier, an electronic chip on the chip carrier, a clip on the electronic chip, an encapsulant at least partially encapsulating the electronic chip, and an electrically conductive vertical connection structure provided separately from the clip and electrically connecting the chip carrier with the clip.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: July 7, 2020
    Assignee: Infineon Technologies AG
    Inventors: Alexander Heinrich, Bernd Goller, Thorsten Meyer, Gerald Ofner
  • Patent number: 10700037
    Abstract: In some examples, a device includes a semiconductor element, a layer element, and a single connector element electrically connecting the semiconductor element and the layer element. In some examples, the single connector element includes two or more discrete connector elements, and each discrete connector element of the two or more discrete connector elements electrically connects the semiconductor element and the layer element. In some examples, the single connector element also includes conductive material attached to the two or more discrete connector elements.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: June 30, 2020
    Assignee: Infineon Technologies AG
    Inventors: Eung San Cho, Thorsten Meyer, Xaver Schloegel, Thomas Behrens, Josef Hoeglauer
  • Publication number: 20200203310
    Abstract: A method of producing packaged semiconductor devices includes providing a first packaging substrate panel, providing a second packaging substrate panel, and moving the first and second packaging substrate panels through an assembly line that comprises a plurality of package assembly tools using a control mechanism. First type packaged semiconductor devices are formed on the first packaging substrate panel and second type packaged semiconductor devices are formed on the second packaging substrate panel. The control mechanism moves both of the first and packaging substrate panels through the assembly line in a non-linear manner. The first and second packaged semiconductor devices differ with respect to at least one of: lead configuration, and encapsulant configuration.
    Type: Application
    Filed: December 19, 2019
    Publication date: June 25, 2020
    Inventors: Thorsten Meyer, Gerald Ofner, Stephan Bradl, Stefan Miethaner, Alexander Heinrich, Horst Theuss, Peter Scherl
  • Publication number: 20200203238
    Abstract: A method for manufacturing a semiconductor panel is disclosed. In one example, the method includes providing a first preformed polymer form. The method further includes arranging multiple semiconductor chips over the first preformed polymer form. The method further includes attaching a second preformed polymer form to the first preformed polymer form, wherein the semiconductor chips are arranged between the attached preformed polymer forms, and wherein the attached preformed polymer forms form the semiconductor panel encapsulating the semiconductor chips.
    Type: Application
    Filed: November 21, 2019
    Publication date: June 25, 2020
    Applicant: Infineon Technologies AG
    Inventors: Thorsten Meyer, Andreas Grassmann
  • Patent number: 10689296
    Abstract: The invention relates to a process for manufacturing a gypsum slurry by bringing together and mixing gypsum, water, wax powder and optionally other components, applying the gypsum slurry in a process for manufacturing a gypsum product and a gypsum product such as a plasterboard or wallboard obtained by the process and the use of the wax powder for the manufacturing of a moisture resistant gypsum product.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: June 23, 2020
    Assignee: Sasol Wax GmbH
    Inventors: Gernot Meyer, Thorsten Frick, Thomas Haas
  • Patent number: 10625769
    Abstract: A motor vehicle steering system is disclosed. The system includes a steering spindle consisting of spindle members which are non-rotatably connected to one another. One end of a spindle member has a spline shaft profile and is introduced into a sleeve-like intermediate piece which is arranged on the other spindle member and, on the inner periphery, has a negative-shaped spline shaft profile with respect to the spline shaft profile such that the spindle member is plug-connected to the intermediate piece. In order for the spindle members to be able to be connected to each other with minimal effort even in the event of visual inaccessibility, a circumferential guide contour pointing toward the intermediate piece is formed on the spindle member. The guide contour is upstream of the spline shaft profile toward the intermediate piece and is perforated by grooves of the spline shaft profile to form convex guide segments.
    Type: Grant
    Filed: February 7, 2015
    Date of Patent: April 21, 2020
    Assignee: Daimler AG
    Inventors: Axel Hebenstreit, Hans-Dieter Loeffler, Thorsten Meyer, Marco Schwieger
  • Patent number: 10629575
    Abstract: A semiconductor chip assembly includes first and second semiconductor dies that each include opposite facing upper and lower sides and an outer edge side, and an electrical interposer having opposite facing first and second conductive surfaces and a conductive connection between the conductive surfaces. The second semiconductor die is mounted on top of the first semiconductor die and the interposer such that the lower side of the second semiconductor die faces the first semiconductor die and the interposer, a first lateral section of the second semiconductor die at least partially covers the upper side of the first semiconductor die, and a second lateral section of the second semiconductor die extends past the outer edge side of the first semiconductor die. The first conductive surface is electrically connected to a first terminal that is disposed on a lower side of the second semiconductor die.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: April 21, 2020
    Assignee: Infineon Techologies AG
    Inventors: Thorsten Scharf, Carsten Ahrens, Helmut Brech, Martin Gruber, Thorsten Meyer, Matthias Zigldrum
  • Publication number: 20200085779
    Abstract: The present invention provides compounds for use in the treatment of respiratory diseases of animals, especially Bovine or Swine Respiratory disease (BRD and SRD).
    Type: Application
    Filed: December 22, 2017
    Publication date: March 19, 2020
    Applicant: Intervet Inc.
    Inventors: Thorsten Meyer, Ralf Warrass, Joachim Ullrich, Michael Berger, Michael Linder
  • Patent number: 10566309
    Abstract: A method of producing packaged semiconductor devices includes providing a first packaging substrate panel. A second packaging substrate panel is provided. The first and second packaging substrate panels are moved through an assembly line that includes a plurality of package assembly tools using a control mechanism. First type packaged semiconductor devices are formed on the first packaging substrate panel and second type packaged semiconductor devices are formed on the second packaging substrate panel. The second type packaged semiconductor device is different than the first type packaged semiconductor device. The control mechanism moves both of the first and packaging substrate panels through the assembly line in a non-linear manner.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: February 18, 2020
    Assignee: Infineon Technologies AG
    Inventors: Thorsten Meyer, Gerald Ofner, Peter Scherl, Stephan Bradl, Stefan Miethaner, Alexander Heinrich, Horst Theuss
  • Publication number: 20200021002
    Abstract: A semiconductor device including an Integrated Circuit (IC) package and a plastic waveguide. The IC package includes a semiconductor chip; and an embedded antenna formed within a Redistribution Layer (RDL) coupled to the semiconductor chip, wherein the RDL is configured to transport a Radio Frequency (RF) signal between the semiconductor chip and the embedded antenna. The plastic waveguide is attached to the IC package and configured to transport the RF signal between the embedded antenna and outside of the IC package.
    Type: Application
    Filed: July 11, 2018
    Publication date: January 16, 2020
    Inventors: Maciej Wojnowski, Dirk Hammerschmidt, Walter Hartner, Johannes Lodermeyer, Chiara Mariotti, Thorsten Meyer
  • Patent number: 10535634
    Abstract: Embodiments herein relate to a system in package (SiP). The SiP may have a first layer of one or more first functional components with respective first active sides and first inactive sides opposite the first active sides. The SiP may further include a second layer of one or more second functional components with respective second active sides and second inactive sides opposite the second active sides. In embodiments, one or more of the first active sides are facing and electrically coupled with one or more of the second active sides through a through-mold via or a through-silicon via.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: January 14, 2020
    Assignee: INTEL CORPORATION
    Inventors: Vijay K. Nair, Chuan Hu, Thorsten Meyer
  • Patent number: 10522454
    Abstract: A microelectronic package including a passive microelectronic device disposed within a package body, wherein the package body is the portion of the microelectronic package which provides support and/or rigidity to the microelectronic package. In a flip-chip type microelectronic package, the package body may comprise a microelectronic substrate to which an active microelectronic device is electrically attached. In an embedded device type microelectronic package, the package body may comprise the material in which the active microelectronic device is embedded.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: December 31, 2019
    Assignee: Intel Corporation
    Inventors: Thorsten Meyer, Gerald Ofner, Andreas Wolter, Georg Seidemann, Sven Albers, Christian Geissler
  • Publication number: 20190363052
    Abstract: Disclosed herein are integrated circuit (IC) packages, and related structures and techniques. In some embodiments, an IC package may include: a die; a redistribution structure, wherein the die is coupled to the redistribution structure via first-level interconnects and solder; a solder resist; and second-level interconnects coupled to the redistribution structure through openings in the solder resist.
    Type: Application
    Filed: January 28, 2016
    Publication date: November 28, 2019
    Applicant: Intel IP Corporation
    Inventors: Sanka Ganesan, Thorsten Meyer, Gerald Ofner
  • Publication number: 20190352256
    Abstract: The present invention discloses compounds of formula (I) that are useful in the treatment of respiratory diseases of animals, especially Bovine or Swine Respiratory disease (BRD and SRD).
    Type: Application
    Filed: December 22, 2017
    Publication date: November 21, 2019
    Applicant: Intervet Inc.
    Inventors: Michael Berger, Thorsten Meyer, Joachim Ullrich, Ralf Warrass
  • Patent number: 10453804
    Abstract: A package is described for a radio frequency die that has a backside conductive plate. One example includes a conductive plate, a semiconductor die having a front side and a back side, the back side being attached to the plate, a radio frequency component attached to the plate, a dielectric filled cavity in the plate adjacent to the radio frequency component, and a redistribution layer attached to the front side of the die for external connection.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: October 22, 2019
    Assignee: Intel Corporation
    Inventors: Telesphor Kamgaing, Thorsten Meyer
  • Patent number: 10447933
    Abstract: A motor vehicle includes a motor vehicle body having an interior forming a passenger compartment. At least one camera is arranged on the outside of the motor vehicle body for imaging an area to the side and behind of the motor vehicle. In the interior of the motor vehicle, particularly in the region of an instrument panel, a monitor or display is arranged in or on an air outlet. The monitor is connected to the camera for continuously displaying the imaged area to occupants, and in particular a driver, in the passenger compartment.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: October 15, 2019
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Matthias Wirth, Martin Schaufler, Jong-Won Kim, Borris Ilse, Boris Jacob, Friedhelm Engler, Michael Richter, Tom Woods, Andrew Bradbury, Ralf Meyer, Frank Leopold, Thorsten Schurna
  • Publication number: 20190304858
    Abstract: A semiconductor package system comprises a semiconductor package and a cap. The semiconductor package comprises a die pad, a chip mounted or arranged to a first main face of the die pad and an encapsulation body encapsulating the chip and the die pad. The cap covers at least partly an exposed second main face of the die pad. The cap comprises a cap body of an electrically insulating and thermally conductive material and a fastening system fastening the cap to the semiconductor package. The fastening system extends from the cap body towards the encapsulation body or along a side surface of the semiconductor package.
    Type: Application
    Filed: March 27, 2019
    Publication date: October 3, 2019
    Applicant: Infineon Technologies AG
    Inventors: Thorsten Scharf, Ralf Otremba, Thomas Bemmerl, Irmgard Escher-Poeppel, Martin Gruber, Michael Juerss, Thorsten Meyer, Xaver Schloegel
  • Patent number: 10394280
    Abstract: Embodiments of wearable electronic devices, components thereof, and related systems and techniques are disclosed herein. For example, a wearable electronic device may include a wearable support structure having a first surface and a second surface; a first electrode located at the first surface, wherein, when the wearable electronic device is worn by a user on a portion of the user's body, the first electrode is arranged to contact the user's skin in the portion of the user's body; a second electrode located at the second surface, wherein, when the wearable electronic device is worn by a user on the portion of the user's body, the second electrode is arranged to not contact the user's skin in the portion of the user's body; and a resistance switch having first and second input terminals coupled to the first and second electrodes, respectively. Other embodiments may be disclosed and/or claimed.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: August 27, 2019
    Assignee: INTEL CORPORATION
    Inventors: Thorsten Meyer, Dirk Plenkers, Hans-Joachim Barth, Bernd Waidhas, Yen Hsiang Chew, Kooi Chi Ooi, Howe Yin Loo
  • Publication number: 20190259688
    Abstract: A package comprising a carrier, at least one electronic chip mounted on one side of the carrier, an encapsulant at least partially encapsulating the at least one electronic chip and partially encapsulating the carrier, and at least one component attached to an opposing other side of the carrier via at least one contact opening.
    Type: Application
    Filed: February 20, 2019
    Publication date: August 22, 2019
    Applicant: Infineon Technologies AG
    Inventors: Thorsten Scharf, Thorsten Meyer