Abstract: Embodiments of the present disclosure are directed towards an integrated circuit (IC) package including a first die at least partially embedded in a first encapsulation layer and a second die at least partially embedded in a second encapsulation layer. The first die may have a first plurality of die-level interconnect structures disposed at a first side of the first encapsulation layer. The IC package may also include a plurality of electrical routing features at least partially embedded in the first encapsulation layer and configured to route electrical signals between a first and second side of the first encapsulation layer. The second side may be disposed opposite to the first side. The second die may have a second plurality of die-level interconnect structures that may be electrically coupled with at least a subset of the plurality of electrical routing features by bonding wires.

Abstract: A radiation source device includes at least one membrane layer, a radiation source structure to emit electromagnetic or infrared radiation, a substrate and a spacer structure, wherein the substrate and the at least one membrane form a chamber, wherein a pressure in the chamber is lower than or equal to a pressure outside of the chamber, and wherein the radiation source structure is arranged between the at least one membrane layer and the substrate.

Abstract: An injectable pharmaceutical composition for treating a bacterial infection in an animal comprising an effective amount of a compound of Formula (I) or salt thereof, and a pharmaceutically acceptable carrier, wherein the injectable pharmaceutical composition is both efficacious and safe.

Abstract: A communications system may include a user equipment (UE) device that communicates with a wireless network. The UE device may transmit a signal to the wireless network identifying a peak data rate of a modem on the UE device, a balanced data rate of the modem, and a buffer size of the modem. The UE device may receive downlink data from the wireless network and may store the downlink data at buffer circuitry on the modem. The UE device may perform delayed processing of the downlink data across slots in a manner that allows for a reduction in size of the modem.

Abstract: The present invention discloses compounds that are useful in the treatment of respiratory diseases of animals, especially Bovine or Swine Respiratory disease (BRD and SRD).

Abstract: A control method of work machine has acquiring operation information related to an operation of an operation portion of a display device for a work machine, causing a display screen Dp1 to be displayed on a display portion of the display device, and causing an operation menu M1 to be displayed at a position corresponding to the operation portion in the display screen Dp1 on the basis of the operation information. The control method of work machine further has changing of the display screen Dp1 on the basis of the operation menu M1 according to an operation of the operation portion in a state where the operation menu M1 is displayed.

Abstract: A control method of work machine includes causing a display screen Dp1 to be displayed on a display portion of a display device for a work machine including a pair of left and right direction indicators, causing a first object Ob1 corresponding to a lighting state of a direction indicator on a right side of the work machine to be displayed on the display screen Dp1, and causing a second object Ob2 corresponding to a lighting state of a direction indicator on a left side of the work machine to be displayed on the display screen Dp1. The first object Ob1 is disposed at a position opposed to a right side edge of a display area of the display portion on the display screen Dp1 with a non-display area therebetween. The second object Ob2 is disposed at a position opposed to a left side edge of a display area of the display portion on the display screen Dp1 with the non-display area therebetween.

Abstract: Described is a camera device (3) for a motor vehicle (1), having: a camera (4) for recording an image, a computing unit (8) for executing a program sequence (12) for providing at least part of a driver assistance function (13, 14, 15) depending on the recorded image, a provisioning unit (11) for providing a temperature of the computing unit (8), and a control unit (10), which is configured to modify the program sequence (12) depending on the provided temperature, the computing unit (8) being configured to execute the modified program sequence (12?).

Abstract: A method of forming a semiconductor package includes providing a metal baseplate having a base section and a plurality of metal posts, the base section being a planar pad of substantially uniform thickness, the plurality of metal posts each extending up from a planar upper surface of the base section, mounting a semiconductor die on the upper surface of the metal baseplate, forming an encapsulant body of electrically insulating mold compound on the upper surface of the base section, electrically connecting terminals of the semiconductor die to the metal posts, and removing the base section so as to form package contacts from the metal posts at a first surface of the encapsulant body.

Abstract: One or more structures and/or methods are provided. In an example of the subject matter presented herein, an apparatus includes a circuit board substrate. A package comprising a semiconductor die and a redistribution layer over the semiconductor die is mounted to the circuit board substrate. A first component is mounted to the redistribution layer over the semiconductor die. A shielding structure is mounted to the circuit board substrate over the package and the first component.

Abstract: The present invention provides compounds of formula (I) for use in the treatment of respiratory diseases of animals, especially Bovine or Swine Respiratory disease (BRD and SRD).

Abstract: A radiation source device includes at least one membrane layer, a radiation source structure to emit electromagnetic or infrared radiation, a substrate and a spacer structure, wherein the substrate and the at least one membrane form a chamber, wherein a pressure in the chamber is lower than or equal to a pressure outside of the chamber, and wherein the radiation source structure is arranged between the at least one membrane layer and the substrate.

Abstract: A semiconductor package is disclosed. In one example, the package includes a non-power chip including a first electrical contact arranged at a first main surface of the non-power chip. The semiconductor package further includes a power chip comprising a second electrical contact arranged at a second main surface of the power chip. A first electrical redistribution layer coupled to the first electrical contact and a second electrical redistribution layer coupled to the second electrical contact. When measured in a first direction vertical to at least one of the first main surface or the second main surface, a maximum thickness of at least a section of the first electrical redistribution layer is smaller than a maximum thickness of the second electrical redistribution layer.

Abstract: A method of manufacturing a semiconductor body includes forming a pattern at a first side of a substrate, forming a semiconductor layer on the first side of the substrate, attaching the substrate and the semiconductor layer to a carrier via a surface of the semiconductor layer, and removing the substrate from a second side opposite to the first side.

Abstract: A semiconductor device includes a semiconductor die having an active main surface and an opposite main surface opposite the active main surface. The semiconductor device further includes an antenna arranged on the active main surface of the semiconductor die and a recess arranged on the opposite main surface of the semiconductor die. The recess is arranged over the antenna.

Abstract: A modular industrial electrical connector is provided having a holding frame; at least two electrical connector modules which can be inserted into the holding frame; a data diode module which is designed for communication with the at least two electrical connector modules; wherein, for at least one of the two electrical connector modules, unidirectional data transfer can be established by the data diode module. REPLY BLOCKING is carried out in that data are sent from an electrical connector module to an electrical device via the data diode module, wherein data are sent back from an electrical device to the data diode module and are blocked by the data diode module, and/or CONTROL BLOCKING is carried out in that data are transmitted from an electrical device to the data diode module and are forwarded by the data diode module to an electrical connector module, wherein data are sent back from the electrical connector module to the data diode module and are blocked by the data diode module.

Abstract: The present invention discloses compounds that are useful in the treatment of respiratory diseases of animals, especially Bovine or Swine Respiratory disease (BRD and SRD).

Abstract: A method for fabricating a semiconductor package includes: providing a die carrier; disposing a semiconductor die on the die carrier, the semiconductor die having one or more contact pads on a first main face thereof; applying an encapsulant at least partially to the semiconductor die, the encapsulant embedding at least one electrical connector, the electrical connector being connected with a contact pad or with the die carrier and extending to a main face of the encapsulant; and depositing at least one electrical layer onto the main face of the encapsulant and an exposed end of the at least one electrical connector.

Abstract: A method of fabricating a semiconductor device package includes: providing a die carrier; disposing at least one semiconductor die on the die carrier, the semiconductor die comprising at least one contact pad on a main face remote from the carrier; electrically connecting the semiconductor die or another electrical device with an electrical connector; applying an encapsulant above the semiconductor die, the die carrier, and the electrical connector; and screwing a metallic drilling screw through the encapsulant so that an end of the drilling screw contacts the electrical connector.

Abstract: A substrate arrangement includes: a first metallization layer, nanowires arranged on a surface of the first metallization layer; and a component arranged on the first metallization layer such that a first subset of the nanowires is arranged between the first metallization layer and the component. The nanowires are evenly distributed over a section of the surface area or over the entire surface area of the first metallization layer. Each nanowire includes first and second ends. The first end of each nanowire is inseparably connected to the surface of the first metallization layer. The second end of each nanowire of the first subset is inseparably connected to a surface of one of the component such that the first subset of nanowires forms a permanent connection between the first metallization layer and the component. There are fewer nanowires in the first subset of nanowires than there are total nanowires.