Abstract: A semiconductor device includes a carrier comprising a recess, a semiconductor die disposed in the recess, and a parylene coating covering at least portions of the surfaces of the semiconductor die and the carrier.

Abstract: A molded semiconductor package includes a lead frame having one or more first leads monolithically formed with a die pad and extending outward from the pad in a first direction. A semiconductor die is attached to the die pad at a first side of the die. A metal clip of a clip frame is attached to a power terminal at a second side of the die. One or more second leads monolithically formed with the metal clip extend outward from the clip in a second direction different than the first direction. A mold compound embeds the die. The first lead(s) and the second lead(s) are exposed at different sides of the mold compound and do not vertically overlap with one another. Within the mold compound, the clip transitions from a first level above the power terminal to a second level in a same plane as the leads.

Abstract: A plug-in connector module for a modular industrial plug-in connector is provided, wherein the plug-in connector module has a housing with a housing surface, wherein the housing consists substantially of plastic, wherein the plug-in connector module has at least one electrical contact element, wherein the housing has at least one contact chamber with a contact chamber surface, wherein the at least one electrical contact element is arranged in the contact chamber, wherein at least a portion of the contact chamber surface and/or at least a portion of the housing surface are/is plasma-modified. A method for producing a plug-in connector module of an industrial plug-in connector is also provided and includes: producing a plastics housing with a housing surface and at least one contact chamber for receiving a contact element, modifying at least a portion of the housing surface and/or at least a portion of the contact chamber surface with an atmospheric pressure plasma with a working gas being fed in.

Abstract: A modular industrial electrical connector is provided having a holding frame; at least two electrical connector modules which can be inserted into the holding frame; a data diode module which is designed for communication with the at least two electrical connector modules; wherein, for at least one of the two electrical connector modules, unidirectional data transfer can be established by the data diode module. REPLY BLOCKING is carried out in that data are sent from an electrical connector module to an electrical device via the data diode module, wherein data are sent back from an electrical device to the data diode module and are blocked by the data diode module, and/or CONTROL BLOCKING is carried out in that data are transmitted from an electrical device to the data diode module and are forwarded by the data diode module to an electrical connector module, wherein data are sent back from the electrical connector module to the data diode module and are blocked by the data diode module.

Abstract: A semiconductor chip package includes a semiconductor transistor chip having a first side and a second side opposite the first side. The first side includes first load current chip pads and second load current chip pads. An interconnect substrate includes a first metal layer, a second metal layer, and an insulating material disposed between the first metal layer and the second metal layer. The first metal layer includes a pattern of holes, the second metal layer includes a pattern of protrusions, and the protrusions pass through the holes. The semiconductor transistor chip is mounted on the interconnect substrate with the first side facing the interconnect substrate. The first metal layer is connected to a plurality of the first load current chip pads and the second metal layer is connected via the pattern of protrusions to a plurality of the second load current chip pads.

Abstract: A method of producing a clip or lead frame includes: performing a first etching process during which first regions of a metal sheet are not masked and etched to a first depth from a first surface of the metal sheet; and after the first etching process, performing a second etching process during which second regions of the metal sheet are not masked and etched to a second depth from the first surface of the metal sheet, wherein the first regions are not masked during the second etching process such that the first regions are etched to a cumulative depth that corresponds to the first depth plus the second depth, wherein the first regions and the second regions delimit clip or lead frame features. Semiconductor packages that use the clip or lead frame and methods of producing such semiconductor packages are also described.

Abstract: Camera (3, 103, 203) for a vehicle (1), which camera is designed: to be mounted at least partially inside an A-pillar (7, 107, 207) of the vehicle (1), to record image data for an area in front of the vehicle (1), and to be arranged in the A-pillar (7, 107, 207) in such a way that a space (24, 124, 224) taken up by the camera (3, 103, 203) inside the A-pillar (7, 107, 207) has a smaller maximum dimension (A1, A3, A5) parallel to a line of sight (14, 114, 228) of the camera (3, 103, 203) than its maximum dimension (A2, A4, A6) parallel to a longitudinal direction (L) of the A-pillar (7, 107, 207).

Abstract: A method of fabricating a semiconductor device package includes: providing a die carrier; disposing at least one semiconductor die on the die carrier, the semiconductor die comprising at least one contact pad on a main face remote from the carrier; electrically connecting the semiconductor die or another electrical device with an electrical connector; applying an encapsulant above the semiconductor die, the die carrier, and the electrical connector; and screwing a metallic drilling screw through the encapsulant so that an end of the drilling screw contacts the electrical connector.

Abstract: The application relates to a one-time programmable (otp) cell, including a selector device with a channel region, an otp capacitor with an otp capacitor dielectric associated with the selector device, and an isolation dielectric having an isolation dielectric thickness. The otp capacitor dielectric includes a first dielectric in a first area and a second dielectric in a second area. The second dielectric has a second thickness which is smaller than the isolation dielectric thickness. The first dielectric has a first thickness which is smaller than the second thickness. The first area is embedded into the second area.

Abstract: Embodiments of the present disclosure are directed towards an integrated circuit (IC) package including a first die at least partially embedded in a first encapsulation layer and a second die at least partially embedded in a second encapsulation layer. The first die may have a first plurality of die-level interconnect structures disposed at a first side of the first encapsulation layer. The IC package may also include a plurality of electrical routing features at least partially embedded in the first encapsulation layer and configured to route electrical signals between a first and second side of the first encapsulation layer. The second side may be disposed opposite to the first side. The second die may have a second plurality of die-level interconnect structures that may be electrically coupled with at least a subset of the plurality of electrical routing features by bonding wires.

Abstract: Embodiments of the present disclosure are directed towards an integrated circuit (IC) package including a first die at least partially embedded in a first encapsulation layer and a second die at least partially embedded in a second encapsulation layer. The first die may have a first plurality of die-level interconnect structures disposed at a first side of the first encapsulation layer. The IC package may also include a plurality of electrical routing features at least partially embedded in the first encapsulation layer and configured to route electrical signals between a first and second side of the first encapsulation layer. The second side may be disposed opposite to the first side. The second die may have a second plurality of die-level interconnect structures that may be electrically coupled with at least a subset of the plurality of electrical routing features by bonding wires.

Abstract: A radiation source device includes at least one membrane layer, a radiation source structure to emit electromagnetic or infrared radiation, a substrate and a spacer structure, wherein the substrate and the at least one membrane form a chamber, wherein a pressure in the chamber is lower than or equal to a pressure outside of the chamber, and wherein the radiation source structure is arranged between the at least one membrane layer and the substrate.

Abstract: An injectable pharmaceutical composition for treating a bacterial infection in an animal comprising an effective amount of a compound of Formula (I) or salt thereof, and a pharmaceutically acceptable carrier, wherein the injectable pharmaceutical composition is both efficacious and safe.

Abstract: The present invention discloses compounds that are useful in the treatment of respiratory diseases of animals, especially Bovine or Swine Respiratory disease (BRD and SRD).

Abstract: A control method of work machine includes causing a display screen Dp1 to be displayed on a display portion of a display device for a work machine including a pair of left and right direction indicators, causing a first object Ob1 corresponding to a lighting state of a direction indicator on a right side of the work machine to be displayed on the display screen Dp1, and causing a second object Ob2 corresponding to a lighting state of a direction indicator on a left side of the work machine to be displayed on the display screen Dp1. The first object Ob1 is disposed at a position opposed to a right side edge of a display area of the display portion on the display screen Dp1 with a non-display area therebetween. The second object Ob2 is disposed at a position opposed to a left side edge of a display area of the display portion on the display screen Dp1 with the non-display area therebetween.

Abstract: A control method of work machine has acquiring operation information related to an operation of an operation portion of a display device for a work machine, causing a display screen Dp1 to be displayed on a display portion of the display device, and causing an operation menu M1 to be displayed at a position corresponding to the operation portion in the display screen Dp1 on the basis of the operation information. The control method of work machine further has changing of the display screen Dp1 on the basis of the operation menu M1 according to an operation of the operation portion in a state where the operation menu M1 is displayed.

Abstract: Described is a camera device (3) for a motor vehicle (1), having: a camera (4) for recording an image, a computing unit (8) for executing a program sequence (12) for providing at least part of a driver assistance function (13, 14, 15) depending on the recorded image, a provisioning unit (11) for providing a temperature of the computing unit (8), and a control unit (10), which is configured to modify the program sequence (12) depending on the provided temperature, the computing unit (8) being configured to execute the modified program sequence (12?).

Abstract: A method of forming a semiconductor package includes providing a metal baseplate having a base section and a plurality of metal posts, the base section being a planar pad of substantially uniform thickness, the plurality of metal posts each extending up from a planar upper surface of the base section, mounting a semiconductor die on the upper surface of the metal baseplate, forming an encapsulant body of electrically insulating mold compound on the upper surface of the base section, electrically connecting terminals of the semiconductor die to the metal posts, and removing the base section so as to form package contacts from the metal posts at a first surface of the encapsulant body.

Abstract: One or more structures and/or methods are provided. In an example of the subject matter presented herein, an apparatus includes a circuit board substrate. A package comprising a semiconductor die and a redistribution layer over the semiconductor die is mounted to the circuit board substrate. A first component is mounted to the redistribution layer over the semiconductor die. A shielding structure is mounted to the circuit board substrate over the package and the first component.

Abstract: A radiation source device includes at least one membrane layer, a radiation source structure to emit electromagnetic or infrared radiation, a substrate and a spacer structure, wherein the substrate and the at least one membrane form a chamber, wherein a pressure in the chamber is lower than or equal to a pressure outside of the chamber, and wherein the radiation source structure is arranged between the at least one membrane layer and the substrate.