Patents by Inventor Thorsten Meyer

Thorsten Meyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220196781
    Abstract: The embodiments herein relate to method performed by a radio network node, a network node, a method performed by a UE, a UE, a method performed by a location server and a location server. The method performed by the network node includes: transmitting at least one signal to other network nodes; detecting signals transmitted from said other network nodes; measuring the signal strength of each received signal; transforming said measured signal strengths into a reference point or into measurement data; and transferring or transmitting the reference point or the measurement data to a location entity or a location node or a location server in the network.
    Type: Application
    Filed: February 13, 2020
    Publication date: June 23, 2022
    Applicant: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventors: Steffen Meyer, Thorsten Vaupel, Mohammad Alawieh, Bastian Perner, JÜrgen Hupp
  • Publication number: 20220177675
    Abstract: The invention relates to a composition comprising an organic polymer, and a silyl functional compound comprising a N—Si bond.
    Type: Application
    Filed: April 15, 2020
    Publication date: June 9, 2022
    Inventors: Thorsten KRÖLLER, Alessa MEYER, Majdi AL-MASRI, Frederik PIESTERT, Carl-Eric WILEN, Melanie AUBERT, Teija TIRRI, Timo ÄÄRITALO
  • Publication number: 20220177674
    Abstract: The invention relates to the use of a silyl functional compound b), which silyl functional compound comprises a N—O—Si bond, for improving the flame retardant properties of a composition comprising an organic polymer a), which is one of a thermoplastic polymer or a thermoset polymer or a mixture thereof.
    Type: Application
    Filed: April 15, 2020
    Publication date: June 9, 2022
    Inventors: Thorsten KRÖLLER, Alessa MEYER, Majdi AL-MASRI, Frederik PIESTERT, Carl-Eric WILEN, Melanie AUBERT, Teija TIRRI, Timo ÄÄRITALO
  • Publication number: 20220165687
    Abstract: A package is disclosed. In one example, the package comprises a carrier, an electronic component mounted on the carrier, an encapsulant encapsulating at least part of the electronic component and at least part of the carrier and having a bottom side at a first vertical level. At least one lead is electrically coupled with the electronic component and comprising a first lead portion being encapsulated in the encapsulant and a second lead portion extending out of the encapsulant at the bottom side of the encapsulant. A functional structure at the bottom side extends up to a second vertical level different from the first vertical level.
    Type: Application
    Filed: October 15, 2021
    Publication date: May 26, 2022
    Applicant: Infineon Technologies AG
    Inventors: Thorsten MEYER, Thomas BEMMERL, Martin GRUBER, Martin Richard NIESSNER
  • Publication number: 20220157774
    Abstract: A semiconductor package is disclosed. In one example, the package includes a non-power chip including a first electrical contact arranged at a first main surface of the non-power chip. The semiconductor package further includes a power chip comprising a second electrical contact arranged at a second main surface of the power chip. A first electrical redistribution layer coupled to the first electrical contact and a second electrical redistribution layer coupled to the second electrical contact. When measured in a first direction vertical to at least one of the first main surface or the second main surface, a maximum thickness of at least a section of the first electrical redistribution layer is smaller than a maximum thickness of the second electrical redistribution layer.
    Type: Application
    Filed: October 15, 2021
    Publication date: May 19, 2022
    Applicant: Infineon Technologies AG
    Inventors: Thorsten MEYER, Martin GRUBER, Thorsten SCHARF
  • Publication number: 20220122756
    Abstract: Embodiments of the invention include a microelectronic device and methods of forming a microelectronic device. In an embodiment the microelectronic device includes a semiconductor die and an inductor that is electrically coupled to the semiconductor die. The inductor may include one or more conductive coils that extend away from a surface of the semiconductor die. In an embodiment each conductive coils may include a plurality of traces. For example, a first trace and a third trace may be formed over a first dielectric layer and a second trace may be formed over a second dielectric layer and over a core. A first via through the second dielectric layer may couple the first trace to the second trace, and a second via through the second dielectric layer may couple the second trace to the third trace.
    Type: Application
    Filed: December 30, 2021
    Publication date: April 21, 2022
    Inventors: Andreas WOLTER, Thorsten MEYER, Gerhard KNOBLINGER
  • Patent number: 11302668
    Abstract: A method of producing packaged semiconductor devices includes providing a first packaging substrate panel, providing a second packaging substrate panel, and moving the first and second packaging substrate panels through an assembly line that comprises a plurality of package assembly tools using a control mechanism. First type packaged semiconductor devices are formed on the first packaging substrate panel and second type packaged semiconductor devices are formed on the second packaging substrate panel. The control mechanism moves both of the first and packaging substrate panels through the assembly line in a non-linear manner. The first and second packaged semiconductor devices differ with respect to at least one of: lead configuration, and encapsulant configuration.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: April 12, 2022
    Assignee: Infineon Technologies AG
    Inventors: Thorsten Meyer, Gerald Ofner, Stephan Bradl, Stefan Miethaner, Alexander Heinrich, Horst Theuss, Peter Scherl
  • Patent number: 11264356
    Abstract: A method of manufacturing packages is disclosed. In one example, the method comprises providing an electrically conductive sheet being continuous at least in a mounting region, mounting first main surfaces of a plurality of electronic components on the continuous mounting region of the sheet and forming interconnect structures for electrically coupling second main surfaces of the electronic components with the sheet. The second main surfaces oppose the first main surfaces. After the forming, structuring the sheet.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: March 1, 2022
    Assignee: Infineon Technologies AG
    Inventors: Thorsten Meyer, Thomas Behrens, Andreas Grassmann, Martin Gruber, Thorsten Scharf
  • Patent number: 11250981
    Abstract: Embodiments of the invention include a microelectronic device and methods of forming a microelectronic device. In an embodiment the microelectronic device includes a semiconductor die and an inductor that is electrically coupled to the semiconductor die. The inductor may include one or more conductive coils that extend away from a surface of the semiconductor die. In an embodiment each conductive coils may include a plurality of traces. For example, a first trace and a third trace may be formed over a first dielectric layer and a second trace may be formed over a second dielectric layer and over a core. A first via through the second dielectric layer may couple the first trace to the second trace, and a second via through the second dielectric layer may couple the second trace to the third trace.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: February 15, 2022
    Assignee: Intel Corporation
    Inventors: Andreas Wolter, Thorsten Meyer, Gerhard Knoblinger
  • Publication number: 20220041547
    Abstract: The present invention discloses compounds that are useful in the treatment of respiratory diseases of animals, especially Bovine or Swine Respiratory disease (BRD and SRD).
    Type: Application
    Filed: May 10, 2021
    Publication date: February 10, 2022
    Applicant: Intervet Inc.
    Inventors: Michael Berger, Thorsten Meyer, Joachim Ullrich, Ralf Warrass
  • Publication number: 20220005755
    Abstract: The semiconductor device package comprises a die carrier, at least one semiconductor die disposed on the carrier, the semiconductor die comprising at least one contact pad on a main face remote from the carrier, an encapsulant disposed above the semiconductor die, an electrical connector electrically connected with the contact pad, a drilling screw screwed through the encapsulant and connected with the electrical connector.
    Type: Application
    Filed: June 28, 2021
    Publication date: January 6, 2022
    Inventors: Thorsten Scharf, Thomas Bemmerl, Martin Gruber, Thorsten Meyer, Frank Singer
  • Publication number: 20210347730
    Abstract: The present invention provides compounds of formula (I) for use in the treatment of respiratory diseases of animals, especially Bovine or Swine Respiratory disease (BRD and SRD).
    Type: Application
    Filed: June 24, 2019
    Publication date: November 11, 2021
    Applicant: Intervet Inc.
    Inventors: Thorsten Meyer, Michael Berger, Ralf Warrass, Joachim Ullrich
  • Patent number: 11171066
    Abstract: A method for manufacturing a semiconductor panel is disclosed. In one example, the method includes providing a first preformed polymer form. The method further includes arranging multiple semiconductor chips over the first preformed polymer form. The method further includes attaching a second preformed polymer form to the first preformed polymer form, wherein the semiconductor chips are arranged between the attached preformed polymer forms, and wherein the attached preformed polymer forms form the semiconductor panel encapsulating the semiconductor chips.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: November 9, 2021
    Assignee: Infineon Technologies AG
    Inventors: Thorsten Meyer, Andreas Grassmann
  • Publication number: 20210325445
    Abstract: The disclosure describes to techniques for detecting field failures or performance degradation of circuits, including integrated circuits (IC), by including additional contacts, i.e. terminals, along with the functional contacts that used for connecting the circuit to a system in which the circuit is a part. These additional contacts may be used to measure dynamic changing electrical characteristics over time e.g. voltage, current, temperature and impedance. These electrical characteristics may be representative of a certain failure mode and may be an indicator for circuit state-of-health (SOH), while the circuit is performing in the field.
    Type: Application
    Filed: April 15, 2020
    Publication date: October 21, 2021
    Inventors: Irmgard Escher-Poeppel, Thorsten Meyer, Gerhard Poeppel
  • Publication number: 20210292284
    Abstract: The present invention discloses compounds that are useful in the treatment of respiratory diseases of animals, especially Bovine or Swine Respiratory disease (BRD and SRD)
    Type: Application
    Filed: June 24, 2019
    Publication date: September 23, 2021
    Applicant: Intervet Inc.
    Inventors: Thorsten Meyer, Michael Berger, Ralf Warrass, Joachim Ullrich
  • Patent number: 11081455
    Abstract: A semiconductor device includes a semiconductor die having a main surface, a rear surface, outer edge sides extending between the main and rear surfaces, and a first conductive bond pad disposed on the main surface, an electrically insulating mold compound body formed around the outer edge sides of the semiconductor die with the main surface of the semiconductor die exposed from an upper surface of the mold compound body, a first metallization layer formed on the upper surface of the mold compound body and on the main surface of the semiconductor die, and a first bond pad extension formed in the first metallization layer. The first bond pad extension overlaps with the upper surface of the mold compound body. The first bond pad extension is conductively connected with the first conductive bond pad. The first bond pad extension is an externally accessible point of electrical contact of the device.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: August 3, 2021
    Assignee: Infineon Technologies Austria AG
    Inventors: Chan Lam Cha, Wei Han Koo, Thorsten Meyer, Klaus Schiess, Guan Choon Matthew Nelson Tee
  • Patent number: 11034650
    Abstract: The present invention discloses compounds of formula (I) that are useful in the treatment of respiratory diseases of animals, especially Bovine or Swine Respiratory disease (BRD and SRD).
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: June 15, 2021
    Assignee: Intervet Inc.
    Inventors: Michael Berger, Thorsten Meyer, Joachim Ullrich, Ralf Warrass
  • Publication number: 20210167036
    Abstract: A semiconductor device includes a semiconductor die, an electrical contact arranged on a surface of the semiconductor die, and a metal layer arranged on the electrical contact, wherein the metal layer includes a singulated part of at least one of a metal foil, a metal sheet, a metal leadframe, or a metal plate. When viewed in a direction perpendicular to the surface of the semiconductor die, a footprint of the electrical contact and a footprint of the metal layer are substantially congruent.
    Type: Application
    Filed: November 23, 2020
    Publication date: June 3, 2021
    Applicant: Infineon Technologies AG
    Inventors: Oliver HELLMUND, Barbara EICHINGER, Thorsten MEYER, Ingo MURI
  • Publication number: 20210166998
    Abstract: A molded semiconductor package includes a lead frame having one or more first leads monolithically formed with a die pad and extending outward from the pad in a first direction. A semiconductor die is attached to the die pad at a first side of the die. A metal clip of a clip frame is attached to a power terminal at a second side of the die. One or more second leads monolithically formed with the metal clip extend outward from the clip in a second direction different than the first direction. A mold compound embeds the die. The first lead(s) and the second lead(s) are exposed at different sides of the mold compound and do not vertically overlap with one another. Within the mold compound, the clip transitions from a first level above the power terminal to a second level in a same plane as the leads.
    Type: Application
    Filed: February 16, 2021
    Publication date: June 3, 2021
    Inventors: Thorsten Scharf, Martin Gruber, Josef Hoeglauer, Michael Juerss, Josef Maerz, Thorsten Meyer, Bun Kian Tay
  • Publication number: 20210111108
    Abstract: A package is disclosed. In one example, the package comprises a substrate having at least one first recess on a front side and at least one second recess on a back side, wherein the substrate is separated into a plurality of separate substrate sections by the at least one first recess and the at least one second recess, an electronic component mounted on the front side of the substrate, and a single encapsulant filling at least part of the at least one first recess and at least part of the at least one second recess. The encapsulant fully circumferentially surrounds sidewalls of at least one of the substrate sections.
    Type: Application
    Filed: October 14, 2020
    Publication date: April 15, 2021
    Applicant: Infineon Technologies AG
    Inventors: Frank Singer, Martin Gruber, Thorsten Meyer, Thorsten Scharf, Peter Strobel, Stefan Woetzel