Abstract: This semiconductor device comprises: a plurality of power modules, each having a semiconductor element; a plurality of heat dissipation bases that are disposed via heat dissipation members on a heat dissipation surface side of the plurality of power modules, and that each have a heat dissipation fin; a frame having a plurality of openings; and a cover that covers the heat dissipation bases and the frame so as to form a refrigerant flow passage. The plurality of heat dissipation bases respectively close the plurality of openings. The cover has an elastic biasing part on a surface which contacts the heat dissipation fins. The heat dissipation bases are biased, by pressurization, toward the power modules.

Abstract: A power semiconductor device according to the present invention is provided with: a first circuit body constituting an upper arm of an inverter circuit for converting a DC current into an AC current; a second circuit body constituting a lower arm of the inverter circuit; and a circuit board that has therein a through-hole in which the first circuit body and the second circuit body are disposed and that has an intermediate board between the first circuit body and the second circuit body. The intermediate board has an AC wiring pattern for transmitting the AC current, and the first circuit body and the second circuit body are connected to the AC wiring pattern so as to be in surface contact with the AC wiring pattern.

Abstract: A semiconductor cooling device includes a plurality of semiconductor modules, a plurality of first refrigerant flow paths provided corresponding to the semiconductor modules, and a pair of flow path pipes connected to the plurality of first refrigerant flow paths. The plurality of semiconductor modules are arranged on a substrate side by side in a first direction so as to face the plurality of first refrigerant flow paths, respectively. Each of the pair of flow path pipes extends along the first direction. In each of the plurality of semiconductor modules, a heat dissipation surface in contact with each of the plurality of first refrigerant flow paths is disposed in an intersecting direction with respect to an extending direction of the first refrigerant flow paths and an arrangement direction of the plurality of semiconductor modules. The first refrigerant flow path includes a deformable portion that is deformable in the intersecting direction.

Abstract: The present invention discloses an ejection deployment and retrieval mechanism for a tethered satellite with repeatable unlocking and locking and a working method thereof, the present invention includes a separation ejection docking assembly and a sub-satellite; the separation ejection docking assembly includes an ejection sleeve, a locking mechanism, and a sub-satellite connector, the ejection sleeve adopts a two-stage internal-external sliding connection and provides initial kinetic energy to the sub-satellite by compressing a spring; the locking mechanism is mounted inside the ejection sleeve, one end of the sub-satellite connector is connected to the sub-satellite, and another end of the sub-satellite connector is slidably engaged with the locking mechanism to complete the locking/unlocking operations of the sub-satellite.

Abstract: A power semiconductor device according to the present invention is provided with a conductive section, a circuit component, a substrate that supports the conductive section and the circuit component, and a sealing member, wherein the sealing member forms a first flow path, and the first flow path has a first region thermally connected to a power circuit and a second region thermally connected to the circuit component.

Abstract: A power conversion device is provided with: a semiconductor device, two heat spreaders, and an external terminal; a circuit board having a first insulating layer; and a cooler. The circuit board has: a recessed section for the semiconductor device; a first conductor layer that forms a bottom surface of the recessed section; and a second conductor layer that is disposed in a layer different from the first conductor layer and which is exposed in the recessed section. One of the heat spreaders is in contact with the bottom surface of the recessed section and is bonded to the first conductor layer with a first metal bonding material. The external terminal is bonded to the second conductor layer with a second metal bonding material. The cooler is in press contact with the other of the heat spreaders with a second insulating layer different from the first insulating layer interposed therebetween.

Abstract: A power semiconductor device according to the present invention is provided with: a first circuit body constituting an upper arm of an inverter circuit for converting a DC current into an AC current; a second circuit body constituting a lower arm of the inverter circuit; and a circuit board that has therein a through-hole in which the first circuit body and the second circuit body are disposed and that has an intermediate board between the first circuit body and the second circuit body. The intermediate board has an AC wiring pattern for transmitting the AC current, and the first circuit body and the second circuit body are connected to the AC wiring pattern so as to be in surface contact with the AC wiring pattern.

Abstract: A power semiconductor device according to the present invention is provided with a conductive section, a circuit component, a substrate that supports the conductive section and the circuit component, and a sealing member, wherein the sealing member forms a first flow path, and the first flow path has a first region thermally connected to a power circuit and a second region thermally connected to the circuit component.

Abstract: A door lock has an inner door assembly, an indoor doorknob assembly, and an outdoor doorknob assembly. The inner door assembly has a locking assembly casing. The indoor doorknob assembly has a positioning resilient component located in the locking assembly casing and configured to switch the door lock between a locked state and an unlocked state. The door is provided with enhanced protection by enclosing the positioning resilient component in the locking assembly casing, so the safety is further improved.

Abstract: A door lock has an inner door assembly, an indoor doorknob assembly, and an outdoor doorknob assembly. The inner door assembly has a locking assembly casing. The indoor doorknob assembly has a positioning resilient component located in the locking assembly casing and configured to switch the door lock between a locked state and an unlocked state. The door is provided with enhanced protection by enclosing the positioning resilient component in the locking assembly casing, so the safety is further improved.

Abstract: A low-power-consumption actuator for battery-powered electronic lock includes assembled first and second cases, the second case being provided at a top with a through bore; a piezoceramic/steel sheet assembly consisting of superposed first and second piezoceramic/steel sheet sets, a first end portion of the second piezoceramic/steel sheet set being in a free state; a circuit board electrically connected to the piezoceramic/steel sheet assembly; and a pin unit being located between a top of the first end portion of the second piezoceramic/steel sheet set and the through bore. When the circuit board applies a voltage across the piezoceramic/steel sheet assembly, the first end portion of the second piezoceramic/steel sheet set upward flexes and thereby displaces to push against the pin unit for a pin thereof to protrude from the through bore and interfere with a latch bolt of the electronic lock, so as to actuate the latch bolt.

Abstract: A memory device comprises a memory cell and a sense amplifier which has a sensing interval. An output circuit is coupled to the sense amplifier and responsive to a clock signal to accept the signal from the sense amplifier. A first source of timing signals generates a first timing signal in response to an enable signal which is asynchronous relative to the clock signal. A second source of timing signals generates a second timing signal based on the clock signal. A switch selects one of the first and second timing signals at the timing signals for use to define pre-charge and sensing intervals for the sense amplifier. The first source of timing signals is selected during an interval of time corresponding to a clock latency, so that the timing signals define a sensing interval where transitions in the clock signal are outside of the sensing interval.