Abstract: An electronic device enclosure includes a panel, a basic frame, a first frame, a second frame, and a sleeve. Both the first frame and the second frame are located between the panel and the basic frame. An inner space is defined by the panel, the basic frame, the first frame, and the second frame. A first inlet is surrounded by the panel, the first frame, and the basic frame and a second inlet is surrounded by the panel, the second frame, and the basic frame. Both the first inlet and second inlet communicate with the inner space. The sleeve covers outside the first frame and the second frame to shield the first inlet and the second inlet.

Abstract: The present invention provides capacitive touch panel, and display device. The capacitive touch panel of the present invention comprises at least one column of electrode set, the electrode set comprising a plurality of electrode units sequentially arranged, and adjacent electrode units complementarily matching each other, wherein each electrode unit comprises first touch electrode, second touch electrode and third touch electrode, the first, second and third touch electrodes complementarily match each other, and the first touch electrode is used for keeping patterns of the second touch electrode and the third touch electrode included in the same electrode unit from contacting with each other, the second touch electrode is used for keeping pattern of the electrode unit from contacting with pattern of immediately previous electrode unit, and the third touch electrode is used for keeping the pattern of the electrode unit from contacting with pattern of immediately next electrode unit.

Abstract: A heat dissipation substrate comprises a substrate material and a heat conductive liquid. The substrate material comprises a plurality of holes and the heat conductive liquid is permeated into the holes. The thermal expansion coefficient of the heat conductive liquid is larger than that of the substrate material. A heat dissipation substrate manufacturing method comprises steps of mixing a sinter powder and an adhesive to form a substrate material; placing the substrate material into a furnace to perform a sintering process in order to form a plurality of holes in the substrate material; and permeating a heat conductive liquid into the holes.

Abstract: According to one embodiment of the present invention, a computer-implemented method of performing analytics on a large quantity of data accommodated by an external mass storage device is provided. The analytics may be divided into a set of modules, wherein each module is selectively executed and comprises a script for a parallel processing engine to perform a corresponding atomic operation on the analytics. A user selection is received of one or more modules to perform desired analytics on the large quantity of data from the external mass storage device, and the selected modules execute scripts for the parallel processing engine to perform the corresponding atomic operations of the desired analytics.

Abstract: According to one embodiment of the present invention, a computer-implemented method of performing analytics on a large quantity of data accommodated by an external mass storage device is provided. The analytics may be divided into a set of modules, wherein each module is selectively executed and comprises a script for a parallel processing engine to perform a corresponding atomic operation on the analytics. A user selection is received of one or more modules to perform desired analytics on the large quantity of data from the external mass storage device, and the selected modules execute scripts for the parallel processing engine to perform the corresponding atomic operations of the desired analytics.

Abstract: The present invention provides capacitive touch panel, and display device. The capacitive touch panel of the present invention comprises at least one column of electrode set, the electrode set comprising a plurality of electrode units sequentially arranged, and adjacent electrode units complementarily matching each other, wherein each electrode unit comprises first touch electrode, second touch electrode and third touch electrode, the first, second and third touch electrodes complementarily match each other, and the first touch electrode is used for keeping patterns of the second touch electrode and the third touch electrode included in the same electrode unit from contacting with each other, the second touch electrode is used for keeping pattern of the electrode unit from contacting with pattern of immediately previous electrode unit, and the third touch electrode is used for keeping the pattern of the electrode unit from contacting with pattern of immediately next electrode unit.

Abstract: Embodiments of the present invention disclose a capacitive touch panel and a display device. The capacitive touch panel comprises an array substrate, an opposing substrate arranged opposite to the array substrate, and a liquid crystal layer disposed between the opposing substrate and the array substrate, wherein shielding electrodes, touch drive electrodes and touch sensing electrodes are disposed on one side of the opposing substrate away from the liquid crystal layer; the touch drive electrodes, the touch sensing electrodes and the shielding electrodes are insulated from one another; the touch drive electrodes and the touch sensing electrodes are arranged to intersect with each other; and orthographic projections of the shielding electrodes on the opposing substrate fall into gaps of orthographic projections formed by the touch drive electrodes and the touch sensing electrodes arranged to intersect with each other on the opposing substrate.

Abstract: The present disclosure relates to the field of display technology and discloses a display device and a method for preparing the same. The display device includes a 3D grating and a touch detection unit. The 3D grating includes a base substrate arranged opposite to a display side of display panel, and a grating structure of the 3D grating and the touch detection unit are formed between the base substrate and the display panel.

Abstract: Embodiments of the present invention disclose a capacitive in-cell touch panel and a display device, with a touch sensing structure layer disposed on a side of an opposite substrate opposite to an array substrate, which side faces a liquid crystal layer; the touch sensing structure layer comprises a first touch sensing electrode and a second touch sensing electrode that are disposed in a same layer and mutually insulated; one of the first touch sensing electrode and the second touch sensing electrode is configured to be loaded with touch control scanning signals, and the other of the first touch sensing electrode and the second touch sensing electrode is configured to couple the touch control scanning signals and output. The touch sensing structure layer is provided on the opposite substrate that is away from the array substrate, which can avoid the mutual interference between touch control signals and display signals in the array substrate.

Abstract: A fixing device for connecting an optical film with a back plate is disclosed. The fixing device includes a supporting portion, and a protrusive portion. The supporting portion is for connecting to a sidewall of the back plate. The protrusive portion is for passing through a through hole on an extended portion of the optical film such that the optical film is fixed on the back plate. The extended portion extrudes from a main body of the optical film. The fixing devices relate to a pure mechanical or semi-mechanical connection. Such connection structure may prevent the optical film from falling off due to environment changes. In addition, the fixing devices may be used over and over. Furthermore, the connection structure is more compact than the typical ones. The fixing devices not only satisfy the trend toward narrower sidewall of liquid crystal modules, but also prevent the optical film from being bent due to thermal expansion and contraction.

Abstract: Embodiments are included for methods, systems, and computer program products in which evaluating operations using an electronic computing device are presented including: receiving the operation on a first database partition in a shared nothing parallelism system, where the operation is non-collocated, reference based operation; generating a correlation sequence, where the correlation sequence includes a sequence of references pointing to input data required for the operation; receiving one of the references on a first table queue operator on a second database partition, where the second database partition includes input data corresponding with the received reference, and where the table queue operator is configured for providing communication between the first database partition and the second database partition; and processing the input data on the second database partition corresponding with the operation.

Abstract: The present invention relates to the field of panel display technology, and provides a display device and a manufacturing method thereof. The display device includes a light guide plate; a light-emitting element located on one side of the light guide plate; and a light mixing unit located between the light guide plate and the light-emitting element which unit includes a sealed transparent container and a light mixing substance filled in the container, wherein the light mixing unit enables light from the light-emitting element to be subjected to one or more of scattering, refraction and diffusion. The device and method according to the invention can reduce the light mixing distance of the light-emitting element so as to provide a display with a narrow frame area.

Abstract: The present invention provides an LED light bar and a backlight module using the LED light bar. The LED light bar includes a heat dissipation strip, a PCB mounted on the heat dissipation strip, LED chips mounted on the heat dissipation strip and electrically connected to the PCB, and a thermal interface material layer arranged between the LED chips and the heat dissipation strip. The LED light bar and the backlight module using the LED light bar according to the present invention arrange LED chips to be mounted to a heat dissipation strip that is of bettered thermal conduction performance to thereby avoid the conventional process of transferring terminal energy through a PCB that is of poor heat dissipation. The art is simple and the entire heat dissipation path is shortened to achieve excellent heat dissipation performance and thus ensure the quality of backlighting.

Abstract: Disclosed are a fixing device and a backlight module using the fixing device. The fixing device includes a positioning post, an embedded part, and at least one elastic part. The embedded part is vertically inserted in the positioning post. The at least one elastic part is disposed at one end of the positioning post. The fixing device of the present invention is capable of enhancing the structure and functions to position accurately. Furthermore, the elastic part is capable of decreasing shocks at the fixed position of the fixing device and improving the problem of stress concentration.

Abstract: A power device package for containing, protecting and providing electrical contacts for a power transistor includes a top and bottom lead frames for directly no-bump attaching to the power transistor. The power transistor is attached to the bottom lead frame as a flip-chip with a source contact and a gate contact directly no-bumping attaching to the bottom lead frame. The power transistor has a bottom drain contact attaching to the top lead frame. The top lead frame further includes an extension for providing a bottom drain electrode substantially on a same side with the bottom lead frame. In a preferred embodiment, the power device package further includes a joint layer between device metal of source, gate or drain and top or bottom lead frame, through applying ultrasonic energy.

Abstract: Embodiments are included for methods, systems, and computer program products for evaluating operations in a shared nothing parallelism system using an electronic computing device are presented, the methods and computer program products including: causing the electronic computing device to receive the operation, where the operation is non-collocated, reference based operation, and where the operation is configured for execution on a first partition in the shared nothing parallelism system; causing the electronic computing device to insert a table queue operator on a second partition, where the second partition includes a reference to input data, causing the electronic computing device to place the reference to the input data on the first partition by the table queue operator; and causing the electronic computing device to execute the operation on the reference to the input data on the first partition.

Abstract: A light guide plate fixing structure and a backlight module using the same, comprising a first abutting wall formed at the side edge of the light guide plate, a second abutting wall formed on the backplane, and a constant-force spring arranged between the first abutting wall and the second abutting wall; the constant-force spring has a fixing end and a support end, the fixing end being fixed on the first abutting wall, the support end forming an elastic foot that abuts against the second abutting wall, with the light guide plate being fixed with the help of the elastic force produced by bounce of the constant-force spring after being pre-compressed: when the light guide plate is expanded, it can push the spring away and be released and expanded; when the light guide plate is contracted, rebound of the spring will make the spring move with the light guide plate.

Abstract: A light guide plate fixing structure and a backlight module using the same, comprising a first abutting wall formed at the side edge of the light guide plate, a second abutting wall formed on the backplane, and a constant-force spring arranged between the first abutting wall and the second abutting wall; the constant-force spring has a fixing end and a support end, the fixing end being fixed on the first abutting wall, the support end forming an elastic foot that abuts against the second abutting wall, with the light guide plate being fixed with the help of the elastic force produced by bounce of the constant-force spring after being pre-compressed: when the light guide plate is expanded, it can push the spring away and be released and expanded; when the light guide plate is contracted, rebound of the spring will make the spring move with the light guide plate.

Abstract: A method and apparatus for acquiring a nanostructured coating on a metal surface by using an intense shock wave generated by continuous explosion of a laser-induced plasma is provided. The method comprises: irradiating a laser beam on a black paint surface of an upper opening of a high pressure resistant glass pipe having a black paint strip arranged therein; the black paint absorbing the light energy and producing a plasma; generating an initial plasma explosion shock wave; transmitting the initial plasma explosion shock wave in the high pressure resistant glass pipe; generating a plasma cloud reaching a lower opening of a glass catheter; and, the shock wave pressure outputted embedding nanoparticles into a surface of a workpiece. The apparatus comprises the high pressure-resistant glass pipe with a zigzagging switchback shape or a spiral and inverted cone shape.

Abstract: A fixing device for connecting an optical film with a back plate is disclosed. The fixing device includes a supporting portion, and a protrusive portion. The supporting portion is for connecting to a sidewall of the back plate. The protrusive portion is for passing through a through hole on an extended portion of the optical film such that the optical film is fixed on the back plate. The extended portion extrudes from a main body of the optical film. The fixing devices relate to a pure mechanical or semi-mechanical connection. Such connection structure may prevent the optical film from falling off due to environment changes. In addition, the fixing devices may be used over and over. Furthermore, the connection structure is more compact than the typical ones. The fixing devices not only satisfy the trend toward narrower sidewall of liquid crystal modules, but also prevent the optical film from being bent due to thermal expansion and contraction.