Patents by Inventor Tianchun Ye
Tianchun Ye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11929304Abstract: A semiconductor apparatus with a heat dissipation conduit in a sidewall interconnection structure, a method of manufacturing the semiconductor apparatus, and an electronic device including the semiconductor apparatus. According to the embodiments, the semiconductor apparatus includes: a carrier substrate having a first region and a second region adjacent to each other; a semiconductor device on the first region; and an interconnection structure on the second region, wherein the interconnection structure includes: an electrical isolation layer; a conductive structure in the electrical isolation layer, wherein at least a part of components require to be electrically connected in the semiconductor device is in contact with and therefore electrically connected to the conductive structure in a lateral direction, wherein the conductive structure is located at a corresponding height in the interconnection structure; and a heat dissipation conduit in the electrical isolation layer.Type: GrantFiled: February 8, 2022Date of Patent: March 12, 2024Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCESInventors: Huilong Zhu, Tianchun Ye
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Publication number: 20240038318Abstract: A read-write method includes: sequentially writing, in a first direction, a code word obtained by information-bit encoding into a target memory cell in each layer of memory cell array in the three-dimensional memory; randomly reading the target memory cell in each layer of memory cell array, or sequentially reading the target memory cell in each layer of memory cell array in a second direction; and determining an LLR value of a current target memory cell according to a storage time corresponding to the current target memory cell when reading, a threshold voltage partition corresponding to the current target memory cell when reading, a comprehensive distribution state corresponding to the current target memory cell when reading, and a pre-established LLR table, so as to perform a soft decoding operation on the code word in the current target memory cell based on the LLR value of the current target memory cell.Type: ApplicationFiled: November 25, 2020Publication date: February 1, 2024Inventors: Qi Wang, Yiyang Jiang, Qianhui Li, Zongliang Huo, Tianchun Ye
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Patent number: 11839085Abstract: Provided are a three-dimensional vertical single transistor ferroelectric memory and a manufacturing method thereof. The ferroelectric memory comprises: a substrate; an insulating dielectric layer provided at the substrate; a channel structure extending through the insulating dielectric layer and connected to the substrate, the channel structure having a source/drain region and a channel region connected to the source/drain region; and a gate stack structure arranged around the channel structure and provided in the insulating dielectric layer opposite to the channel region, the gate stack structure comprising a ferroelectric insulation layer and a gate sequentially stacked in a direction away from the channel structure. The ferroelectric memory having the above structure can replace conventional DRAMs. Therefore, the invention realizes a high intensity high speed memory.Type: GrantFiled: November 4, 2019Date of Patent: December 5, 2023Assignee: Institute of Microelectronics, Chinese Academy of SciencesInventors: Huaxiang Yin, Zhaozhao Hou, Tianchun Ye, Chaolei Li
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Patent number: 11594608Abstract: A gate-all-around nanowire device and a method for forming the gate-all-around nanowire device. A first fin and a dielectric layer on the first fin are formed on a substrate. The first fin includes the at least one first epitaxial layer and the at least one second epitaxial layer that are alternately stacked. The dielectric layer exposes a channel region of the first fin. A doping concentration at a lateral surface of the channel region and a doping concentration at a central region of the channel region are different from each other in the at least one second epitaxial layer. After the at least one first epitaxial layer is removed from the channel region, the at least one second epitaxial layer in the channel region serves as at least one nanowire. A gate surrounding the at least one nanowire is formed.Type: GrantFiled: September 5, 2019Date of Patent: February 28, 2023Assignee: Institute of Microelectronics, Chinese Academy of SciencesInventors: Huaxiang Yin, Jiaxin Yao, Qingzhu Zhang, Zhaohao Zhang, Tianchun Ye
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Publication number: 20220254702Abstract: A semiconductor apparatus with a heat dissipation conduit in a sidewall interconnection structure, a method of manufacturing the semiconductor apparatus, and an electronic device including the semiconductor apparatus. According to the embodiments, the semiconductor apparatus includes: a carrier substrate having a first region and a second region adjacent to each other; a semiconductor device on the first region; and an interconnection structure on the second region, wherein the interconnection structure includes: an electrical isolation layer; a conductive structure in the electrical isolation layer, wherein at least a part of components require to be electrically connected in the semiconductor device is in contact with and therefore electrically connected to the conductive structure in a lateral direction, wherein the conductive structure is located at a corresponding height in the interconnection structure; and a heat dissipation conduit in the electrical isolation layer.Type: ApplicationFiled: February 8, 2022Publication date: August 11, 2022Inventors: Huilong ZHU, Tianchun YE
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Patent number: 11411091Abstract: A method for manufacturing a stacked gate-all-around nano-sheet CMOS device, including: providing a substrate with a fin structure, where a channel layer for an NMOS is a sacrificial layer for a PMOS, a channel layer for the PMOS is a sacrificial layer for the NMOS; and mobility of holes in the second material is greater than mobility of holes in the first material; forming a dummy gate stack extending across the fin structure; forming source-or-drain regions in the fin structure at two sides of the dummy gate stack; removing the dummy gate stack and the sacrificial layers covered by the dummy gate stack, to expose a surface of a part of the channel layer that is located between the source-or-drain regions, where a nano-sheet array is formed by the channel layer with the exposed surface; and forming a gate stack structure surrounding each nano sheet in the nano-sheet array.Type: GrantFiled: October 30, 2019Date of Patent: August 9, 2022Inventors: Huaxiang Yin, Tianchun Ye, Qingzhu Zhang, Jiaxin Yao
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Publication number: 20220231144Abstract: A semiconductor structure, a method for manufacturing the semiconductor structure, and a transistor. A doped structure is provided, where the doped structure includes a dopant. A surface of the doped structure is oxidized to form the oxide film. In such case, the dopant at an interface between the oxide film and the doped structure may be redistributed, and thereby a segregated-dopant layer is formed inside or at a surface of the doped structure under the oxide film. A concentration of the dopant is higher in the segregated-dopant layer than in other regions of the doped structure. After the oxide film is removed, the doped structure with a high surface doping concentration can be obtained without an additional doping process. Therefore, after a conducting structure is formed on the segregated-dopant layer, a low contact resistance between the conducting structure and the doped structure is obtained, and a device performance is improved.Type: ApplicationFiled: March 26, 2021Publication date: July 21, 2022Inventors: Jun LUO, Tianchun YE, Dan ZHANG
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Publication number: 20220115513Abstract: A method for manufacturing a stacked gate-all-around nano-sheet CMOS device, including: providing a substrate with a fin structure, where a channel layer for an NMOS is a sacrificial layer for a PMOS, a channel layer for the PMOS is a sacrificial layer for the NMOS; and mobility of holes in the second material is greater than mobility of holes in the first material; forming a dummy gate stack extending across the fin structure; forming source-or-drain regions in the fin structure at two sides of the dummy gate stack; removing the dummy gate stack and the sacrificial layers covered by the dummy gate stack, to expose a surface of a part of the channel layer that is located between the source-or-drain regions, where a nano-sheet array is formed by the channel layer with the exposed surface; and forming a gate stack structure surrounding each nano sheet in the nano-sheet array.Type: ApplicationFiled: October 30, 2019Publication date: April 14, 2022Inventors: Huaxiang YIN, Tianchun YE, Qingzhu ZHANG, Jiaxin YAO
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Publication number: 20220085070Abstract: Provided are a three-dimensional vertical single transistor ferroelectric memory and a manufacturing method thereof. The ferroelectric memory comprises: a substrate; an insulating dielectric layer provided at the substrate; a channel structure extending through the insulating dielectric layer and connected to the substrate, the channel structure having a source/drain region and a channel region connected to the source/drain region; and a gate stack structure arranged around the channel structure and provided in the insulating dielectric layer opposite to the channel region, the gate stack structure comprising a ferroelectric insulation layer and a gate sequentially stacked in a direction away from the channel structure. The ferroelectric memory having the above structure can replace conventional DRAMs. Therefore, the invention realizes a high intensity high speed memory.Type: ApplicationFiled: November 4, 2019Publication date: March 17, 2022Inventors: Huaxiang YIN, Zhaozhao HOU, Tianchun YE, Chaolei LI
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Patent number: 11069808Abstract: A negative capacitance field effect transistor (NCFET) and a manufacturing method thereof. The NCFET includes: a substrate structure, including a MOS region; a gate insulating dielectric structure, covering the MOS region; and a metal gate stack layer, covering the gate insulating dielectric structure. The gate insulating dielectric structure includes an interface oxide layer, a HfO2 layer, a doping material layer, and a ferroelectric material layer, which are sequentially stacked along a direction away from the substrate structure. A ferroelectric material in the ferroelectric material layer is HfxA1-xO2, A represents a doping element, and 0.1?x?0.9. A material forming the doping material layer is AyOz or A, and a ratio of y/z is equal to 1/2, 2/3, 2/5 or 1/1. Ferroelectric characteristics, material stability, and material reliability of the NCFET are improved by increasing domain polarity of the ferroelectric material.Type: GrantFiled: December 19, 2019Date of Patent: July 20, 2021Assignee: Institute of Microelectronics, Chinese Academy of SciencesInventors: Huaxiang Yin, Qingzhu Zhang, Zhaohao Zhang, Tianchun Ye
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Patent number: 11056580Abstract: A semiconductor device comprise a substrate, source/drain regions, a channel region, a gate dielectric layer and a gate conductive layer, wherein the gate dielectric layer comprises a barrier layer, a storage layer, a first interface layer, a tunneling layer, a second interface layer. In accordance with the semiconductor device and the manufacturing method of the present invention, an interface layer is added between the storage layer and tunneling layer in the gate dielectric by adjusting process step, and the peak concentration and peak location of nitrogen can be flexibly adjusted, effectively improving the quality of the interface between the storage layer and the tunneling layer in the gate dielectric layer, increasing process flexibility, improving device reliability and current characteristics.Type: GrantFiled: November 23, 2015Date of Patent: July 6, 2021Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCESInventor: Tianchun Ye
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Patent number: 10991877Abstract: A multi-state memory and a method for manufacturing the same. A magnetoresistive tunnel junction is disposed on a spin-orbit coupling layer, and thermal annealing is performed after dopant ions are injected from a side of the magnetoresistive tunnel junction. The concentration of dopant ions in the magnetoresistive tunnel junction has a gradient variation along the direction that is perpendicular to the direction of the current and within the plane in which the spin-orbit coupling layer is located. Symmetry along the direction perpendicular to the direction of the current is broken. In a case a current flows into the spin-orbit coupling layer, resistance are outputted in multiple states in linearity with the current. The multi-state storage is achieved. It can meet a requirement on hardware of neural network synapses, and is applicable to calculation in a neural network.Type: GrantFiled: September 4, 2019Date of Patent: April 27, 2021Assignee: Institute of Microelectronics, Chinese Academy of SciencesInventors: Meiyin Yang, Jun Luo, Sumei Wang, Jing Xu, Yanru Li, Junfeng Li, Yan Cui, Wenwu Wang, Tianchun Ye
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Publication number: 20200335596Abstract: A gate-all-around nanowire device and a method for forming the gate-all-around nanowire device. A first fin and a dielectric layer on the first fin are formed on a substrate. The first fin includes the at least one first epitaxial layer and the at least one second epitaxial layer that are alternately stacked. The dielectric layer exposes a channel region of the first fin. A doping concentration at a lateral surface of the channel region and a doping concentration at a central region of the channel region are different from each other in the at least one second epitaxial layer. After the at least one first epitaxial layer is removed from the channel region, the at least one second epitaxial layer in the channel region serves as at least one nanowire. A gate surrounding the at least one nanowire is formed.Type: ApplicationFiled: September 5, 2019Publication date: October 22, 2020Inventors: Huaxiang YIN, Jiaxin YAO, Qingzhu ZHANG, Zhaohao ZHANG, Tianchun YE
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Publication number: 20200328309Abstract: A negative capacitance field effect transistor (NCFET) and a manufacturing method thereof. The NCFET includes: a substrate structure, including a MOS region; a gate insulating dielectric structure, covering the MOS region; and a metal gate stack layer, covering the gate insulating dielectric structure. The gate insulating dielectric structure includes an interface oxide layer, a HfO2 layer, a doping material layer, and a ferroelectric material layer, which are sequentially stacked along a direction away from the substrate structure. A ferroelectric material in the ferroelectric material layer is HfxA1-xO2, A represents a doping element, and 0.1?x?0.9. A material forming the doping material layer is AyOz or A, and a ratio of y/z is equal to 1/2, 2/3, 2/5 or 1/1. Ferroelectric characteristics, material stability, and material reliability of the NCFET are improved by increasing domain polarity of the ferroelectric material.Type: ApplicationFiled: December 19, 2019Publication date: October 15, 2020Inventors: Huaxiang YIN, Qingzhu ZHANG, Zhaohao ZHANG, Tianchun YE
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Publication number: 20200303635Abstract: A multi-state memory and a method for manufacturing the same. A magnetoresistive tunnel junction is disposed on a spin-orbit coupling layer, and thermal annealing is performed after dopant ions are injected from a side of the magnetoresistive tunnel junction. The concentration of dopant ions in the magnetoresistive tunnel junction has a gradient variation along the direction that is perpendicular to the direction of the current and within the plane in which the spin-orbit coupling layer is located. Symmetry along the direction perpendicular to the direction of the current is broken. In a case a current flows into the spin-orbit coupling layer, resistance are outputted in multiple states in linearity with the current. The multi-state storage is achieved. It can meet a requirement on hardware of neural network synapses, and is applicable to calculation in a neural network.Type: ApplicationFiled: September 4, 2019Publication date: September 24, 2020Inventors: Meiyin YANG, Jun Luo, Sumei Wang, Jing Xu, Yanru Li, Junfeng Li, Yan Cui, Wenwu Wang, Tianchun Ye
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Patent number: 10644020Abstract: A three-dimensional semiconductor device includes: A peripheral circuit, distributed on a substrate; a plurality of memory cells above the peripheral circuit, each of which includes: a common source region, between the memory cell and the peripheral circuit; a channel layer, distributed in a direction perpendicular to the surface of the substrate; at least one substrate contact layer, extending horizontally from the central portion of the channel layer parallel to the surface of the substrate, each comprising at least one substrate contact region; a plurality of insulating layers, located on sidewalls of the channel layer; a plurality of control gates, sandwiched between adjacent insulating layers; a gate dielectric layer, located between the channel layer and the control gates; a drain region, located at top of the channel layer; a substrate contact lead-out line, electrically connected to the substrate contact regions; and a bit line wiring, electrically connected to the drain region of each memory cell andType: GrantFiled: November 23, 2015Date of Patent: May 5, 2020Assignee: Institute of Microelectronics, Chinese Academy of SciencesInventors: Zongliang Huo, Tianchun Ye
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Patent number: 10504916Abstract: A three-dimensional memory device and method of manufacturing the same, an isolation structure is embedded between the common source region and the substrate thereunder, which can inhibit the undesired diffusion of impurities during the implantation of the common source region, avoiding operation failure due to excessive diffusion of impurities. In programming and reading states of the three-dimensional memory device, electrons flow from the common source region to bit line; while in erase states, holes are injected from the substrate. Due to the isolation structure, the three-dimensional memory device achieves spatial separation of electrons from holes required for programming/erasing, improving the erasing efficiency and the integration as well.Type: GrantFiled: November 23, 2015Date of Patent: December 10, 2019Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCESInventors: Zongliang Huo, Tianchun Ye
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Patent number: 10483279Abstract: A method of manufacturing a semiconductor device, comprising the steps of: forming a gate dielectric layer and a first amorphous channel layer on a substrate; thinning the first amorphous channel layer; etching the first amorphous channel layer and the gate dielectric layer until the substrate is exposed; forming a second amorphous channel layer on the first amorphous channel layer and the substrate; annealing such that the first amorphous channel layer and the second amorphous channel layer are converted into a polycrystalline channel layer; and thinning the polycrystalline channel layer. According to the method of manufacturing semiconductor device of the present invention, the grain size of the polycrystalline thin film is increased by depositing a thick amorphous film and then annealing and thinning it.Type: GrantFiled: November 23, 2015Date of Patent: November 19, 2019Assignee: Institute of Microelectronics, Chinese Academy of SciencesInventor: Tianchun Ye
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Publication number: 20180315769Abstract: A three-dimensional semiconductor device includes: A peripheral circuit, distributed on a substrate; a plurality of memory cells above the peripheral circuit, each of which includes: a common source region, between the memory cell and the peripheral circuit; a channel layer, distributed in a direction perpendicular to the surface of the substrate; at least one substrate contact layer, extending horizontally from the central portion of the channel layer parallel to the surface of the substrate, each comprising at least one substrate contact region; a plurality of insulating layers, located on sidewalls of the channel layer; a plurality of control gates, sandwiched between adjacent insulating layers; a gate dielectric layer, located between the channel layer and the control gates; a drain region, located at top of the channel layer; a substrate contact lead-out line, electrically connected to the substrate contact regions; and a bit line wiring, electrically connected to the drain region of each memory cell andType: ApplicationFiled: November 23, 2015Publication date: November 1, 2018Inventors: Zongliang Huo, Tianchun Ye
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Publication number: 20180315484Abstract: A method for operating a semiconductor memory includes: randomizing a data of an operation address to obtain a random code; performing a combinational logic operation between the random code and the original data to obtain a randomized data, or performing a combinational logic operation between the randomized data and the random code to obtain a de-randomized data; saving the randomized data, or outputting the de-randomized data. According to the method for operating a semiconductor memory of the present invention, since a combinational logic or a non-iterative sequential logic is used to form a random sequence generation unit, the encoding/decoding process does not need to wait for a specific cycle, thus reducing the operation time and improving the chip performance.Type: ApplicationFiled: November 23, 2015Publication date: November 1, 2018Inventor: Tianchun Ye