Abstract: In a described example, an apparatus includes: a package substrate having a planar die mount surface; recesses extending into the planar die mount surface; and a semiconductor device die flip chip mounted to the package substrate on the planar die mount surface, the semiconductor device die having post connects having proximate ends on bond pads on an active surface of the semiconductor device die, and extending to distal ends away from the semiconductor device die having solder bumps, wherein the solder bumps form solder joints to the package substrate within the recesses.

Abstract: A method of making a semiconductor device includes separating a conductive structure of a leadframe into interior conductive leads using an etching process. The method includes forming a first molded structure by applying a first molding compound to a leadframe having a conductive structure, separating the conductive structure into at least two interior contact portions, attaching a semiconductor die to at least one of the interior contact portions, the at least two interior contact portions being supported by the first molding compound, and forming a second molded structure by applying a second molding compound to at least part of the semiconductor die and at least two interior contact portions.

Abstract: A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate.

Abstract: A packaged electronic device includes a semiconductor die, a conductive plate coupled to a lead, a solder structure and a package structure. The semiconductor die has opposite first and second sides and a terminal exposed along the second side. The conductive plate has opposite first and second sides and an indent that extends into the first side, the conductive plate, and the solder structure extends between the second side of the semiconductor die and the first side of the conductive plate to electrically couple the conductive plate to the terminal, and the solder structure extends into the indent. The package structure encloses the semiconductor die, the conductive plate and a portion of the lead.

Abstract: The present disclosure relates to modified metal-organic frameworks (MOFs) and a post-synthetic modification method that simultaneously enhances hydrophilicity and water stability to achieve high-performance water sorption materials.

Abstract: A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate.

Abstract: In examples, a semiconductor package comprises a substrate and multiple columns of semiconductor dies positioned approximately in parallel along a length of the substrate. The package also includes multiple passive components positioned between the multiple columns of semiconductor dies, the multiple passive components angled between 30 and 60 degrees relative to the length of the substrate, a pair of the multiple passive components having a gap therebetween that is configured to permit mold compound flow through capillary action. The package also includes a mold compound covering the substrate, the multiple columns of semiconductor dies, and the multiple passive components.

Abstract: The invention relates to luminescence-based compounds, compositions and methods for chemical sensing in solid state and solutions. More particularly, the invention includes “turn-on” lanthanide sensors that luminesce only in the presence of an organic compound (analyte) and are non-emissive in the absence of the organic compound (analyte).

Abstract: A packaged electronic device includes a semiconductor die, a conductive plate coupled to a lead, a solder structure and a package structure. The semiconductor die has opposite first and second sides and a terminal exposed along the second side. The conductive plate has opposite first and second sides and an indent that extends into the first side, the conductive plate, and the solder structure extends between the second side of the semiconductor die and the first side of the conductive plate to electrically couple the conductive plate to the terminal, and the solder structure extends into the indent. The package structure encloses the semiconductor die, the conductive plate and a portion of the lead.

Abstract: In a described example, an apparatus includes: a package substrate having a planar die mount surface; recesses extending into the planar die mount surface; and a semiconductor device die flip chip mounted to the package substrate on the planar die mount surface, the semiconductor device die having post connects having proximate ends on bond pads on an active surface of the semiconductor device die, and extending to distal ends away from the semiconductor device die having solder bumps, wherein the solder bumps form solder joints to the package substrate within the recesses.

Abstract: A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate.

Abstract: A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate.

Abstract: A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate.

Abstract: A migration system or service may implement event-driven replication for migrating a computing resource from a source network to a destination network. A replication event may be detected to obtain a state of a data volume for a computing resource hosted in a client network. A request to a replication agent hosted in the source network may instruct the replication agent to copy at least some of the data of the data volume and send the data to the destination network. The migration service may generate a state of the data volume from the received data in a format that is operable to host the computing resource in the destination network and store the generated state of the data volume.

Abstract: A method of making a semiconductor device includes separating a conductive structure of a leadframe into interior conductive leads using an etching process. The method includes forming a first molded structure by applying a first molding compound to a leadframe having a conductive structure, separating the conductive structure into at least two interior contact portions, attaching a semiconductor die to at least one of the interior contact portions, the at least two interior contact portions being supported by the first molding compound, and forming a second molded structure by applying a second molding compound to at least part of the semiconductor die and at least two interior contact portions.

Abstract: A semiconductor package comprises a first die thermally coupled to a first thermally conductive device. The first thermally conductive device has a first surface exposed to an exterior of the semiconductor package. The package comprises a second die thermally coupled to a second thermally conductive device, the second thermally conductive device having a second surface exposed to an exterior of the semiconductor package. The first and second dies are positioned in different horizontal planes.

Abstract: A device for use in a burner, including a honeycomb body formed from a metal band. The metal band is laminated or coiled to yield a plurality of holes or apertures. The honeycomb body has first and second surfaces which are opposite to each other. The holes or apertures penetrate through the first surface and the second surface, and an outer boundary of the first surface and an outer boundary of the second surface are connected whereby yielding a lateral surface. A through hole is disposed on the lateral surface of the honeycomb body and penetrates inward through multiple layers of adjacent laminated or coiled metal bands, and a metal wire is disposed in the through hole; and/or, a part of the laminated or coiled metal bands on the first surface and/or the second surface are embedded, overlapped and engaged with adjacent metal bands to form an embedded member.

Abstract: A device for use in a burner, including a honeycomb body formed from a metal band. The metal band is laminated or coiled to yield a plurality of holes or apertures. The honeycomb body has first and second surfaces which are opposite to each other. The holes or apertures penetrate through the first surface and the second surface, and an outer boundary of the first surface and an outer boundary of the second surface are connected whereby yielding a lateral surface. A through hole is disposed on the lateral surface of the honeycomb body and penetrates inward through multiple layers of adjacent laminated or coiled metal bands, and a metal wire is disposed in the through hole; and/or, a part of the laminated or coiled metal bands on the first surface and/or the second surface are embedded, overlapped and engaged with adjacent metal bands to form an embedded member.