Abstract: A method of making a semiconductor device includes separating a conductive structure of a leadframe into interior conductive leads using an etching process. The method includes forming a first molded structure by applying a first molding compound to a leadframe having a conductive structure, separating the conductive structure into at least two interior contact portions, attaching a semiconductor die to at least one of the interior contact portions, the at least two interior contact portions being supported by the first molding compound, and forming a second molded structure by applying a second molding compound to at least part of the semiconductor die and at least two interior contact portions.

Abstract: A semiconductor package comprises a first die thermally coupled to a first thermally conductive device. The first thermally conductive device has a first surface exposed to an exterior of the semiconductor package. The package comprises a second die thermally coupled to a second thermally conductive device, the second thermally conductive device having a second surface exposed to an exterior of the semiconductor package. The first and second dies are positioned in different horizontal planes.

Abstract: A device for use in a burner, including a honeycomb body formed from a metal band. The metal band is laminated or coiled to yield a plurality of holes or apertures. The honeycomb body has first and second surfaces which are opposite to each other. The holes or apertures penetrate through the first surface and the second surface, and an outer boundary of the first surface and an outer boundary of the second surface are connected whereby yielding a lateral surface. A through hole is disposed on the lateral surface of the honeycomb body and penetrates inward through multiple layers of adjacent laminated or coiled metal bands, and a metal wire is disposed in the through hole; and/or, a part of the laminated or coiled metal bands on the first surface and/or the second surface are embedded, overlapped and engaged with adjacent metal bands to form an embedded member.

Abstract: A device for use in a burner, including a honeycomb body formed from a metal band. The metal band is laminated or coiled to yield a plurality of holes or apertures. The honeycomb body has first and second surfaces which are opposite to each other. The holes or apertures penetrate through the first surface and the second surface, and an outer boundary of the first surface and an outer boundary of the second surface are connected whereby yielding a lateral surface. A through hole is disposed on the lateral surface of the honeycomb body and penetrates inward through multiple layers of adjacent laminated or coiled metal bands, and a metal wire is disposed in the through hole; and/or, a part of the laminated or coiled metal bands on the first surface and/or the second surface are embedded, overlapped and engaged with adjacent metal bands to form an embedded member.