Abstract: A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe, a working fluid and a solder bonding portion. The vapor chamber includes an inner cavity and a first joint. The first joint is formed with a passage being in communication with the inner cavity. The heat pipe is provided with a pipe space and a second joint. The pipe space is in communication with the inner cavity through the passage. The second joint is sleeved to surround the first joint such that one end surface of the second joint is directly contacted with one surface of the vapor chamber. The working fluid is filled within the pipe space and the inner cavity. The solder bonding portion connected to the second joint and the surface of the vapor chamber for integrating the heat pipe and the vapor chamber together.

Abstract: A flexible vapor chamber includes a first flexible casing, a second flexible casing, a plurality of capillary strips and a plurality of inner capillary layers. The capillary strips are installed between the first flexible casing and the second flexible casing, and the inner capillary layers are arranged between the first flexible casing and the second flexible casing, and the capillary strips.

Abstract: A heat dissipation device is provided and includes: a first vapor chamber filled with a first working fluid therein and used for contacting at least one heat source; at least one heat transfer structure disposed on a side of the first vapor chamber; and a second vapor chamber filled with a second working fluid therein and connected to the first vapor chamber via the heat transfer structure, where the first working fluid absorbs heat of the heat source and then vaporizes, and the vaporized first working fluid transfers the heat to the second working fluid via the heat transfer structure.

Abstract: Disclosed herein is a method against coronavirus infection, which includes administering to a subject in need thereof a composition containing a water-extracted product of Perilla frutescens.

Abstract: Disclosed herein is a method against coronavirus infection, which includes administering to a subject in need thereof an effective amount of 6-bromo-2-[1-(2,5-dimethylphenyl)-5-methyl-1H-pyrazol-4-yl]-quinoline-4-carboxylic acid or a pharmaceutically acceptable salt thereof.

Abstract: Disclosed herein is a method against coronavirus infection, which includes administering to a subject in need thereof an effective amount of 8-benzoyl-4-methyl-9-phenyl-furo[2,3-h]chromen-2-one or a pharmaceutically acceptable salt thereof.

Abstract: A thin vapor chamber is provided. The thin vapor chamber includes an upper plate, a lower plate, and a plurality of solid columns. The lower plate is opposite to the upper plate, and the upper plate and the lower plate are combined to form a closed space. The solid column is formed on the upper plate and extends to the lower plate. The solid columns are located in the closed space. The solid columns respectively have at least one capillary groove, and a first portion of an inner surface of the capillary groove faces a second portion of the inner surface.

Abstract: A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe, a working fluid and a solder bonding portion. The vapor chamber includes an inner cavity and a first joint. The first joint is formed with a passage being in communication with the inner cavity. The heat pipe is provided with a pipe space and a second joint. The pipe space is in communication with the inner cavity through the passage. The second joint is sleeved to surround the first joint such that one end surface of the second joint is directly contacted with one surface of the vapor chamber. The working fluid is filled within the pipe space and the inner cavity. The solder bonding portion connected to the second joint and the surface of the vapor chamber for integrating the heat pipe and the vapor chamber together.

Abstract: A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe and a working fluid. The vapor chamber includes an inner cavity, a first capillary structure disposed within the inner cavity, and a first joint connected with the inner cavity. The heat pipe includes a pipe body, a second capillary structure, and a second joint disposed at the pipe body and connected to the first joint, such that a pipe space of the pipe body is in communication with the inner cavity. The second capillary structure includes a first section and a second section. The first section is fixedly disposed within a pipe space and connected to the second section. The second section is curvedly extended from one end of the first section, and connected to the first capillary structure. The working fluid is filled within the pipe space and the inner cavity.

Abstract: A vapor chamber is provided, which includes: a substrate; a diversion layer disposed on the substrate and having first openings and second openings; and at least one liquid passage formed between the substrate and the diversion layer, where the vapor chamber is defined with an evaporation area corresponding to a heat source and at least one condensation area, and the size of the first openings corresponding to the evaporation area and the condensation area is different from the size of the second openings corresponding to a non-evaporation area and a non-condensation area.

Abstract: The present disclosure provides a vapor chamber including an upper plate and a lower plate. The upper plate includes a first metal layer and a second metal layer made of different materials. The lower plate is attached to the upper plate. A stamping process is performed on the first metal layer and the second metal layer of the upper plate, so that the first metal layer and the second metal layer are simultaneously deformed to form at least one supporting structure and a first skirt structure. The upper plate is attached to the lower plate via the first skirt structure to define a working space. At least one supporting structure is within the working space.

Abstract: A vapor chamber includes an upper plate and a lower plate. The lower plate is attached on the upper plate. The upper plate and the lower plate are combined together to define a working space. The lower plate is in thermal contact with a heat source. A reinforcing layer is formed on a surface of the upper plate or the lower plate away from the working space.

Abstract: A flexible vapor chamber for an electronic device includes an upper cover, a lower cover, an accommodation space, a capillary structure, plural support structures and a working fluid. The upper cover is made of a first flexible material. The lower cover is made of a second flexible material. The accommodation space is arranged between the upper cover and the lower cover. The capillary structure is disposed on the lower cover and accommodated within the accommodation space. The plural support structures are disposed on the upper cover and accommodated within the accommodation space. The plural support structures are contacted with the capillary structure. The working fluid is accommodated within the accommodation space. The flexible vapor chamber is permitted to be subjected to a flexural action in a flexible range. Consequently, the installation of the flexible vapor chamber complies with a shape of the electronic device.

Abstract: A vapor chamber includes an upper plate, a lower plate and a fixing frame. The lower plate is attached on the upper plate. The lower plate includes a raised structure. The fixing frame is attached on the lower plate. The fixing frame includes a hollow portion and at least one fastening part. The raised structure is accommodated within the hollow portion. The fixing frame is helpful for facilitating the manufacturer or the user to directly assemble and fix the vapor chamber on a supporting plate with a heat source. Moreover, due to the fixing frame, the possibility of causing deformation of the vapor chamber is minimized.