VAPOR CHAMBER
A vapor chamber includes an upper plate, a lower plate and a fixing frame. The lower plate is attached on the upper plate. The lower plate includes a raised structure. The fixing frame is attached on the lower plate. The fixing frame includes a hollow portion and at least one fastening part. The raised structure is accommodated within the hollow portion. The fixing frame is helpful for facilitating the manufacturer or the user to directly assemble and fix the vapor chamber on a supporting plate with a heat source. Moreover, due to the fixing frame, the possibility of causing deformation of the vapor chamber is minimized.
The present invention relates to a heat dissipation device, and more particularly to a vapor chamber
BACKGROUND OF THE INVENTIONA vapor chamber is one of the heat dissipation devices. Generally, a heat source is fixed on a supporting plate, and a lower plate of the vapor chamber is attached on the heat source. However, the slim-type vapor chamber is readily suffered from deformation. It is important to securely fix the heat source on the supporting plate and attach the lower plate of the vapor chamber on the heat source while avoiding deformation of the vapor chamber.
Moreover, it is also important to quickly and easily fix the final product of the vapor chamber on the heat source.
SUMMARY OF THE INVENTIONFor solving the drawbacks of the conventional technologies, the present invention provides a vapor chamber with a fixing frame. The fixing frame is helpful for facilitating the manufacturer or the user to directly assemble and fix the vapor chamber on a supporting plate with a heat source. Moreover, due to the fixing frame, the possibility of causing deformation of the vapor chamber is minimized.
In accordance with an embodiment of the present invention, a vapor chamber is provided. The vapor chamber includes an upper plate, a lower plate and a fixing frame. The lower plate is attached on the upper plate. The lower plate includes a raised structure. The fixing frame is attached on the lower plate. The fixing frame includes a hollow portion and at least one fastening part. The raised structure is accommodated within the hollow portion.
In an embodiment, the vapor chamber is in thermal contact with a heat source, and the heat source is fixed on a supporting plate. The raised structure is contacted with the heat source. The fastening part of the fixing frame is fixed on the supporting plate.
In an embodiment, a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate, and the thermal conduction property of the lower plate is superior to a thermal conduction property of the fixing frame.
In an embodiment, a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate, and the thermal conduction property of the upper plate is superior to or equal to a thermal conduction property of the fixing frame.
In an embodiment, a metallic strength of the fixing frame is higher than a metallic strength of the lower plate, and the metallic strength of the fixing frame is higher than or equal to a metallic strength of the upper plate.
In an embodiment, the fixing frame is made of copper alloy, stainless steel, plastic steel or aluminum alloy.
In an embodiment, the upper plate is made of copper alloy, and the lower plate is made of pure copper.
In an embodiment, the fastening part is a male threaded rod, a female threaded rod or a threaded hole.
In an embodiment, the fixing frame is a hollow frame with a through-hole, and the through-hole is the hollow portion.
In an embodiment, the fixing frame has a notch, or the fixing frame is defined by two individual sub-frames.
In accordance with another embodiment of the present invention, a vapor chamber is provided. The vapor chamber includes an upper plate, a lower plate and a fixing frame. The lower plate is attached on the upper plate. The fixing frame is attached on the lower plate. The fixing frame includes a fastening part.
In an embodiment, the vapor chamber is in thermal contact with the heat source, and the heat source is fixed on a supporting plate. The fixing frame is contacted with the heat source. A heat from the heat source is transferred to the lower plate through the fixing frame. The fastening part of the fixing frame is fixed on the supporting plate.
In an embodiment, a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate, and the thermal conduction property of the lower plate is superior to a thermal conduction property of the fixing frame.
In an embodiment, a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate, and the thermal conduction property of the upper plate is superior to or equal to a thermal conduction property of the fixing frame.
In an embodiment, a metallic strength of the fixing frame is higher than a metallic strength of the lower plate, and the metallic strength of the fixing frame is higher than or equal to a metallic strength of the upper plate.
In an embodiment, the fixing frame is made of copper alloy, stainless steel, plastic steel or aluminum alloy.
In an embodiment, the upper plate is made of copper alloy, and the lower plate is made of pure copper.
In an embodiment, the fastening part is a male threaded rod, a female threaded rod or a threaded hole.
In an embodiment, the fixing frame is a hollow frame with a through-hole, and the through-hole is the hollow portion.
In an embodiment, the fixing frame has a notch, or the fixing frame is defined by two individual sub-frames.
In an embodiment, the vapor chamber further includes a heat conduction block. The heat conduction block is attached on the lower plate. The heat conduction block is in thermal contact with a heat source. The heat source is fixed on a supporting plate. The heat conduction block is contacted with the heat source. A heat from the heat source is transferred to the lower plate through the heat conduction block. The fastening part of the fixing frame is fixed on the supporting plate.
In an embodiment, a thermal conduction property of the lower plate or the heat conduction block is superior to a thermal conduction property of the upper plate, and the thermal conduction property of the lower plate or the heat conduction block is superior to a thermal conduction property of the fixing frame.
In an embodiment, a thermal conduction property of the lower plate or the heat conduction block is superior to a thermal conduction property of the upper plate, and a thermal conduction property of the upper plate is superior to or equal to a thermal conduction property of the fixing frame.
In an embodiment, a metallic strength of the fixing frame is higher than a metallic strength of the lower plate, and the metallic strength of the fixing frame is higher than or equal to a metallic strength of the upper plate.
In an embodiment, the fixing frame is made of copper alloy, stainless steel, plastic steel or aluminum alloy.
In an embodiment, the upper plate is made of copper alloy, and the lower plate or the heat conduction block is made of pure copper.
The above objects and advantages of the present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed description and accompanying drawings, in which:
Please refer to
In this embodiment, the vapor chamber 1 comprises an upper plate 11, a lower plate 12 and a fixing frame 13. The vapor chamber 1 is in thermal contact with at least one heat source 4. The heat source 4 is fixed on a supporting plate 5. After the upper plate 11 and the lower plate 12 of the vapor chamber 1 are attached on each other, a working space 14 is defined. In the working space 14, a first capillary structure 15 is formed on an inner surface of the upper plate 11, and a second capillary structure 16 is formed on an inner surface of the lower plate 12. Moreover, a support structure 17 is clamped between the upper plate 11 and the lower plate 12.
In this embodiment, at least one raised structure 121 is formed on a portion of the lower plate 12. The raised structure 121 is in thermal contact with the at least one heat source 4. In this context, the thermal contact between the raised structure 121 and the heat source 4 indicates that the raised structure 121 is directly attached on the heat source 4 or an intermediate medium (a thermal grease or another heat conductive element) is arranged between the raised structure 121 and the heat source 4. The arrangement of the raised structure 121 has the following advantages. When the vapor chamber 1 is in thermal contact with the heat source 4, there is a height difference between the raised structure 121 and the other region of the lower plate 12. Consequently, the electronic components on the supporting plate 5 are not pressed or obstructed by the lower plate 12, and the installing flexibility and convenience are enhanced.
The fixing frame 13 is attached on the lower plate 12 through a welding means or any other appropriate connecting means. When the fixing frame 13 and the supporting plate 5 are combined together, the raised structure 121 provides a pressing force to suppress the heat source 4. Consequently, the heat energy generated by the heat source 4 can be quickly and completely transferred to the raised structure 121. Then, the heat energy is dissipated away through the operations of the vapor chamber 1. In this embodiment, the fixing frame 13 comprises a hollow portion 131 and at least one fastening part 132. Preferably but not exclusively, the raised structure 121 of the lower plate 12 is accommodated within the hollow portion 131 of the fixing frame 13, or the raised structure 121 of the lower plate 12 is extended or protruded out of the hollow portion 131 of the fixing frame 13.
In an embodiment, the fastening part 132 of the fixing frame 13 is fixed on the supporting plate 5. The fastening part 132 of the fixing frame 13 is a female threaded rod. The supporting plate 5 has at least one perforation 51 corresponding to the at least one fastening part 132. After a screw 6 is penetrated through the perforation 51 and tightened into the fastening part 132 (e.g., the female threaded rod), the lower plate 12, the fixing frame 13 and the supporting plate 5 (along with the heat source 4) are combined together. It is noted that numerous modifications and alterations may be made while retaining the teachings of the invention. For example, in another embodiment, the fastening part 132 of the fixing frame 13 is a male threaded rod, and the supporting plate 5 has at least one perforation 51 corresponding to the at least one fastening part 132. After the male threaded rod is penetrated through the perforation 51, a screw (not shown) is fixed on the male threaded rod. Consequently, the assembling process is completed. In another embodiment, the fastening part 132 of the fixing frame 13 is a threaded hole. After a screw 6 is penetrated through the perforation 51 of the supporting plate 5 and tightened into the threaded hole, the assembling process is completed.
In an embodiment, the upper plate 11 is made of copper alloy, the lower plate 12 is made of pure copper, and the fixing frame 13 is made of copper alloy, stainless steel, plastic steel or aluminum alloy. Since the thermal conduction property of pure copper is better than the thermal conduction property of copper alloy, the lower plate 12 can receive the heat energy more efficiently than the upper plate 11. Since the upper plate 11 is closer to the site grasped by the user, the thermal conductivity of the upper plate 11 is slightly lower than the thermal conductivity of the lower plate 12. Consequently, when the vapor chamber 1 is applied to a product (e.g., a smart phone), the user feels that the touch temperature of the product is not too high and the heat dissipation efficiency is still satisfactory. Since the fixing frame 13 is made of copper alloy or stainless steel, the fixing frame 13 has excellent metallic strength. In accordance with a feature of the present invention, the thermal conduction property of the material of the fixing frame 13 is lower than that of pure copper (i.e., the material of the lower plate 12) but the metallic strength of the fixing frame 13 is superior to that of the pure copper. Consequently, the vapor chamber 1 is not readily suffered from deformation during the assembling process. The thermal conductivity is measured according to the thermal conductivity coefficient. The metallic strength is measured according to Vickers hardness, tensile strength or elasticity coefficient.
In accordance with the designing rules of the vapor chamber 1, the thermal conduction property of the lower plate 12 is superior to the thermal conduction property of the upper plate 11, the thermal conduction property of the lower plate 12 is superior to the thermal conduction property of the fixing frame 13, the thermal conduction property of the upper plate 11 is superior to or equal to the thermal conduction property of the fixing frame 13, the metallic strength of the fixing frame 13 is higher than (or superior to) the metallic strength of the lower plate 12, or the metallic strength of the fixing frame 13 is higher than (or superior to) the metallic strength of the upper plate 11.
Please refer to
Hereinafter, some variant examples of the hollow portion 131 of the fixing frame 13 will be described with reference to
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In this embodiment, the vapor chamber 2 comprises an upper plate 21, a lower plate 22 and a fixing frame 23. the fixing frame 23 comprises at least one fastening part 232. The vapor chamber 2 is in thermal contact with at least one heat source 4. Consequently, the heat energy from the heat source 4 can be transferred to the lower plate 22. The heat source 4 is fixed on a supporting plate 5. After the upper plate 21 and the lower plate 22 of the vapor chamber 2 are attached on each other, a working space 24 is defined. In the working space 24, a first capillary structure 25 is formed on an inner surface of the upper plate 21, and a second capillary structure 26 is formed on an inner surface of the lower plate 22. Moreover, a support structure 27 is clamped between the upper plate 21 and the lower plate 22. In this context, the thermal contact between the fixing frame 23 and the heat source 4 indicates that the fixing frame 23 is directly attached on the heat source or an intermediate medium (a thermal grease or another heat conductive element) is arranged between the fixing frame 23 and the heat source 4.
The fixing frame 23 is attached on the lower plate 22 through a welding means or any other appropriate connecting means. When the fixing frame 23 and the supporting plate 5 are combined together, the fixing frame 23 provides a pressing force to suppress the heat source 4. Consequently, the heat energy generated by the heat source 4 can be quickly and completely transferred to the lower plate 22 through the fixing frame 23. Then, the heat energy is dissipated away through the operations of the vapor chamber 2.
In an embodiment, the fastening part 232 of the fixing frame 23 is a female threaded rod. The supporting plate 5 has at least one perforation 51 corresponding to the at least one fastening part 232. After a screw 6 is penetrated through the perforation 51 and tightened into the fastening part 232 (e.g., the female threaded rod), the lower plate 22, the fixing frame 23 and the supporting plate 5 (along with the heat source 4) are combined together. It is noted that numerous modifications and alterations may be made while retaining the teachings of the invention. For example, in another embodiment, the fastening part 232 of the fixing frame 23 is a male threaded rod and the supporting plate 5 has at least one perforation 51 corresponding to the at least one fastening part 232. After the male threaded rod is penetrated through the perforation 51, a screw (not shown) is fixed on the male threaded rod. Consequently, the assembling process is completed. In another embodiment, the fastening part 232 of the fixing frame 23 is a threaded hole (not shown). After a screw 6 is penetrated through the perforation 51 of the supporting plate 5 and tightened into the threaded hole, the assembling process is completed.
In an embodiment, the upper plate 21 is made of copper alloy, the lower plate 22 is made of pure copper, and the fixing frame 23 is made of copper alloy, stainless steel, plastic steel or aluminum alloy. Since the thermal conduction property of pure copper is better than the thermal conduction property of copper alloy, the lower plate 22 can receive the heat energy more efficiently than the upper plate 21. Since the upper plate 21 is closer to the site grasped by the user, the thermal conductivity of the upper plate 21 is slightly lower than the thermal conductivity of the lower plate 22. Consequently, when the vapor chamber 2 is applied to a product (e.g., a smart phone), the user feels that the touch temperature of the product is not too high and the heat dissipation efficiency is still satisfactory. Since the fixing frame 23 is made of copper alloy or stainless steel, the fixing frame 23 has excellent metallic strength. In accordance with a feature of the present invention, the thermal conduction property of the material of the fixing frame 23 is lower than that of pure copper (i.e., the material of the lower plate 22) but the metallic strength of the fixing frame 23 is superior to that of the pure copper. Consequently, the vapor chamber 2 is not readily suffered from deformation during the assembling process. The thermal conductivity is measured according to the thermal conductivity coefficient. The metallic strength is measured according to Vickers hardness, tensile strength or elasticity coefficient.
In accordance with the designing rules of the vapor chamber 2, the thermal conduction property of the lower plate 22 is superior to the thermal conduction property of the upper plate 21, the thermal conduction property of the lower plate 22 is superior to the thermal conduction property of the fixing frame 23, the thermal conduction property of the upper plate 21 is superior to or equal to the thermal conduction property of the fixing frame 23, the metallic strength of the fixing frame 23 is higher than (or superior to) the metallic strength of the lower plate 22, or the metallic strength of the fixing frame 23 is higher than (or superior to) the metallic strength of the upper plate 21.
Please refer to
In this embodiment, the vapor chamber 3 comprises an upper plate 31, a lower plate 32, a fixing frame 33 and a heat conduction block 38. The vapor chamber 3 is in thermal contact with at least one heat source 4. The heat source 4 is fixed on a supporting plate 5. After the upper plate 31 and the lower plate 32 of the vapor chamber 3 are attached on each other, a working space 34 is defined. In the working space 34, a first capillary structure 35 is formed on an inner surface of the upper plate 31, and a second capillary structure 36 is formed on an inner surface of the lower plate 32. Moreover, a support structure 37 is clamped between the upper plate 31 and the lower plate 32.
In this embodiment, a first surface of the heat conduction block 38 is attached on the lower plate 32 of the vapor chamber 3 through a welding means or any other appropriate connecting means. A second surface of the heat conduction block 38 is in thermal contact with the at least one heat source 4. In this context, the thermal contact between the heat conduction block 38 and the heat source 4 indicates that the heat conduction block 38 is directly attached on the heat source 4 or an intermediate medium (a thermal grease or another heat conductive element) is arranged between the heat conduction block 38 and the heat source 4. When the heat conduction block 38, the lower plate 32 of the vapor chamber 3 and the heat source 4 are combined together, the heat energy generated by the heat source 4 is transferred to the vapor chamber 3 through the heat conduction block 38. Then, the heat energy is dissipated away through the vapor chamber 3.
In this embodiment, the fixing frame 33 comprises a hollow portion 331 and at least one fastening part 332. The heat conduction block 38 is disposed within the hollow portion 331. That is, the top surface of the heat conduction block 38 is at the same level with the top surface of the fixing frame 33. Consequently, the overall thickness of the vapor chamber 3 is not increased.
In an embodiment, the fixing frame 33 is attached on the lower plate 32 through a welding means or any other appropriate connecting means, and the fixing frame 33 is fixed on the supporting plate 5 through the at least one fastening part 332. The fastening part 332 of the fixing frame 33 is a female threaded rod. The supporting plate 5 has at least one perforation 51 corresponding to the at least one fastening part 332. After a screw 6 is penetrated through the perforation 51 and tightened into the fastening part 332 (e.g., the female threaded rod), the lower plate 32, the fixing frame 33 and the supporting plate 5 (along with the heat source 4) are combined together. It is noted that numerous modifications and alterations may be made while retaining the teachings of the invention. For example, in another embodiment, the fastening part 332 of the fixing frame 33 is a male threaded rod and the supporting plate 5 has at least one perforation 51 corresponding to the at least one fastening part 332. After the male threaded rod is penetrated through the perforation 51, a screw (not shown) is fixed on the male threaded rod. Consequently, the assembling process is completed. In another embodiment, the fastening part 332 of the fixing frame 33 is a threaded hole. After a screw 6 is penetrated through the perforation 51 of the supporting plate 5 and tightened into the threaded hole, the assembling process is completed.
In an embodiment, the upper plate 31 is made of copper alloy, the lower plate 32 is made of pure copper, the heat conduction block 38 is made of pure copper, and the fixing frame 33 is made of copper alloy, stainless steel, plastic steel or aluminum alloy. Since the thermal conduction property of pure copper is better than the thermal conduction property of copper alloy, the heat energy can be transferred from the heat source 4 to the lower plate 32 through the heat conduction block 38 more efficiently and the lower plate 32 can receive the heat energy more efficiently than the upper plate 31. Since the upper plate 31 is closer to the site grasped by the user, the thermal conductivity of the upper plate 31 is slightly lower than the thermal conductivity of the lower plate 32. Consequently, when the vapor chamber 3 is applied to a product (e.g., a smart phone), the user feels that the touch temperature of the product is not too high and the heat dissipation efficiency is still satisfactory. Since the fixing frame 33 is made of copper alloy or stainless steel, the fixing frame 33 has excellent metallic strength. In accordance with a feature of the present invention, the thermal conduction property of the material of the fixing frame 33 is lower than that of pure copper (i.e., the material of the lower plate 32) but the metallic strength of the fixing frame 33 is superior to that of the pure copper. Consequently, the vapor chamber 3 is not readily suffered from deformation during the assembling process. The thermal conductivity is measured according to the thermal conductivity coefficient. The metallic strength is measured according to Vickers hardness, tensile strength or elasticity coefficient.
In accordance with the designing rules of the vapor chamber 3, the thermal conduction property of the lower plate 32 or the heat conduction block 38 is superior to the thermal conduction property of the upper plate 31, the thermal conduction property of the lower plate 32 or the heat conduction block 38 is superior to the thermal conduction property of the fixing frame 33, the thermal conduction property of the upper plate 31 is superior to or equal to the thermal conduction property of the fixing frame 33, the metallic strength of the fixing frame 33 is higher than (or superior to) the metallic strength of the lower plate 32, or the metallic strength of the fixing frame 33 is higher than (or superior to) the metallic strength of the upper plate 31.
It is noted that the examples of the hollow portion 331 are not restricted. Hereinafter, some variant examples of the hollow portion 331 of the fixing frame 33 will be described with reference to
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While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all modifications and similar structures.
Claims
1. A vapor chamber, comprising:
- an upper plate;
- a lower plate attached on the upper plate, wherein the lower plate comprises a raised structure; and
- a fixing frame attached on the lower plate, wherein the fixing frame comprises a hollow portion and at least one fastening part, and the raised structure is accommodated within the hollow portion.
2. The vapor chamber according to claim 1, wherein the vapor chamber is in thermal contact with a heat source, and the heat source is fixed on a supporting plate, wherein the raised structure is contacted with the heat source, and the fastening part of the fixing frame is fixed on the supporting plate.
3. The vapor chamber according to claim 1, wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate, and the thermal conduction property of the lower plate is superior to a thermal conduction property of the fixing frame.
4. The vapor chamber according to claim 1, wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate, and the thermal conduction property of the upper plate is superior to or equal to a thermal conduction property of the fixing frame.
5. The vapor chamber according to claim 1, wherein a metallic strength of the fixing frame is higher than a metallic strength of the lower plate, and the metallic strength of the fixing frame is higher than or equal to a metallic strength of the upper plate.
6. The vapor chamber according to claim 1, wherein the fixing frame is made of copper alloy, stainless steel, plastic steel or aluminum alloy.
7. The vapor chamber according to claim 1, wherein the upper plate is made of copper alloy, and the lower plate is made of pure copper.
8. The vapor chamber according to claim 1, wherein the fastening part is a male threaded rod, a female threaded rod or a threaded hole.
9. The vapor chamber according to claim 1, wherein the fixing frame is a hollow frame with a through-hole, and the through-hole is the hollow portion.
10. The vapor chamber according to claim 1, wherein the fixing frame has a notch, or the fixing frame is defined by two individual sub-frames.
11. A vapor chamber, comprising:
- an upper plate;
- a lower plate attached on the upper plate; and
- a fixing frame attached on the lower plate, wherein the fixing frame comprises a fastening part.
12. The vapor chamber according to claim 11, wherein the vapor chamber is in thermal contact with the heat source, and the heat source is fixed on a supporting plate, wherein the fixing frame is contacted with the heat source, a heat from the heat source is transferred to the lower plate through the fixing frame, and the fastening part of the fixing frame is fixed on the supporting plate.
13. The vapor chamber according to claim 11, wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate, and the thermal conduction property of the lower plate is superior to a thermal conduction property of the fixing frame.
14. The vapor chamber according to claim 11, wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate, and the thermal conduction property of the upper plate is superior to or equal to a thermal conduction property of the fixing frame.
15. The vapor chamber according to claim 11, wherein a metallic strength of the fixing frame is higher than a metallic strength of the lower plate, and the metallic strength of the fixing frame is higher than or equal to a metallic strength of the upper plate.
16. The vapor chamber according to claim 11, wherein the fixing frame is made of copper alloy, stainless steel, plastic steel or aluminum alloy.
17. The vapor chamber according to claim 11, wherein the upper plate is made of copper alloy, and the lower plate is made of pure copper.
18. The vapor chamber according to claim 11, wherein the fastening part is a male threaded rod, a female threaded rod or a threaded hole.
19. The vapor chamber according to claim 11, wherein the fixing frame is a hollow frame with a through-hole, and the through-hole is the hollow portion.
20. The vapor chamber according to claim 11, wherein the fixing frame has a notch, or the fixing frame is defined by two individual sub-frames.
21. The vapor chamber according to claim 11, wherein the vapor chamber further comprises a heat conduction block, wherein the heat conduction block is attached on the lower plate, the heat conduction block is in thermal contact with a heat source, and the heat source is fixed on a supporting plate, wherein the heat conduction block is contacted with the heat source, a heat from the heat source is transferred to the lower plate through the heat conduction block, and the fastening part of the fixing frame is fixed on the supporting plate.
22. The vapor chamber according to claim 21, wherein a thermal conduction property of the lower plate or the heat conduction block is superior to a thermal conduction property of the upper plate, and the thermal conduction property of the lower plate or the heat conduction block is superior to a thermal conduction property of the fixing frame.
23. The vapor chamber according to claim 21, wherein a thermal conduction property of the lower plate or the heat conduction block is superior to a thermal conduction property of the upper plate, and a thermal conduction property of the upper plate is superior to or equal to a thermal conduction property of the fixing frame.
24. The vapor chamber according to claim 21, wherein a metallic strength of the fixing frame is higher than a metallic strength of the lower plate, and the metallic strength of the fixing frame is higher than or equal to a metallic strength of the upper plate.
25. The vapor chamber according to claim 21, wherein the fixing frame is made of copper alloy, stainless steel, plastic steel or aluminum alloy.
26. The vapor chamber according to claim 21, wherein the upper plate is made of copper alloy, and the lower plate or the heat conduction block is made of pure copper.
Type: Application
Filed: Mar 13, 2020
Publication Date: Oct 1, 2020
Inventors: TIEN-YAO CHANG (New Taipei City), CHE-WEI KUO (New Taipei City)
Application Number: 16/818,197
