Abstract: Embodiments hereof relate methods of delivering a valve prosthesis to an annulus of a native valve of a heart. A valve delivery system is introduced into a ventricle of the heart via a ventricular wall of the heart. The valve delivery system has a displacement component at the distal portion thereof. The valve prosthesis is in a delivery configuration and the displacement component is in a delivery state in which the displacement component has a first outer diameter. While the valve prosthesis is in the delivery configuration, the displacement component of the valve delivery system is radially expanded into an expanded state in which the displacement component has a second outer diameter greater than the first outer diameter. The valve delivery system is advanced towards the annulus of the native valve of the heart with the displacement component in the expanded state to displace chordae tendineae.

Abstract: An electrical cable is provided with a rounded insulated electrical conductor that transitions to a flattened section to fit into areas where the rounded portion does not fit. A round electrical conductor transitions to a flattened section for electrical conduction routing via the undercarriage of a vehicle, for routing under the carpeting of the passenger compartment, or other confined spaces. The electrical cable may illustratively be used in an electric car application where distribution of electrical current from the battery compartment to the motor requires additional wiring in the vehicle not found in combustion based engines. The reduced vertical profile of the flattened section provides for additional clearance between the vehicle undercarriage and the road, or between the undercarriage frame and the interior passenger compartment carpet.

Abstract: In one embodiment, a semiconductor package includes a first and a second die flag, wherein the first and second die flags are separated by a gap. First and second metal oxide semiconductor field effect transistor (MOSFET) die are on the first and the second die flags, respectively. A power control integrated circuit (IC) is stacked on top of at least one of the first or the second MOSFET die. A mold compound is encapsulating the power control IC, the first and second MOSFET die, and the first and second die flags.

Abstract: In one embodiment, a semiconductor package includes a first and a second die flag, wherein the first and second die flags are separated by a gap. First and second metal oxide semiconductor field effect transistor (MOSFET) die are on the first and the second die flags, respectively. A power control integrated circuit (IC) is stacked on top of at least one of the first or the second MOSFET die. A mold compound is encapsulating the power control IC, the first and second MOSFET die, and the first and second die flags.

Abstract: To investigate the quality and nature of perforations in a downhole environment, a ‘pecking’ finger and depth measuring probe that can be axially and radially displaced enables the perforation to be located and its depth determined, through sequentially pecking around the wall lining. By swinging a pecking finger supporting a depth measuring probe tip and measuring the displacement of the finger, the edge and center of the hole can be determined with the largest displacement being when the tip is fully in the hole. The depth measuring probe is then deployed and the depth of the perforation established by an increase in the force required to push the probe and by the displacement of the pecking finger as it is pushed back by the reaction forces. Radially extendable clamps at the ends of the tool fix the tool with a surrounding bore.

Abstract: Humanized anti-A? antibodies derived from a murine antibody directed to a N-terminal epitope of A? are described. The humanized antibodies have reduced or no human T cell epitopes and bind A? with an affinity similar to that of the murine antibody.

Abstract: A lead, method of manufacturing same, and system for stimulation is provided. The lead includes an insulative member or layer that masks a portion of the electrode(s) to effectively generate a directional lead that focuses or directs the stimulation to desired location(s). In another embodiment, the lead further includes a marking system to allow a clinician to orient the directional lead, as desired, while the lead is within a body.

Abstract: Methods and apparatus that change the mobility of formation fluids using thermal and non-thermal stimulation including, an example apparatus to simultaneously provide thermal and non-thermal stimulation to change a mobility of a fluid in a subsurface formation includes one or more containers to hold one or more reactants. Additionally, the example apparatus includes a reactor to initiate a chemical reaction with at least one of the reactants. Further, the example apparatus includes an injector to inject a product of the chemical reaction into a formation. The product of the chemical reaction includes heat and a gaseous diluent to change a mobility of a fluid in a subsurface formation.

Abstract: In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.

Abstract: A lead, method of manufacturing same, and system for stimulation is provided. The lead includes an insulative member or layer that masks a portion of the electrode(s) to effectively generate a directional lead that focuses or directs the stimulation to desired location(s). In another embodiment, the lead further includes a marking system to allow a clinician to orient the directional lead, as desired, while the lead is within a body.

Abstract: A lead, method of manufacturing same, and system for stimulation is provided. The lead includes an insulative member or layer that masks a portion of the electrode(s) to effectively generate a directional lead that focuses or directs the stimulation to desired location(s). In another embodiment, the lead further includes a marking system to allow a clinician to orient the directional lead, as desired, while the lead is within a body.

Abstract: Humanized anti-A? antibodies derived from a murine antibody directed to a N-terminal epitope of A? are described. The humanized antibodies have reduced or no human T cell epitopes and bind A? with an affinity similar to that of the murine antibody.

Abstract: In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.

Abstract: In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.

Abstract: A means of investigating the quality and/or nature of perforations in a downhole environment is disclosed. A ‘pecking’ finger and depth measuring probe that can be axially and radially displaced enables the perforation to be located and its depth determined, through sequentially pecking around the wall lining in patterns such as radial, axial, and spiral sequences. By swinging a pecking finger that supports a depth measuring probe or cable with a bullet or conically shaped tip and measuring the displacement of the finger, the edge and centre of the hole can be determined with the largest displacement being when the tip is fully in the hole. When this position has been determined, the depth measuring cable is deployed and the depth of the perforation can be established by both an increase in the force required to push the cable and by the displacement of the pecking finger as it is pushed back by the reaction forces on the cable.

Abstract: Humanized anti-A? antibodies derived from a murine antibody directed to a N-terminal epitope of A? are described. The humanized antibodies have reduced or no human T cell epitopes and bind A? with an affinity similar to that of the murine antibody.

Abstract: Methods and apparatus to change the mobility of formation fluids using thermal and non-thermal stimulation are described. An example apparatus to simultaneously provide thermal and non-thermal stimulation to change a mobility of a fluid in a subsurface formation includes one or more containers to hold one or more reactants. Additionally, the example apparatus includes a reactor to initiate a chemical reaction with at least one of the reactants. Further, the example apparatus includes an injector to inject a product of the chemical reaction into a formation. The product of the chemical reaction includes heat and a gaseous diluent to change a mobility of a fluid in a subsurface formation.

Abstract: A system for reinforcing a tower is disclosed. The system includes a number of vertically elongated primary support risers. Each riser is attached to the tower at a series of spaced apart locations.

Abstract: The present invention relates a modified human interferon beta (INF?) which is less immunogenic than human INF? (SEQ ID NO: 1) when administered in vivo to a human. The modified human INF? comprises an amino acid residue sequence that differs from SEQ ID NO: 1 by an amino acid residue substitution selected from the group consisting of L57A, L57C, L57D L57E, L57G, L57H, L57K, L57N, L57P, L57Q, L57R, L57S, and L57T and an additional substitution selected from the group consisting of the H140A, H140C, H140G, and H140P.

Abstract: In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.