Abstract: A spacer textile material may include a first layer, a second layer, and a plurality of connecting members extending between and joining the first layer and the second layer. The connecting members may form a series of at least ten rows that are separated by spaces. The rows have a width that is less than a width of the spaces, and the connecting members form at least one stabilizing row with a width that is greater than the width of the spaces.

Abstract: Antenna configurations for wireless speakers are disclosed. An example playback device includes a housing having a metallic face and a non-metallic face, the metallic face including an opening; a first antenna of a first type positioned within the housing adjacent an inner surface of the non-metallic face; and a second antenna of second type different from the first type positioned within the housing, the second antenna including a slot aligned with the opening of the metallic face.

Abstract: Numerous embodiments of an apparatus and method of a dielectric material having a low dielectric constant and good mechanical strength are described. In one embodiment a dielectric material having multiple porous regions is disposed over a substrate. A caged structure is bridged within the plurality of pores. In one particular embodiment, the caged structure may be carborane or a carborane derivative.

Abstract: Systems and methods for operating a portable computing device having a broad set of functionality, such as image or audio/video capture capabilities, are provided. One or more specialized modes are provided in a portable computing device, such as a smart phone, for intelligently disabling any distracting functionality of the portable computing device with respect to a target subset of functionality possessed by the device and invoked during operation of a specialized mode. In various embodiments, the special mode for operation of a portable computing device in accordance with the invention is such that functionality that is likely to interfere with a time capture event of the device is disabled or mitigated during operation.

Abstract: Numerous embodiments of an apparatus and method of a dielectric material having a low dielectric constant and good mechanical strength are described. In one embodiment a dielectric material having multiple porous regions is disposed over a substrate. A caged structure is bridged within the plurality of pores. In one particular embodiment, the caged structure may be carborane or a carborane derivative.

Abstract: A method and apparatus provides increased operative life for flip-chip devices that are produced from an integrated circuit formed with electrically conductive bumps bonded to a printed circuit board substrate. The bumps and the substrate are formed from similar materials that allow control of the degree of latency for each element and produce a covalently bonded laminate structure when the bumps and substrate are brought together. The covalently bonded structure decreases bump fatigue to lengthen the operative life of the flip-chip device.

Abstract: A pellicle made of a polymer material contains fullerenes within the polymer material to reduce the damaging effects of radiation that is transmitted through the pellicle during an exposure operation. The fullerenes may comprise nanotubes and/or buckyballs. The buckyballs may also enclose molecules of a gas that further reduce the damaging effects of the radiation on the polymer material.

Abstract: A pellicle made of a polymer material contains fullerenes within the polymer material to reduce the damaging effects of radiation that is transmitted through the pellicle during an exposure operation. The fullerenes may comprise nanotubes and/or buckyballs. The buckyballs may also enclose molecules of a gas that further reduce the damaging effects of the radiation on the polymer material.

Abstract: A method and apparatus provides increased operative life for flip-chip devices that are produced from an integrated circuit formed with electrically conductive bumps bonded to a printed circuit board substrate. The bumps and the substrate are formed from similar materials that allow control of the degree of latency for each element and produce a covalently bonded laminate structure when the bumps and substrate are brought together. The covalently bonded structure decreases bump fatigue to lengthen the operative life of the flip-chip device.

Abstract: A method and apparatus provides increased operative life for flip-chip devices that are produced from an integrated circuit formed with electrically conductive bumps bonded to a printed circuit board substrate. The bumps and the substrate are formed from similar materials that allow control of the degree of latency for each element and produce a covalently bonded laminate structure when the bumps and substrate are brought together. The covalently bonded structure decreases bump fatigue to lengthen the operative life of the flip-chip device.

Abstract: A method and apparatus provides increased operative life for flip-chip devices that are produced from an integrated circuit formed with electrically conductive bumps bonded to a printed circuit board substrate. The bumps and the substrate are formed from similar materials that allow control of the degree of latency for each element and produce a covalently bonded laminate structure when the bumps and substrate are brought together. The covalently bonded structure decreases bump fatigue to lengthen the operative life of the flip-chip device.

Abstract: Conductive polymer sheathed polymeric particulate powders comprise a polymeric core powder; and from about 5 to about 30 percent by weight of an intrinsically conductive polymer forming a sheath around the core powder. A method of providing corrosion protection to metal substrates comprises applying a conductive polymer sheathed polymeric particulate powder to a metal substrate to form a coating at least about 0.5 mils thick; wherein the conductive powder comprises a polymeric core powder; and from about 5 to about 30 percent by weight of an intrinsically conductive polymer forming a sheath around the core powder, the resulting conductive polymer powder having a particle size greater than about 1 micron.