Abstract: An arrangement for subsea cooling of a semiconductor module. The arrangement includes a tank. The tank is filled with a dielectric fluid. The arrangement includes at least one semiconductor module. The at least one semiconductor module is placed in the tank. Each at least one semiconductor module includes semiconductor submodules and is attached to a heat sink. The semiconductor submodules generate heat, thereby causing the dielectric fluid to circulate by natural convection. The heat sink includes a first part having a first thermal resistance from the semiconductor module to the dielectric fluid. The heat sink includes a second part having a second thermal resistance from the semiconductor module to the dielectric fluid. The second thermal resistance is higher than the first thermal resistance. The heat sink is oriented such that, when the arrangement is installed, the first part is configured to lie vertically higher than the second part.

Abstract: A thermal interface material sheet, method of manufacturing a thermal interface material sheet and an electrical device. The thermal interface material sheet is to be disposed between a heat generating electrical component and a cooling device, the thermal interface material sheet comprising at least one thin film sensor and electrical conductors connected to the at least one thin film sensor for measuring a property related to the heat generating electrical component.

Abstract: A cooling apparatus is disclosed with a base plate for receiving a heat load from an electric component, an evaporator, a condenser, and a connecting piece for passing fluid from the evaporator to the condenser. In order to efficiently fill the evaporator, the cooling apparatus is provided with a pump for pumping fluid from the condenser to the evaporator.

Abstract: A pressure compensated subsea electrical system and a pressure compensated subsea electrical system which has a housing filled with a dielectric liquid. The housing has a first housing portion and a second housing portion in pressure communication with each other. The first housing portion includes a transformer, and the second housing portion includes a power converter. The pressure compensated subsea electrical system includes a pressure compensator arranged to compensate pressure inside the housing. The pressure compensator is enabled to compensate pressure in both the first housing portion and the second housing portion.

Abstract: A cooling assembly comprising a plurality of fin elements stacked in a stack direction, a plurality of coolant channels each located between adjacent fin elements and extending in a coolant channel direction perpendicular to the stack direction, a first heat transfer surface adapted to be in contact with a heat generating element, and a second heat transfer surface spaced apart from the first heat transfer surface, the plurality of fin elements and the plurality of coolant channels being located between the first heat transfer surface and the second heat transfer surface. Each of the fin elements comprises a pulsating heat pipe embedded therein, a main pulsating direction of each of the pulsating heat pipes being substantially parallel to a normal of the first heat transfer surface.

Abstract: A pressure compensated subsea electrical system and a pressure compensated subsea electrical system which has a housing filled with a dielectric liquid. The housing has a first housing portion and a second housing portion in pressure communication with each other. The first housing portion includes a transformer, and the second housing portion includes a power converter. The pressure compensated subsea electrical system includes a pressure compensator arranged to compensate pressure inside the housing. The pressure compensator is enabled to compensate pressure in both the first housing portion and the second housing portion.

Abstract: An arrangement for subsea cooling of a semiconductor module. The arrangement includes a tank. The tank is filled with a dielectric fluid. The arrangement includes at least one semiconductor module. The at least one semiconductor module is placed in the tank. Each at least one semiconductor module includes semiconductor submodules and is attached to a heat sink. The semiconductor submodules generate heat, thereby causing the dielectric fluid to circulate by natural convection. The heat sink includes a first part having a first thermal resistance from the semiconductor module to the dielectric fluid. The heat sink includes a second part having a second thermal resistance from the semiconductor module to the dielectric fluid. The second thermal resistance is higher than the first thermal resistance. The heat sink is oriented such that, when the arrangement is installed, the first part is configured to lie vertically higher than the second part.

Abstract: A cooling assembly comprising a plurality of fin elements stacked in a stack direction, a plurality of coolant channels each located between adjacent fin elements and extending in a coolant channel direction perpendicular to the stack direction, a first heat transfer surface adapted to be in contact with a heat generating element, and a second heat transfer surface spaced apart from the first heat transfer surface, the plurality of fin elements and the plurality of coolant channels being located between the first heat transfer surface and the second heat transfer surface. Each of the fin elements comprises a pulsating heat pipe embedded therein, a main pulsating direction of each of the pulsating heat pipes being substantially parallel to a normal of the first heat transfer surface.

Abstract: The invention relates to a cooling apparatus comprising a base plate for receiving a heat load from an electric component, an evaporator, a condenser, and a connecting piece for passing fluid from the evaporator to the condenser. In order to efficiently fill the evaporator, the cooling apparatus is provided with a pump for pumping fluid from the condenser to the evaporator.

Abstract: Exemplary embodiments are directed to an equipment space that is a closed space provided with electrical equipment and an air dryer condensing the moisture of the air in the equipment space into water. A system for removing water from the equipment space includes a porous element having a capillary structure and being located in an outlet opening of the equipment space. The porous element is connected such that water condensed by the air dryer is directed to a first inner surface of the porous element. The capillary structure of the porous element is configured to propogate water from the inner surface of the porous element to an outer surface of the porous element. The outer surface of the porous element is configured to release water to ambient air outside the equipment space.

Abstract: This invention relates to a cooling apparatus comprising a first cooling element (5) with first channels (6) extending between a first manifold (1) and a second manifold (2) and with a base plate (9) with a first surface (10) for receiving a heat load from an electric component (11), and a second cooling element (14) with second channels (16) extending between a third manifold (3) and a fourth manifold (4). A first section (21) of the second cooling element (14) is provided with openings (19) for allowing an airflow (18) to pass through the first section (21). The second cooling element (14) comprises a second section (22) provided with openings (19), and the cooling apparatus is configured to conduct the airflow (18) which has passed through the first section (21) through the openings (19) of the second section (22).

Abstract: An arrangement and a method are provided in connection with a solar energy system. The arrangement includes solar panels and a converter for converting the DC voltage from the solar panels. The converter is arranged inside a container or a similar closed structure. The arrangement includes means for producing heat from the energy produced by the solar panels. The means are arranged inside the container or a similar closed structure and are electrically connectable to the solar panels.

Abstract: A cooling assembly is disclosed having a device chamber, a cooling chamber, a heat exchanger, a fan and a controller, the heat exchanger having a first heat exchanger unit and a second heat exchanger unit located above the first heat exchanger unit. The fan includes a first fan adapted to generate a first cooling air flow. The cooling assembly further includes a first dust tray located between the first heat exchanger unit and the second heat exchanger unit, the first cooling air flow being directed towards the first dust tray. The first dust tray is adapted to receive and retain at least part of contaminant particles present in the first cooling air flow, the device chamber being separated from the cooling chamber.

Abstract: A cooling device comprising a first chamber (1), a second chamber (2) separated from the first chamber (1), heat exchanger means (4) adapted to transfer heat from the first chamber (1) to the second chamber (2), and fan means. The first chamber (1) comprises an inlet flow opening (12) and an outlet flow opening (14). The fan means is adapted to generate a first cooling medium flow (511) inside the first chamber (1) between the inlet flow opening (12) and the outlet flow opening (14) such that heat is transferred from the first cooling medium flow (511) into the heat exchanger means.

Abstract: A method and arrangement are provided for reducing the amount of condensed moisture inside an enclosure which encloses at least one piece of electrical equipment which is configured to receive electric power from outside the enclosure in a first electrical magnitude range (0 . . . maxinput) and to feed electric power to outside the enclosure in a second electrical magnitude range (minoutput . . . maxoutput). Electric power received on at least one portion (a, b, c) of the first electrical magnitude range (0 . . . maxinput) being outside the second electrical magnitude range (minoutput . . . maxoutput) is utilized for heating the condensed moisture for exhaustion thereof.

Abstract: An arrangement and a method are provided in connection with a solar energy system. The arrangement includes solar panels and a converter for converting the DC voltage from the solar panels. The converter is arranged inside a container or a similar closed structure. The arrangement includes means for producing heat from the energy produced by the solar panels. The means are arranged inside the container or a similar closed structure and are electrically connectable to the solar panels.

Abstract: A cooled base plate is provided for electric components. A first side of the cooled base plate is provided for attaching exothermal electric components thereto. On a second side of the base plate, opposite to the first side, there is embedded a cooling channel system having a cooling fluid inlet at a first end of the base plate and a cooling fluid outlet at a second end of the base plate. In order to minimize differences in temperature between the electric components, the thickness of the base plate increases in the direction from the inlet of the cooling channel system towards the outlet of the cooling channel system, e.g., in the flow direction of the cooling fluid, for at least a portion of the length of the base plate.

Abstract: A cooling assembly includes a device chamber, a cooling chamber separated from the device chamber, a heat exchanger, a device chamber fan arrangement and a control unit. The heat exchanger includes a first portion located in the device chamber and a second portion located in the cooling chamber for transferring heat from the device chamber to the cooling chamber. The device chamber fan arrangement is configured to generate a device chamber cooling medium flow including a first partial flow interacting with the first portion of the heat exchanger. The cooling assembly also includes a first throttle arrangement for regulating the first partial flow. The control unit is configured to reduce a cooling power of the heat exchanger as a response to predetermined operating conditions by decreasing the first partial flow with the first throttle arrangement.

Abstract: A cooling assembly includes a device chamber containing a device chamber cooling medium, a heat exchanger including at least one cooling surface in contact with the device chamber cooling medium, a control unit configured to control the heat exchanger, a humidity sensor configured to detect a humidity level in the device chamber, and a receptacle. The control unit is configured to perform a dehumidification operation as a response to the humidity level exceeding a predetermined threshold value in the device chamber. The dehumidification operation includes lowering a temperature of the at least one cooling surface in order to condensate water from the device chamber cooling medium on the at least one cooling surface. The receptacle is configured to receive water dripping from the at least one cooling surface.

Abstract: Exemplary embodiments are directed to an equipment space that is a closed space provided with electrical equipment and an air dryer condensing the moisture of the air in the equipment space into water. A system for removing water from the equipment space includes a porous element having a capillary structure and being located in an outlet opening of the equipment space. The porous element is connected such that water condensed by the air dryer is directed to a first inner surface of the porous element. The capillary structure of the porous element is configured to propogate water from the inner surface of the porous element to an outer surface of the porous element. The outer surface of the porous element is configured to release water to ambient air outside the equipment space.