COOLING APPARATUS
This invention relates to a cooling apparatus comprising a first cooling element (5) with first channels (6) extending between a first manifold (1) and a second manifold (2) and with a base plate (9) with a first surface (10) for receiving a heat load from an electric component (11), and a second cooling element (14) with second channels (16) extending between a third manifold (3) and a fourth manifold (4). A first section (21) of the second cooling element (14) is provided with openings (19) for allowing an airflow (18) to pass through the first section (21). The second cooling element (14) comprises a second section (22) provided with openings (19), and the cooling apparatus is configured to conduct the airflow (18) which has passed through the first section (21) through the openings (19) of the second section (22).
1. Field of the Invention
This invention relates to a cooling apparatus for cooling an electric component.
2Description of Prior Art
Previously there is known a heat sink to which an electric component may be attached in order to cool the electric component. Such a heat sink is provided with a surface area which is as large as possible in order to dissipate heat into the surrounding air as efficiently as possible. A problem with such a heat sink is that the electric component may produce a greater heat load than the heat sink is capable of dissipating. This typically occurs when the available space is limited and the surface area of the heat sink can therefore not be increased to a sufficient size.
Previously there is also known a cooling device where a fluid is utilized in order to handle a heat load produced by an electric component. In this cooling device the electric component is attached to an evaporator which provides a condenser with heated fluid. The condenser dissipates the heat from the fluid to the surrounding air.
It would be advantageous if the known cooling device could be used in place of the known heat sink in order to obtain a more efficient cooling in existing electric devices. However, in many existing electric devices the space where the heat sink is located is too small for an above mentioned cooling device utilizing fluid circulation.
SUMMARY OF THE INVENTIONAn object of the present invention is to provide a cooling apparatus which can be used in various implementations in order to provide efficient cooling. This object is achieved with a cooling apparatus according to independent claim 1.
The use of a cooling apparatus with a first and second section through which the airflow is conducted makes it possible to obtain a compact and efficient cooling apparatus.
Preferred embodiments of the invention are disclosed in the dependent claims.
In the following the present invention will be described in closer detail by way of example and with reference to the attached drawings, in which
The first element 5 additionally comprises a base plate 9. A first surface 10 of the base plate is provided with an electric component 11 (or more than one electric component). During use the electric component 11 produces a heat load which is received by the base plate via the first surface. In the illustrated example a second surface 12 of the base plate 9 is provided with grooves 13 into which the pipes 7 with the first channels 6 are arranged. Heat originating from the electric component 11 is therefore efficiently passed on to fluid in the first channels 6.
The first cooling element 5 may operate as an evaporator, in which case the fluid evaporates due to heat originating from the electric component, and as a consequence the fluid is transferred upwards in
The cooling apparatus additionally comprises a second cooling element 14 with second channels 16 extending from a third manifold 3 to a fourth manifold 4. Similarly as the first channels, also the second channels 16 may be arranged into tubes 17 having longitudinal internal walls separating the second channels 16 from each other. In practice, the tubes 17 may be similar as tubes 7 illustrated in
An airflow 18 is provided to pass via openings 19 between the second channels 16, which in the illustrated example are located in different tubes 17, in order to cool the fluid in the second channels 16 of the second cooling element. The second cooling element 14 may operate as a condenser, in which case the fluid may condensate into a liquid state while moving through the second channels 16 towards the fourth manifold 4. A tube 15 provides fluid communication between the fourth manifold 4 and the first manifold 1 such that the fluid which has been cooled may enter the lower part of the first manifold 1. When the cooling apparatus is kept in the upright position illustrated in
In order to obtain efficient cooling, the cooling apparatus is configured to conduct the airflow 18 to pass through openings 19 in a first section 21 of the second cooling element 14 and subsequently also through a second section 22 of the second cooling element 14. In the illustrated example the same airflow passes still through a third section 23 of the second cooling element 14. A third section is, however, not necessary in all embodiments. Due to the fact that the same airflow passes through more than one section of the second cooling element 14, the cooling capabilities of the airflow 18 can be very efficiently utilized, which gives the cooling apparatus excellent cooling properties despite of the fact that the cooling apparatus may be implemented as a very compact and space saving cooling apparatus. The cooling capabilities become even more better if the openings are provided with fins 24 extending between the second channels 16 (and tubes 17) as illustrated in
In the example of
From
In the embodiment of
In
It is to be understood that the above description and the accompanying figures are only intended to illustrate the present invention. It will be obvious to a person skilled in the art that the invention can be varied and modified without departing from the scope of the invention.
Claims
1. A cooling apparatus comprising:
- a first cooling element with first channels extending between a first manifold and a second manifold and with a base plate with a first surface for receiving a heat load from an electric component and for passing said heat load into a fluid in the first channels, and
- a second cooling element with second channels extending between a third manifold and a fourth manifold, the third manifold of the second cooling element is arranged to receive fluid from the second manifold of the first cooling element and to pass the received fluid via the second channels to the fourth manifold, a first section of the second cooling element is provided with openings for allowing an airflow to pass through the first section, the second cooling element comprising a second section provided with openings, and
- the cooling apparatus is configured to conduct the airflow which has passed through the first section through the openings of the second section.
2. The cooling apparatus according to claim 1, wherein the second cooling element is curved and wherein the first and second sections of the second cooling element consists of different parts of the curved second cooling element.
3. The cooling apparatus according to claim 1, wherein the first section and the second section of the second cooling element are in fluid communication with each other via one or more additional manifolds.
4. The cooling apparatus according to claim 1, wherein the first section and the second section of the second cooling element are stacked on top of each other whereby the airflow is conducted straight forward through the openings of the first and second sections without any substantial changes in the flow direction.
5. The cooling apparatus according to claim 1, wherein
- the cooling apparatus is provided with an intermediate space which the airflow enters once the airflow has passed through the first section, and
- the intermediate space is shaped to change the flow direction to conduct the airflow towards the second section.
6. The cooling apparatus according to claim 1, wherein the base plate comprises a second surface arranged along a part of the flow path of the airflow to dissipate heat directly from the base plate to the airflow.
7. The cooling apparatus according to claim 1, wherein the second surface of the base plate conducts the airflow towards the second section by changing the direction of the airflow.
8. The cooling apparatus according to claim 1, wherein at least one of the first channels of the first cooling element or of the second channels of the second cooling element are arranged into a plurality of tubes, such that longitudinal walls of the tubes separates the first channels or second channels of one tube, respectively, from each other.
9. The cooling apparatus according to claim 1, wherein the openings of the second cooling element are provided with fins extending between the second channels.
10. The cooling apparatus according to claim 1, wherein the cooling apparatus is provided with a fan for producing the airflow.
Type: Application
Filed: Jan 5, 2016
Publication Date: Jul 14, 2016
Inventors: Anna Rumpunen (Helsinki), Bruno Agostini (Zurich), Mathieu Habert (Rheinfelden), Roman Jauhonen (Helsinki), Timo Koivuluoma (Vantaa)
Application Number: 14/988,225