Abstract: An extreme ultraviolet exposure apparatus includes a radiation system configured to supply a beam of extreme ultraviolet radiation; a support configured to support a patterning device, the patterning device configured to pattern the beam of extreme ultraviolet radiation according to a desired pattern; a substrate table having an area configured to support a substrate; a projection system configured to project the patterned beam of extreme ultraviolet radiation onto a target portion of the substrate, the projection system comprising a reflective optical system; wherein at least a part of the apparatus that during use of the apparatus is exposed to the beam of extreme ultraviolet radiation is coated with a coating, the coating comprising a metal oxide, or a photocatalyst, or a semiconductor, or any combination thereof.

Abstract: A lithographic projection apparatus is disclosed in which a space between the projection system and the substrate is filled with a liquid. An edge seal member at least partly surrounds the substrate or other object on a substrate table to prevent liquid loss when edge portions of the substrate or other object are, for example, imaged or illuminated.

Abstract: An immersion lithographic projection apparatus is disclosed in which liquid is provided between a projection system of the apparatus and a substrate. The use of both liquidphobic and liquidphilic layers on various elements of the apparatus is provided to help prevent formation of bubbles in the liquid and to help reduce residue on the elements after being in contact with the liquid.

Abstract: A lithographic projection apparatus is disclosed in which a space between the projection system and the substrate is filled with a liquid. An edge seal member at least partly surrounds the substrate or other object on a substrate table to prevent liquid loss when edge portions of the substrate or other object are, for example, imaged or illuminated. A lithographic projection apparatus includes a support structure configured to hold a patterning device, the patterning device configured to pattern a beam of radiation according to a desired pattern; a substrate table configured to hold a substrate; a projection system configured to project the patterned beam onto a target portion of the substrate; a liquid supply system configured to provide liquid to a space between the projection system and the substrate; and a shutter configured to isolate the space from the substrate or a space to be occupied by a substrate.

Abstract: An exposure apparatus includes a radiation system configured to supply a projection beam of radiation, and a patterning device configured to pattern the projection beam according to a desired pattern. The apparatus includes a substrate table having an area configured to support a substrate, and a projection system configured to project the patterned beam onto a target portion of the substrate. At least a part of the apparatus that during use of the apparatus is exposed to radiation is coated with a coating. The coating includes a metal oxide, or a photocatalyst, or a semiconductor, or any combination thereof.

Abstract: A lithographic projection apparatus is disclosed in which a space between the projection system and a sensor is filled with a liquid.

Abstract: A lithographic projection apparatus is disclosed in which a space between the projection system and the substrate is filled with a liquid. An edge seal member at least partly surrounds the substrate or other object on a substrate table to prevent liquid loss when edge portions of the substrate or other object are, for example, imaged or illuminated.

Abstract: A lithographic projection apparatus is disclosed in which a space between the projection system and a sensor is filled with a liquid.

Abstract: A lithographic projection apparatus is disclosed in which a space between the projection system and a sensor is filled with a liquid.

Abstract: A lithographic apparatus is provided that has a sensor at substrate level, the sensor including a radiation receiver, a transmissive plate supporting the radiation receiver, and a radiation detector, wherein the sensor is arranged to avoid loss of radiation between the radiation receiver and a final element of the radiation detector.

Abstract: A lithographic projection apparatus is disclosed in which a space between the projection system and a sensor is filled with a liquid.

Abstract: A lithographic projection apparatus is disclosed in which a space between the projection system and a sensor is filled with a liquid.

Abstract: An immersion lithographic projection apparatus is disclosed in which liquid is provided between a projection system of the apparatus and a substrate. The use of both liquidphobic and liquidphilic layers on various elements of the apparatus is provided to help prevent formation of bubbles in the liquid and to help reduce residue on the elements after being in contact with the liquid.

Abstract: A lithographic projection apparatus in which a liquid supply system and the geometry of the objects on the substrate table are arranged to avoid high velocity immersion liquid flowing over sensors.

Abstract: A lithographic apparatus is provided that has a sensor at substrate level, the sensor including a radiation receiver, a transmissive plate supporting the radiation receiver, and a radiation detector, wherein the sensor is arranged to avoid loss of radiation between the radiation receiver and a final element of the radiation detector.

Abstract: A lithographic projection apparatus is disclosed in which a space between the projection system and the substrate is filled with a liquid. An edge seal member at least partly surrounds the substrate or other object on a substrate table to prevent liquid loss when edge portions of the substrate or other object are, for example, imaged or illuminated.

Abstract: A projection system (PS) is provided which includes, in an embodiment, two frames. The optical elements of the projection system are mounted on a first frame (200). The position of the optical elements is measured relative to a second frame (300) using a first measurement system (910). A second measurement system (920) is used to measure a parameter associated with a deformation of the second frame. The measurement made by the second measurement system can be used to compensate for any errors in the position of the optical elements as measured by the first measurement system resulting from deformations of the second frame. Typically, deformations of the frames are due to resonant oscillation and thermal expansion. Having two frames enables the optical elements of the projection system to be positioned with a high degree of accuracy.

Abstract: An illuminator for a lithographic apparatus includes a first illuminator channel, a second illuminator channel, a first switch device, an additional illuminator part and a second switch device. Each of the first and the second illuminator channel includes elements which are adjustable to provide a radiation beam with at least one desired property. The first switch device is configured to receive the radiation beam and arranged to direct the radiation beam between the first and second illuminator channels. The second switch device is arranged to receive the radiation beam from the first and second illuminator channels and direct the radiation beam through the additional illuminator part. The additional illuminator part includes elements which apply at least one additional desired property to the radiation beam.

Abstract: A lithographic apparatus is provided that has a sensor at substrate level, the sensor including a radiation receiver, a transmissive plate supporting the radiation receiver, and a radiation detector, wherein the sensor is arranged to avoid loss of radiation between the radiation receiver and a final element of the radiation detector.

Abstract: In a lithographic apparatus, a corrective irradiation procedure is performed using an illumination mode arranged so as to heat a selected part of an element of the projection system near a pupil plane thereof that is relatively unheated during production exposure. The corrective irradiation procedure aims to improve uniformity of optical element heating of the projective system and/or to reduce a phase gradient.