Patents by Inventor Timothy A. Lemke

Timothy A. Lemke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8827746
    Abstract: An apparatus includes a backplane having a ground plane. Conductor through holes extend through the backplane in rows and columns for conductors to project through the backplane in orthogonal arrays. Each row and column of the conductor through holes includes ground holes, each of which is sized to receive only a single ground conductor, with the single ground conductor in connection with the ground plane. Each row and column of the conductor through holes also includes signal holes, each of which is sized to receive only a single signal conductor, with the single signal conductor free of a connection with the ground plane. The backplane further has a plurality of nonconductor through holes at locations between and offset from the rows and columns of conductor through holes, with each of the plurality of nonconductor through holes having plating electrically connected to the ground plane.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: September 9, 2014
    Assignee: Z-Plane, Inc.
    Inventors: Timothy A. Lemke, Charles C. Byer
  • Publication number: 20130034978
    Abstract: An apparatus includes a backplane having a ground plane. Conductor through holes extend through the backplane in rows and columns for conductors to project through the backplane in orthogonal arrays. Each row and column of the conductor through holes includes ground holes, each of which is sized to receive only a single ground conductor, with the single ground conductor in connection with the ground plane. Each row and column of the conductor through holes also includes signal holes, each of which is sized to receive only a single signal conductor, with the single signal conductor free of a connection with the ground plane. The backplane further has a plurality of nonconductor through holes at locations between and offset from the rows and columns of conductor through holes, with each of the plurality of nonconductor through holes having plating electrically connected to the ground plane.
    Type: Application
    Filed: July 30, 2012
    Publication date: February 7, 2013
    Inventors: Timothy A. Lemke, Charles C. Byer
  • Patent number: 8167630
    Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also disclosed is a method for manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side of the into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portion of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the housing, thereby reducing warpage. Solder resist areas are formed on central portions of the contacts to promote uniformity of solder volume.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: May 1, 2012
    Assignee: FCI Americas Technology LLC
    Inventors: Timothy A. Lemke, Timothy W. Houtz
  • Patent number: 8120926
    Abstract: A backplane has through holes for conductors to project through the backplane in arrays corresponding to respective circuit boards arranged along the front side of the backplane. The through holes include ground holes for receiving ground conductors in connection with a ground plane, and signal holes for receiving signal conductors free of connections with the ground plane. In accordance with a principal feature, the backplane is free of circuitry configured to interconnect signal conductors in the signal holes. This avoids problems associated with circuit density within the structure of a backplane. In accordance with another principal feature, each signal hole is wide enough to provide clearance for a respective signal conductor to extend fully through the signal hole free of contact with the backplane.
    Type: Grant
    Filed: November 20, 2008
    Date of Patent: February 21, 2012
    Assignee: Z-Plane, Inc.
    Inventors: Timothy A. Lemke, Charles C. Byer
  • Patent number: 7927149
    Abstract: An apparatus electrically interconnects pins that project from the rear side of a backplane in separate arrays corresponding to respective circuit boards at the front side of the backplane. The apparatus comprises a connector board assembly extending across the rear side of the backplane between separate arrays of pins. The connector board assembly has signal routing circuitry that electrically interconnects those separate arrays of pins. This enables the respective printed circuit boards to be electrically interconnected independently of any signal routing circuitry within the structure of the backplane. Accordingly, the apparatus preferably includes a backplane that is free of signal routing circuitry for interconnecting pins that extend through the backplane.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: April 19, 2011
    Assignee: Z-Plane, Inc.
    Inventor: Timothy A. Lemke
  • Publication number: 20110076897
    Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also disclosed is a method for manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side of the into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portion of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the housing, thereby reducing warpage. Solder resist areas are formed on central portions of the contacts to promote uniformity of solder volume.
    Type: Application
    Filed: September 27, 2010
    Publication date: March 31, 2011
    Inventors: Timothy A. Lemke, Timothy W. Houtz
  • Patent number: 7802999
    Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.
    Type: Grant
    Filed: January 12, 2009
    Date of Patent: September 28, 2010
    Assignee: FCI Americas Technology LLC
    Inventors: Timothy A. Lemke, Timothy W. Houtz
  • Patent number: 7712179
    Abstract: A convenient ticket scraper is comfortable for use in scraping various surfaces and consists of a main body with a guitar pick shape and an arcuate protruding blade. The main body has a banana shaped key ring hole in one end and the arcuate protruding blade with the thickness of a coin in the other end. There is an even beveled area covered by rubber on each side of the main body for a thumb and a forefinger. An appealing version of this scraper is also disclosed.
    Type: Grant
    Filed: May 10, 2007
    Date of Patent: May 11, 2010
    Inventor: Patrick Timothy Lemke
  • Publication number: 20100099306
    Abstract: An apparatus electrically interconnects pins that project from the rear side of a backplane in separate arrays corresponding to respective circuit boards at the front side of the backplane. The apparatus comprises a connector board assembly extending across the rear side of the backplane between separate arrays of pins. The connector board assembly has signal routing circuitry that electrically interconnects those separate arrays of pins. This enables the respective printed circuit boards to be electrically interconnected independently of any signal routing circuitry within the structure of the backplane. Accordingly, the apparatus preferably includes a backplane that is free of signal routing circuitry for interconnecting pins that extend through the backplane.
    Type: Application
    Filed: December 23, 2009
    Publication date: April 22, 2010
    Applicant: Z-Plane, Inc.
    Inventor: Timothy A. Lemke
  • Patent number: 7654870
    Abstract: An apparatus electrically interconnects pins that project from the rear side of a backplane in separate arrays corresponding to respective circuit boards at the front side of the backplane. The apparatus comprises a connector board assembly extending across the rear side of the backplane between separate arrays of pins. The connector board assembly has signal routing circuitry that electrically interconnects those separate arrays of pins. This enables the respective printed circuit boards to be electrically interconnected independently of any signal routing circuitry within the structure of the backplane. Accordingly, the apparatus preferably includes a backplane that is free of signal routing circuitry for interconnecting pins that extend through the backplane.
    Type: Grant
    Filed: October 17, 2008
    Date of Patent: February 2, 2010
    Assignee: Z-Plane, Inc.
    Inventor: Timothy A. Lemke
  • Publication number: 20090203263
    Abstract: An apparatus electrically interconnects pins that project from the rear side of a backplane in separate arrays corresponding to respective circuit boards at the front side of the backplane. The apparatus comprises a connector board assembly extending across the rear side of the backplane between separate arrays of pins. The connector board assembly has signal routing circuitry that electrically interconnects those separate arrays of pins. This enables the respective printed circuit boards to be electrically interconnected independently of any signal routing circuitry within the structure of the backplane. Accordingly, the apparatus preferably includes a backplane that is free of signal routing circuitry for interconnecting pins that extend through the backplane.
    Type: Application
    Filed: October 17, 2008
    Publication date: August 13, 2009
    Inventor: Timothy A. Lemke
  • Publication number: 20090201658
    Abstract: A backplane has through holes for conductors to project through the backplane in arrays corresponding to respective circuit boards arranged along the front side of the backplane. The through holes include ground holes for receiving ground conductors in connection with a ground plane, and signal holes for receiving signal conductors free of connections with the ground plane. In accordance with a principal feature, the backplane is free of circuitry configured to interconnect signal conductors in the signal holes. This avoids problems associated with circuit density within the structure of a backplane. In accordance with another principal feature, each signal hole is wide enough to provide clearance for a respective signal conductor to extend fully through the signal hole free of contact with the backplane.
    Type: Application
    Filed: November 20, 2008
    Publication date: August 13, 2009
    Inventors: Timothy A. Lemke, Charles C. Byer
  • Publication number: 20090191731
    Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.
    Type: Application
    Filed: January 12, 2009
    Publication date: July 30, 2009
    Inventors: TIMOTHY A. LEMKE, Timothy W. Houtz
  • Patent number: 7476110
    Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.
    Type: Grant
    Filed: January 29, 2007
    Date of Patent: January 13, 2009
    Assignee: FCI Americas Technology, Inc.
    Inventors: Timothy A. Lemke, Timothy W. Houtz
  • Patent number: 7442054
    Abstract: An electrical connector according to the invention may include a first signal contact that defines a first side and a first edge, wherein the first side is greater in length than the first edge, the first edge having a first edge width, and a second signal contact that defines a second side and a second edge, wherein the second side is greater in length that the second edge, the second edge having a second edge width. The first signal contact and the second signal contact may be positioned edge-to-edge. A gap may be defined between the first edge of the first signal contact and the second edge of the second signal contact. The gap may have a gap width that is approximately equal to at least one of the first edge width and the second edge width. The connector may have a column pitch, and the gap width may be based on the column pitch. The gap width may be approximately 0.3-0.4 millimeters.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: October 28, 2008
    Assignee: FCI Americas Technology, Inc.
    Inventors: Timothy A. Lemke, Steven E. Minich, Joseph B. Shuey, Gregory A. Hull, Stephen B. Smith
  • Publication number: 20080248693
    Abstract: A shieldless, high-speed electrical connector is disclosed. Such a connector may include a first column of electrical contacts comprising a first arrangement of differential signal pairs separated from one another by first ground contacts, and a second column of electrical contacts adjacent to the first column, the second column of electrical contacts comprising a second arrangement of differential signal pairs separated from one another by second ground contacts. The connector may be devoid of electrical shield plates between the first column of electrical contacts and the second column of electrical contacts. The connector may be capable of transferring differential signals at data transfer rates of at least ten gigabits per second through the connector while producing no more than an acceptable level of cross talk on any of the differential signal pairs.
    Type: Application
    Filed: June 17, 2008
    Publication date: October 9, 2008
    Applicant: FCI Americas Technology, Inc.
    Inventors: Clifford L. Winings, Joseph B. Shuey, Timothy A. Lemke, Gregory A. Hull, Stephen B. Smith, Stefaan Hendrik Jozef Sercu, Timothy W. Houtz, Steven E. Minich
  • Publication number: 20080214029
    Abstract: An electrical connector that includes a mass disposed within the connector such that the connector has a first center of gravity in the absence of the mass and a second center of gravity with the mass is disclosed. Such a connector may include a connector housing and an insert molded leadframe assembly (IMLA) positioned within the connector housing. The IMLA may include an array of electrically-conductive contacts and a dielectric leadframe housing overmolded onto the array of contacts. The mass may be disposed within the connector such that the mass causes the connector to be balanced. The connector may be unbalanced about the first center of gravity and balanced about the second center of gravity. The connector may be a right angle, ball grid array connector.
    Type: Application
    Filed: January 26, 2007
    Publication date: September 4, 2008
    Inventors: Timothy A. Lemke, Timothy W. Houtz
  • Publication number: 20080163441
    Abstract: A convenient ticket scraper is comfortable for use in scraping various surfaces and consists of a main body with a guitar pick shape and an acruate protruding blade. The main body has a banana shaped key ring hole in one end and the acruate protruding blade with the thickness of a coin in the other end. There is an even beveled area covered by rubber on each side of the main body for a thumb and a forefinger. An appealing version of this scraper is also disclosed.
    Type: Application
    Filed: May 10, 2007
    Publication date: July 10, 2008
    Inventor: Patrick Timothy Lemke
  • Patent number: 7390218
    Abstract: An electrical connector having a leadframe housing, a first electrical contact fixed in the leadframe housing, a second electrical contact fixed adjacent to the first electrical contact in the leadframe housing, and a third electrical contact fixed adjacent to the second electrical contact in the leadframe housing is disclosed. Each of the first and second electrical contacts may be selectively designated, while fixed in the lead frame housing, as either a ground contact or a signal contact such that, in a first designation, the first and second contacts form a differential signal pair, and, in a second designation, the second contact is a single-ended signal conductor. The third electrical contact may be a ground contact having a terminal end that extends beyond terminal ends of the first and second contacts.
    Type: Grant
    Filed: December 14, 2006
    Date of Patent: June 24, 2008
    Assignee: FCI Americas Technology, Inc.
    Inventors: Stephen B. Smith, Joseph B. Shuey, Stefaan Hendrik Jozef Sercu, Timothy A. Lemke, Clifford L. Winings
  • Patent number: 7331800
    Abstract: An electrical connector that includes first and second linear arrays of electrical contacts is disclosed. The first linear array includes a first differential signal pair, a first ground contact lead adjacent to the first differential signal pair, and a second ground contact lead adjacent to the first ground contact lead. The second linear array is positioned adjacent to the first linear array, and includes a second differential signal pair, a third ground contact lead adjacent to the second differential signal pair, and a fourth ground contact lead adjacent to the third ground contact lead. The electrical connector is devoid of electrical shields between the first linear array and the second linear array.
    Type: Grant
    Filed: January 5, 2006
    Date of Patent: February 19, 2008
    Assignee: FCI Americas Technology, Inc.
    Inventors: Clifford L. Winings, Joseph B. Shuey, Timothy A. Lemke, Gregory A. Hull, Stephen B. Smith, Stefaan Hendrik Jozef Sercu, Timothy W. Houtz, Steven E. Minich