Abstract: An interconnected printhead die and carrier substrate system for a printhead in hard-copy-producing devices used to print on print media includes a printhead die and a carrier substrate. The die and the substrate are coupled and each has an operative face separated from an inner face, and includes integrated circuits formed therein. At least three spacers are positioned between the die and substrate to define a space that is filled with an adhesive/under-fill layer. An electrical-connection region is located adjacent the inner faces of the die and substrate, and is effective to accommodate bilateral communication between integrated circuits formed on the die and the substrate. The die and the substrate may also have a stepped shape, and a cavity is formed by the stepped die and stepped substrate, with the electrical-connection region being located in the cavity. The electrical-connection region is also encapsulated with an encapsulant that may fill the cavity.

Abstract: A method and apparatus for maintaining the state of a MEMS device in the event of a power failure are disclosed. The apparatus and method may be used with a MEMS device generally having one or more MEMS elements moveably coupled to a substrate that uses electrostatic clamping force to sustain the state of the MEMS element. According to the method, a capacitive or other charge-storing circuit is coupled between a clamping surface and an electrical ground. During normal operation, a clamping voltage is applied between the clamping surface and at least one MEMS element to retain the at least one MEMS element against the clamping surface. In the event of a power failure, the source of the clamping voltage and other circuit paths to ground are isolated from the clamping surface. The charge-storing circuit maintains an electric charge on the clamping surface.

Abstract: A method and apparatus for maintaining the state of a MEMS device in the event of a power failure are disclosed. The apparatus and method may be used with a MEMS device generally having one or more MEMS elements moveably coupled to a substrate that uses electrostatic clamping force to sustain the state of the MEMS element. According to the method, a capacitive or other charge-storing circuit is coupled between a clamping surface and an electrical ground. During normal operation, a clamping voltage is applied between the clamping surface and at least one MEMS element to retain the at least one MEMS element against the clamping surface. In the event of a power failure, the source of the clamping voltage and other circuit paths to ground are isolated from the clamping surface. The charge-storing circuit maintains an electric charge on the clamping surface.

Abstract: An apparatus and method of fabricating a flextensional transducer capable of ejecting a flowable material is disclosed. The method of fabricating a flextensional transducer capable of ejecting a flowable material includes ultrasonically metal welding an actuator body having an outer diameter and an aperture to a transducer membrane having an outer diameter and an aperture. The transducer membrane is also ultrasonically metal welded to a gland or nozzle capable of housing a portion of the flowable material. The gland or nozzle includes a surface adjacent to the transducer membrane having an aperture. The outer diameter of the actuator body is smaller than the aperture of the gland or nozzle.

Abstract: An interconnected printhead die and carrier substrate system for a printhead in hard-copy-producing devices used to print on print media includes a printhead die and a carrier substrate. The die and the substrate are coupled and each has an operative face separated from an inner face, and includes integrated circuits formed therein. At least three spacers are positioned between the die and substrate to define a space that is filled with an adhesive/under-fill layer. An electrical-connection region is located adjacent the inner faces of the die and substrate, and is effective to accommodate bilateral communication between integrated circuits formed on the die and the substrate. The die and the substrate may also have a stepped shape, and a cavity is formed by the stepped die and stepped substrate, with the electrical-connection region being located in the cavity. The electrical-connection region is also encapsulated with an encapsulant that may fill the cavity.

Abstract: A backpressure sensor is integrated into a printhead die, or alternatively to a pen body. The backpressure sensor is susceptible to ink pressure from ink within a printhead ink slot, ink channel or nozzle chamber, and to ambient pressure. For the alternative embodiment, the backpressure sensor is susceptible to ink pressure from ink within an ink slot, ink channel or ink cavity away from a printhead die, and to ambient pressure.

Abstract: A printhead is formed from a plurality of ink ejectors mounted on an inner surface of a rigid substrate while protruding through holes provided in the substrate. Electrical contact is provided on a surface of the ink ejectors common with the ink ejecting nozzles thereby avoiding vias to another surface. The rigid substrate provides a conducting layer on its inner surface such that the ink ejectors may be connected thereto with solder reflow techniques.

Abstract: A printhead used to eject fluid onto a recording medium has an integrated heat-sink which is used to cool the energy dissipation elements used to propel the fluid from the printhead. The printhead is comprised of a semiconductor substrate that has been processed with thin-film layers. On top of the thin-film layers is an orifice layer that has a pattern of orifices. Fluid feed channels, on the side of the printhead opposite the orifice, supply fluid to the pattern of orifices. Within the thin-film layers are energy dissipating elements which are used to transfer energy to the fluid thereby ejecting fluid from the orifice. The fluid is transferred to the orifice opening through fluid feed slots formed in the thin-film layer adjacent to the energy dissipation elements which is exposed in the fluid feed channel. An integrated heat-sink is attached to the energy dissipation elements to remove heat to the semiconductor substrate and the fluid supply in the fluid feed channel.