Abstract: A process for making modified diethylenetriaminepentaacetic acid (DTPA)-associated media for use in solid-liquid extraction of rare earth elements is disclosed. The process includes functionalizing DTPA with hydrophobic groups to form modified DTPA; dissolving the modified DTPA into a methanol solution; loading the modified DTPA solution to a solid support; rotating the modified DTPA-loaded solid support to allow for association; and removing the methanol to obtain the modified-DTPA-associated media.

Abstract: Embodiments of the present disclosure present devices, methods, and computer readable medium for enabling a user to quickly and easily filter and search a digital asset collection. The disclosed techniques allow for rapid recall of desired digital assets, linking assets into logical collections, and an overall improved user experience. The zero keyword/contextual keyword feature presents multimedia content icons and searchable keywords to allow a user to search the digital asset collection simply by tapping on one of these keywords. The top auto completion feature auto-completes suggestions in the search field based on various heuristics to ensure the method produces diverse and relevant results. The next keyword suggestion feature predicts a next search term based on learned properties about the digital asset collection. The semantical synonym and syntax synonym features expand an indexed vocabulary to allow broader searching.

Abstract: A LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. The lead frame has stress relief slots formed in the undersides of the lead elements proximate the adhesive to accommodate filler particles lodged between the leads and the active surface of the die during transfer molding of a plastic encapsulant. The increased space created by the slots and flexure in the leads about the slots reduces point stresses on the active surface of the die by the filler particles. The increased flexure in the leads about the slots further enhances the locking of the leads in position with respect to the die.

Abstract: A rotor assembly for use in an electric motor or generator where the mass of the rotor assembly is reduced with respect to conventional rotor assemblies. In addition, the rotor assembly is configured to be scalable to different sized electric motors. Within the rotor assembly, the rotor hub, the shaft, and the permanent magnets can independently or collectively be modified to have a reduced mass. In one aspect, a portion of the rotor hub adjacent to the shaft is configured with passages and spokes. In another aspect, an intermediate hub with lightening holes is provided between the shaft and the rotor hub. In yet another aspect, a large diameter hollow shaft replaces a portion of the rotor hub. In yet another aspect, the permanent magnets are configured to have an arc-shape, which permits the thickness of the magnets to be reduced without reducing the efficiency of the magnets.

Abstract: A rod brake, and a method, including an elastic device, such as a coil spring, array of split rings, or an elastic sleeve, that engages one or more grooves in a cylindrical surface to restrain the rod from longitudinal movement relative to another body, and wherein longitudinal force is applied to distort the elastic device and push it out of the one or more grooves to release the rod for longitudinal movement is disclosed. A locking sleeve is added to lock the elastic device against distortion and movement to the release configuration.

Abstract: Methods and systems for use with an electric machine which reduce magnetic leakage paths, improve d-axis flux, and/or reduce stress levels at high operating speeds.

Abstract: A wireless communications system has a plurality of base stations, a plurality of mobile vehicular repeater units, and a plurality of portable units. In a typical context, each mobile vehicular repeater unit is associated with at least one portable unit, and both may be associated with a single user. The object is for the user(s) to be able to access the wireless network for any geographic location. In cases where a geographic area is shadowed from a base station and communication directly between the portable unit and the base station is not possible, it is beneficial to use the mobile vehicular repeater unit in accordance with an extended coverage mode of operation, to relay communications between the portable unit and the base station. A mobile vehicular repeater unit constructed according to the present invention enters the extended coverage mode of operation in response to receipt of an access request, transmitted by a first of the plurality of portable units.

Abstract: A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die are provided where the leads for bussing are held in place by lead-lock tape to prevent bending and/or other movement of the bussing leads during manufacturing. More specifically, the lead-lock tape is transversely attached across a plurality of bussing leads proximate to and outside of the position where the die is to be attached.

Abstract: An LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. The lead frame has stress relief slots formed in the undersides of the lead elements proximate the adhesive to accommodate filler particles lodged between the leads and the active surface of the die during transfer molding of a plastic encapsulant. The increased space created by the slots and flexure in the leads about the slots reduces point stresses on the active surface of the die by the filler particles. The increased flexure in the leads about the slots further enhances the locking of the leads in position with respect to the die.

Abstract: A method and apparatus for coupling a semiconductor die to terminals of a die package in which the die is housed. The apparatus comprises a die having first and second terminals. A first conductive member is elongated between a first end portion and a second end portion thereof such that the second end portion is proximate to the first terminal. A second conductive member is elongated between a first end portion and second end portion thereof such that the second end portion of the second conductive member is proximate to the second terminal of the die and the second conductive member is generally parallel to the first conductive member. The second end portions of the first and second conductive members may be coupled with conductive couplers to the first and second die terminals, respectively. The conductive members and conductive couplers may be sized and shaped to produce a selected capacitance and/or a selected impedance at the die terminals.

Abstract: Disclosed is a rod brake, and a method, including an elastic device, such as a coil spring, array of split rings, or an elastic sleeve, that engages one or more grooves in a cylindrical surface to restrain the rod from longitudinal movement relative to another body, and wherein longitudinal force is applied to distort the elastic device and push it out of the one or more grooves to release the rod for longitudinal movement. A locking sleeve is added to lock the elastic device against distortion and movement to the release configuration.

Abstract: A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die are provided where the leads for bussing are held in place by lead-lock tape to prevent bending and/or other movement of the bussing leads during manufacturing. More specifically, the lead-lock tape is transversely attached across a plurality of bussing leads proximate to and outside of the position where the die is to be attached.

Abstract: An LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. The lead frame has stress relief slots formed in the undersides of the lead elements proximate the adhesive to accommodate filler particles lodged between the leads and the active surface of the die during transfer molding of a plastic encapsulant. The increased space created by the slots and flexure in the leads about the slots reduces point stresses on the active surface of the die by the filler particles. The increased flexure in the leads about the slots further enhances the locking of the leads in position with respect to the die.

Abstract: A LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. The lead frame has stress relief slots formed in the undersides of the lead elements proximate the adhesive to accommodate filler particles lodged between the leads and the active surface of the die during transfer molding of a plastic encapsulant. The increased space created by the slots and flexure in the leads about the slots reduces point stresses on the active surface of the die by the filler particles. The increased flexure in the leads about the slots further enhances the locking of the leads in position with respect to the die.

Abstract: A method and apparatus for coupling a semiconductor die to terminals of a die package in which the die is housed. The apparatus comprises a die having first and second terminals. A first conductive member is elongated between a first end portion and a second end portion thereof such that the second end portion is proximate to the first terminal. A second conductive member is elongated between a first end portion and second end portion thereof such that the second end portion of the second conductive member is proximate to the second terminal of the die and the second conductive member is generally parallel to the first conductive member. The second end portions of the first and second conductive members may be coupled with conductive couplers to the first and second die terminals, respectively. The conductive members and conductive couplers may be sized and shaped to produce a selected capacitance and/or a selected impedance at the die terminals.

Abstract: A method and apparatus for coupling a semiconductor die to terminals of a die package in which the die is housed. The apparatus comprises a die having first and second terminals. A first conductive member is elongated between a first end portion and a second end portion thereof such that the second end portion is proximate to the first terminal. A second conductive member is elongated between a first end portion and second end portion thereof such that the second end portion of the second conductive member is proximate to the second terminal of the die and the second conductive member is generally parallel to the first conductive member. The second end portions of the first and second conductive members may be coupled with conductive couplers to the first and second die terminals, respectively. The conductive members and conductive couplers may be sized and shaped to produce a selected capacitance and/or a selected impedance at the die terminals.

Abstract: A method and apparatus for coupling a semiconductor die to terminals of a die package in which the die is housed. The apparatus comprises a die having first and second terminals. A first conductive member is elongated between a first end portion and a second end portion thereof such that the second end portion is proximate to the first terminal. A second conductive member is elongated between a first end portion and second end portion thereof such that the second end portion of the second conductive member is proximate to the second terminal of the die and the second conductive member is generally parallel to the first conductive member. The second end portions of the first and second conductive members may be coupled with conductive couplers to the first and second die terminals, respectively. The conductive members and conductive couplers may be sized and shaped to produce a selected capacitance and/or a selected impedance at the die terminals.

Abstract: A 16 megabit (224) or greater density single deposition layer metal Dynamic Random Access Memory (DRAM) part is described which allows for a die that fits within an industry-standard 300 ml wide SOJ (Small Outline J-wing) package or a TSOP (Thin, Small Outline Package) with little or no speed loss over previous double metal deposition layered 16 megabit DRAM designs. This is accomplished using a die architecture which allows for a single metal layer signal path, together with the novel use of a lead frame to remove a substantial portion of the power busing from the die, allowing for a smaller, speed-optimized DRAM. The use of a single deposition layer metal results in lower production costs, and shorter production time.

Abstract: A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die are provided where the leads for bussing are held in place by lead-lock tape to prevent bending and/or other movement of the bussing leads during manufacturing. More specifically, the lead-lock tape is transversely attached across a plurality of bussing leads proximate to and outside of the position where the die is to be attached.

Abstract: An injection spool for use in the injection of a fluid, for example a slurry of drilling cuttings, into a subsea wellhead assembly has an outer housing having a central bore therethrough. The housing has a first end for connection to a wellhead assembly such that the central bore of the housing is aligned with the central bore of the wellhead assembly. An inner housing, for example an isolation sleeve, having a central bore therethrough is disposed within the central bore in the outer housing, whereby a cavity is formed between the inner housing and the outer housing. A port in the outer housing has an opening into the cavity between the inner housing and the outer housing, through which a fluid may be injected. The inner housing has a portion extending from within the outer housing beyond the first end of the outer housing for forming a cavity within a wellhead assembly to which the injection spool is connected.