Abstract: A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die is provided where the leads for bussing are held in place by lead-lock tape to prevent bending and/or other movement of the bussing leads during manufacturing. More specifically, the lead-lock tape is transversely attached across a plurality of bussing leads proximate to and outside of the position where the die is to be attached.

Abstract: A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die are provided where the leads for bussing are held in place by lead-lock tape to prevent bending and/or other movement of the bussing leads during manufacturing. More specifically, the lead-lock tape is transversely attached across a plurality of bussing leads proximate to and outside of the position where the die is to be attached.

Abstract: A 16 megabit (2.sup.24) or greater density single deposition layer metal Dynamic Random Access Memory (DRAM) part is described which allows for a die that fits within an industry-standard 300 ml wide SOJ (Small Outline J-wing) package or a TSOP (Thin, Small Outline Package) with little or no speed loss over previous double metal deposition layered 16 megabit DRAM designs. This is accomplished using a die architecture which allows for a single metal layer signal path, together with the novel use of a lead frame to remove a substantial portion of the power busing from the die, allowing for a smaller, speed-optimized DRAM. The use of a single deposition layer metal results in lower production costs, and shorter production time.

Abstract: A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die are provided where the leads for bussing are held in place by lead-lock tape to prevent bending and/or other movement of the bussing leads during manufacturing. More specifically, the lead-lock tape is transversely attached across a plurality of bussing leads proximate to and outside of the position where the die is to be attached.

Abstract: A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extends over a surface of the semiconductor die are provided where the leads for bussing are held in place by lead-lock tape to prevent bending and/or other movement of the bussing leads during manufacturing. More specifically, the lead-lock tape is transversely attached across a plurality of bussing leads proximate to and outside of the position where the die is to be attached.

Abstract: An improved die-mounting paddle for mechanical stress reduction in plastic integrated circuit packages. The paddle, which is incorporated in a leadframe, comprises multiple, coplanar floating sub-paddles, each of which is attached to a support beam by a flexible coil, thus allowing a large die to remain firmly attached to each of the pads, in spite of differences in the coefficients of expansion between the leadframe paddle metal and the die that might well result in bonding wire breakage or die breakage if a conventional single large paddle were utilized.

Abstract: An improved interdigitized leadframe strip having a pair of rail stubs coextensive with the exposed pins of the leadframes at either end of the strip, which can still be stamped from a continuous strip without any waste of material between the individual strips. The split rail stubs are still considerably wider than the exposed pins of the end leadframes and hence, offer considerable protection to the exposed pins from mechanical damage.

Abstract: A method of manufacturing a series of leadframe strip carriers, the individual members of the series having common external dimensions to facilitate production handling equipment setup and internal slot dimensions which vary to accommodate the various widths of available leadframe strips. This new method of manufacturing leadframe strip carriers results in a much lower unit cost, as compared to carriers manufactured from aluminum extrusions. This has been achieved using an injection molding process employing a single mold which produces constant length, width and height dimensions throughout the series, and which has an internal form die, the position of which can be varied with spacing inserts that can be either removed or transferred to the other side of the mold cavity as the mold is modified for progressively-narrower leadframe strips. To ensure durability, highly-abrasion resistant, fiber-reinforced plastic material is used to create the carriers.