Abstract: In an embodiment, a system on a chip (SOC) includes a component that remains powered when the remainder of the SOC is powered off. The component may include a sensor capture unit to capture data from various device sensors, and may filter the captured sensor data. Responsive to the filtering, the component may wake up the remainder of the SOC to permit the processing. The component may store programmable configuration data, matching the state at the time the SOC was most recently powered down, for the other components of the SOC, in order to reprogram them after wakeup. In some embodiments, the component may be configured to wake up the memory controller within the SOC and the path to the memory controller, in order to write the data to memory. The remainder of the SOC may remain powered down.

Abstract: A semiconductor package includes a processor die (e.g., an SoC) and one or more memory die (e.g., DRAM) coupled to a ball grid array (BGA) substrate. The processor die and the memory die are coupled to opposite sides of the BGA substrate using terminals (e.g., solder balls). The package may be coupled to a printed circuit board (PCB) using one or more terminals positioned around the perimeter of the processor die. The PCB may include a recess with at least part of the processor die being positioned in the recess. Positioning at least part of the processor die in the recess reduces the overall height of the semiconductor package assembly. A voltage regulator may also be coupled to the BGA substrate on the same side as the processor die with at least part of the voltage regulator being positioned in the recess a few millimeters from the processor die.

Abstract: In an embodiment, a system on a chip (SOC) may include one or more central processing units (CPUs), a memory controller, and a circuit configured to remain powered on when the rest of the SOC is powered down. The circuit may be configured to receive audio samples and match those audio samples against a predetermined pattern. The circuit may operate according to a first clock during the time that the rest of the SOC is powered down. In response to detecting the predetermined pattern in the samples, the circuit may cause the memory controller and processors to power up. During the power up process, a second clock having one or more better characteristics than the first clock may become available. The circuit may switch to the second clock while preserving the samples, or losing at most one sample, or no more than a threshold number of samples.

Abstract: In one embodiment, a memory that is delineated into transparent and non-transparent portions. The transparent portion may be controlled by a control unit coupled to the memory, along with a corresponding tag memory. The non-transparent portion may be software controlled by directly accessing the non-transparent portion via an input address. In an embodiment, the memory may include a decoder configured to decode the address and select a location in either the transparent or non-transparent portion. Each request may include a non-transparent attribute identifying the request as either transparent or non-transparent. In an embodiment, the size of the transparent portion may be programmable. Based on the non-transparent attribute indicating transparent, the decoder may selectively mask bits of the address based on the size to ensure that the decoder only selects a location in the transparent portion.

Abstract: In an embodiment, an electronic device may be configured to capture still frames during video capture, but may capture the still frames in the 4×3 aspect ratio and at higher resolution than the 16×9 aspect ratio video frames. The device may interleave high resolution, 4×3 frames and lower resolution 16×9 frames in the video sequence, and may capture the nearest higher resolution, 4×3 frame when the user indicates the capture of a still frame. Alternatively, the device may display 16×9 frames in the video sequence, and then expand to 4×3 frames when a shutter button is pressed. The device may capture the still frame and return to the 16×9 video frames responsive to a release of the shutter button.

Abstract: In an embodiment, a system on a chip (SOC) includes a component that remains powered when the remainder of the SOC is powered off. The component may include a sensor capture unit to capture data from various device sensors, and may filter the captured sensor data. Responsive to the filtering, the component may wake up the remainder of the SOC to permit the processing. The component may store programmable configuration data, matching the state at the time the SOC was most recently powered down, for the other components of the SOC, in order to reprogram them after wakeup. In some embodiments, the component may be configured to wake up the memory controller within the SOC and the path to the memory controller, in order to write the data to memory. The remainder of the SOC may remain powered down.

Abstract: A semiconductor package includes a processor die (e.g., an SoC) and one or more memory die (e.g., DRAM) coupled to a ball grid array (BGA) substrate. The processor die and the memory die are coupled to opposite sides of the BGA substrate using terminals (e.g., solder balls). The package may be coupled to a printed circuit board (PCB) using one or more terminals positioned around the perimeter of the processor die. The PCB may include a recess with at least part of the processor die being positioned in the recess. Positioning at least part of the processor die in the recess reduces the overall height of the semiconductor package assembly. A voltage regulator may also be coupled to the BGA substrate on the same side as the processor die with at least part of the voltage regulator being positioned in the recess a few millimeters from the processor die.

Abstract: In an embodiment, an electronic device may be configured to capture still frames during video capture, but may capture the still frames in the 4×3 aspect ratio and at higher resolution than the 16×9 aspect ratio video frames. The device may interleave high resolution, 4×3 frames and lower resolution 16×9 frames in the video sequence, and may capture the nearest higher resolution, 4×3 frame when the user indicates the capture of a still frame. Alternatively, the device may display 16×9 frames in the video sequence, and then expand to 4×3 frames when a shutter button is pressed. The device may capture the still frame and return to the 16×9 video frames responsive to a release of the shutter button.

Abstract: An embodiment of a system may include a plurality of media units, a processor, and circuitry. Each media unit may be configured to execute one or more commands to process a display image. The processor may be configured to store a plurality of media processing commands in a queue. The circuitry may be configured to retrieve a first media processing command from the queue and send the first media processing command to a first media unit. The circuitry may also be configured to retrieve a second media processing from the queue and send the second media processing command to a second media unit in response to receiving an interrupt from the first media unit. The circuitry may then copy data from the first media unit to the second media unit in response to receiving the interrupt from the first media unit.

Abstract: In one embodiment, a memory that is delineated into transparent and non-transparent portions. The transparent portion may be controlled by a control unit coupled to the memory, along with a corresponding tag memory. The non-transparent portion may be software controlled by directly accessing the non-transparent portion via an input address. In an embodiment, the memory may include a decoder configured to decode the address and select a location in either the transparent or non-transparent portion. Each request may include a non-transparent attribute identifying the request as either transparent or non-transparent. In an embodiment, the size of the transparent portion may be programmable. Based on the non-transparent attribute indicating transparent, the decoder may selectively mask bits of the address based on the size to ensure that the decoder only selects a location in the transparent portion.

Abstract: In an embodiment, a system on a chip (SOC) may include one or more central processing units (CPUs), a memory controller, and a circuit configured to remain powered on when the rest of the SOC is powered down. The circuit may be configured to receive audio samples and match those audio samples against a predetermined pattern. The circuit may operate according to a first clock during the time that the rest of the SOC is powered down. In response to detecting the predetermined pattern in the samples, the circuit may cause the memory controller and processors to power up. During the power up process, a second clock having one or more better characteristics than the first clock may become available. The circuit may switch to the second clock while preserving the samples, or losing at most one sample, or no more than a threshold number of samples.

Abstract: In an embodiment, an electronic device may be configured to capture still frames during video capture, but may capture the still frames in the 4×3 aspect ratio and at higher resolution than the 16×9 aspect ratio video frames. The device may interleave high resolution, 4×3 frames and lower resolution 16×9 frames in the video sequence, and may capture the nearest higher resolution, 4×3 frame when the user indicates the capture of a still frame. Alternatively, the device may display 16×9 frames in the video sequence, and then expand to 4×3 frames when a shutter button is pressed. The device may capture the still frame and return to the 16×9 video frames responsive to a release of the shutter button.

Abstract: A semiconductor package includes a processor die (e.g., an SoC) and one or more memory die (e.g., DRAM) coupled to a ball grid array (BGA) substrate. The processor die and the memory die are coupled to opposite sides of the BGA substrate using terminals (e.g., solder balls). The package may be coupled to a printed circuit board (PCB) using one or more terminals positioned around the perimeter of the processor die. The PCB may include a recess with at least part of the processor die being positioned in the recess. Positioning at least part of the processor die in the recess reduces the overall height of the semiconductor package assembly. A voltage regulator may also be coupled to the BGA substrate on the same side as the processor die with at least part of the voltage regulator being positioned in the recess a few millimeters from the processor die.

Abstract: In one embodiment, a memory that is delineated into transparent and non-transparent portions. The transparent portion may be controlled by a control unit coupled to the memory, along with a corresponding tag memory. The non-transparent portion may be software controlled by directly accessing the non-transparent portion via an input address. In an embodiment, the memory may include a decoder configured to decode the address and select a location in either the transparent or non-transparent portion. Each request may include a non-transparent attribute identifying the request as either transparent or non-transparent. In an embodiment, the size of the transparent portion may be programmable. Based on the non-transparent attribute indicating transparent, the decoder may selectively mask bits of the address based on the size to ensure that the decoder only selects a location in the transparent portion.

Abstract: In an embodiment, an electronic device may be configured to capture still frames during video capture, but may capture the still frames in the 4×3 aspect ratio and at higher resolution than the 16×9 aspect ratio video frames. The device may interleave high resolution, 4×3 frames and lower resolution 16×9 frames in the video sequence, and may capture the nearest higher resolution, 4×3 frame when the user indicates the capture of a still frame. Alternatively, the device may display 16×9 frames in the video sequence, and then expand to 4×3 frames when a shutter button is pressed. The device may capture the still frame and return to the 16×9 video frames responsive to a release of the shutter button.

Abstract: A graphics system may include a display pipe with a buffer configured to store pixels to be processed by a display controller for displaying on a display device, with a buffer control circuit coupled to the buffer to supply pixels to the display controller. When the buffer control circuit detects an underrun of the buffer responsive to the display controller attempting to read pixels from the buffer that have not yet been written to the buffer, the buffer control circuit may supply an underrun pixel to the display. The underrun pixel may be selected from a set of previously stored set of underrun pixels, which may include a most recent valid pixel read by the display controller. A read pointer representative of the location in the buffer from where the display controller is currently attempting to read may be advanced even when an underrun condition occurs.

Abstract: A semiconductor package includes a processor die (e.g., an SoC) and one or more memory die (e.g., DRAM) coupled to a ball grid array (BGA) substrate. The processor die and the memory die are coupled to opposite sides of the BGA substrate using terminals (e.g., solder balls). The package may be coupled to a printed circuit board (PCB) using one or more terminals positioned around the perimeter of the processor die. The PCB may include a recess with at least part of the processor die being positioned in the recess. Positioning at least part of the processor die in the recess reduces the overall height of the semiconductor package assembly. A voltage regulator may also be coupled to the BGA substrate on the same side as the processor die with at least part of the voltage regulator being positioned in the recess a few millimeters from the processor die.

Abstract: Embodiments of a method that allow the adjustment of performance settings of a computing system are disclosed. One or more functional units may include multiple monitor circuits, each of which may be configured to monitor a given operational parameter of a corresponding functional unit. Upon detection of an event related to a monitored operational parameter, a monitor circuit may generate an interrupt. In response to the interrupt a processor may adjust one or more performance settings of the computing system.

Abstract: A context switching method for video encoders that enables higher priority video streams to interrupt lower priority video streams. A high priority frame may be received for processing while another frame is being processed. The pipeline may be signaled to perform a context stop for the current frame. The pipeline stops processing the current frame at an appropriate place, and propagates the stop through the stages of the pipeline and to a transcoder through DMA. The stopping location is recorded. The video encoder may then process the higher-priority frame. When done, a context restart is performed and the pipeline resumes processing the lower-priority frame beginning at the recorded location. The transcoder may process data for the interrupted frame while the higher-priority frame is being processed in the pipeline, and similarly the pipeline may begin processing the lower-priority frame after the context restart while the transcoder completes processing the higher-priority frame.

Abstract: Methods and apparatus for caching reference data in a block processing pipeline. A cache may be implemented to which reference data corresponding to motion vectors for blocks being processed in the pipeline may be prefetched from memory. Prefetches for the motion vectors may be initiated one or more stages prior to a processing stage. Cache tags for the cache may be defined by the motion vectors. When a motion vector is received, the tags can be checked to determine if there are cache block(s) corresponding to the vector (cache hits) in the cache. Upon a cache miss, a cache block in the cache is selected according to a replacement policy, the respective tag is updated, and a prefetch (e.g., via DMA) for the respective reference data is issued.