Abstract: A method for sealing a bundle of wires includes providing an adhesive material having a viscosity of less than about 300 Pa·s at the installation temperature. The method further includes forming a structure from the adhesive and inserting a plurality of wires into the structure. A first amount of heat is applied to the structure in a first heating operation. The first amount of heat being higher than an ambient temperature and lower than a softening temperature of the structure. Subsequently, a second amount of heat is applied in a second heating operation to the adhesive structure to thereby fully melt the adhesive structure and cause the adhesive of the structure to fill voids between the plurality of wires to thereby seal the wires. Application of the first amount of heat during the first operation to the structure facilitates improved melt uniformity of the structure during the second heating operation.

Abstract: A detection circuit includes a switch conversion unit and a collection control unit. The switch conversion unit is configured to: enable a first end of the switch conversion unit to connect to a third end of the switch conversion unit within first duration, and enable a second end of the switch conversion unit to connect to the third end of the switch conversion unit within second duration. The collection control unit is configured to: collect a voltage (V1) between a first end of a relay and a second end of a battery pack within the first duration, collect a voltage (V2) between a second end of the relay and the second end of the battery pack within the second duration, and determine, based on V1 and V2, whether the relay is faulty.

Abstract: A composite formulation and a composite article are provided. The composite article includes at least two layers of a composite formulation including a polymer matrix and conductive particles distributed within the polymer matrix, the conductive particles forming, by volume, between 20% and 50% of the composite formulation. The conductive particles in each of the at least two layers include at least one morphology selected from the group consisting of fibrous, dendritic, and flake, and the morphology of the conductive particles in one of the at least two layers differs from the morphology of the conductive particles in another one of the at least two layers. The composite formulation includes a polymer matrix and between 30% and 45%, by volume, tin-coated copper conductive particles at a copper/tin ratio of between 3/1 and 3/2, the conductive particles including at least two morphologies selected from the group consisting of fibrous, dendritic, and flake.

Abstract: A system for sealing an electrical terminal which includes a device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal. The device includes a shrinkable tubing which is placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal. A sealant/adhesive is placed within the heat shrink tubing and has a first portion proximate to the edge of heat shrink tubing. The sealant/adhesive has a strip of high viscosity sealant/adhesive proximate a strip of low viscosity sealant/adhesive. Upon the application of heat to the device after installation of the device over the electrical terminal, the shrinkable tubing starts to recover, the first portion of the sealant/adhesive flows and seals free ends of the plurality of electrical wires to seal the free ends of the electrical wires.

Abstract: A method and an apparatus for compensating for wavelength drift are disclosed. The method includes: generating, by a burst control circuit, a burst bias current; sending, by the burst control circuit, the burst bias current to a light emitting part and a trigger; converting, by the trigger, the received burst bias current into burst DA data; sending, by the trigger, the burst DA data to a synthesizer circuit; receiving, by the synthesizer circuit, the burst DA data sent by the trigger and the calibrated DA data sent by the MCU respectively; synthesizing, by the synthesizer circuit, the burst DA data and the calibrated DA data to obtain a synthesized signal; and sending, by the synthesizer circuit, the synthesized signal to a temperature control part.

Abstract: Various embodiments provide for analyzing impedance states of a set of nodes in a circuit design and providing a set of reasons for those impedance states. The set of reasons can include a reason regarding why a particular node is reported as being in high-impedance (highz) state or in low-impedance (lowz) state, and the reason may be for a specific time point during transient analysis of the circuit design. Some embodiments are implemented within a debugging utility of an electronic design automation (EDA) software system.

Abstract: An electrical connection sealer includes an outer jacket and a low-viscosity sealant. The outer jacket includes a first piece of heat-shrinkable tubing. The outer jacket has a pre-sealed end and an open end opposite the pre-sealed end. The first piece of heat-shrinkable tubing at the open end is heat-recoverable and forms a cavity for insertion of an electrical connection. The low-viscosity sealant is insertable into the cavity. Upon application of heat to the electrical connection sealer with the electrical connection and the low-viscosity sealant in the cavity of the electrical connection sealer, the low-viscosity sealant flows across and through the first wires and the at least one second wire and the first piece of heat-shrinkable tubing shrinks to encapsulate the electrical connection and seal the electrical connection and the low-viscosity sealant substantially within the outer jacket.

Abstract: A touchscreen system comprises a touch area. At least one transmitter is positioned proximate to outer edges of the touch area for transmitting first beams in a first direction. At least one beam splitter is positioned proximate to the outer edges of the touch area for splitting the first beams into at least second and third beams that travel through the touch area in at least second and third directions, respectively. The at least one beam splitter comprises a plurality of deflecting elements. Receivers are positioned proximate to the outer edges of the touch area for receiving the at least second and third beams.

Abstract: Processes of applying conductive composites on flexible materials, transfer assemblies, and garments including conductive composites are disclosed. The processes include positioning the conductive composite relative to the flexible material, the conductive composite having a resin matrix and conductive filler, and heating the conductive composite with an iron thereby applying the conductive composite directly onto the flexible material. Additionally or alternatively, the processes include positioning the conductive composite relative to the clothing, and heating the conductive composite thereby applying the conductive composite on the clothing. The garments include the flexible material and the conductive composite positioned directly on the flexible material. The transfer assembly has the conductive composite on a transfer substrate.

Abstract: A system for sealing an electrical terminal which includes a device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal. The device includes a shrinkable tubing which is placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal. A sealant/adhesive is placed within the heat shrink tubing and has a first portion proximate to the edge of heat shrink tubing. The sealant/adhesive has a strip of high viscosity sealant/adhesive proximate a strip of low viscosity sealant/adhesive. Upon the application of heat to the device after installation of the device over the electrical terminal, the shrinkable tubing starts to recover, the first portion of the sealant/adhesive flows and seals free ends of the plurality of electrical wires to seal the free ends of the electrical wires.

Abstract: A system and device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal, wherein the device further includes a first piece of heat shrink tubing having a predetermined length, wherein the first piece of heat shrink tubing has been placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal; a second piece of heat shrink tubing having a predetermined length, wherein the second piece of heat shrink tubing has a smaller diameter than the first piece of heat shrink tubing, and wherein the second piece of heat shrink tubing is placed partially inside the end of the first piece of heat shrink tubing that extends over the wire attachment portion of the electrical terminal; and a band of adhesive placed within the first piece of heat shrink tubing adjacent to the second piece of heat shrink tubing.

Abstract: A system and device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal, wherein a shrinkable tubing is placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal. A band of the high viscosity sealant/adhesive is placed within the heat shrink tubing adjacent to the edge of heat shrink tubing. A band of the low viscosity sealant/adhesive is placed within the heat shrink tubing. Upon the application of heat to the device, the shrinkable tubing starts to recover, the high viscosity sealant/adhesive seals the edge of the shrinkable tubing and the low-viscosity sealant/adhesive flows across and through the plurality of electrical wires to create a seal. The high viscosity sealant/adhesive prevents flow of the low-viscosity sealant/adhesive from contaminating the electrical terminal.

Abstract: A fluid sensing system includes a microfluidic chip, multiple sensors, and a communication device. The microfluidic chip includes at least one microfluidic channel extending a length through the microfluidic chip. The microfluidic chip is fluidly connected to a process fluid such that a fluid sample from the process fluid flows through the at least one microfluidic channel. The multiple sensors are operatively connected to the at least one microfluidic channel of the microfluidic chip. The multiple sensors are configured to monitor multiple different properties of the fluid sample within the at least one microfluidic channel. The communication device is operatively connected to the multiple sensors. The communication device is configured to receive data parameters representative of the multiple different properties of the fluid sample from the multiple sensors and wirelessly transmit the data parameters to a remote location.

Abstract: A system and device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal, wherein a shrinkable tubing is placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal. A band of the high viscosity sealant/adhesive is placed within the heat shrink tubing adjacent to the edge of heat shrink tubing. A band of the low viscosity sealant/adhesive is placed within the heat shrink tubing. Upon the application of heat to the device, the shrinkable tubing starts to recover, the high viscosity sealant/adhesive seals the edge of the shrinkable tubing and the low-viscosity sealant/adhesive flows across and through the plurality of electrical wires to create a seal. The high viscosity sealant/adhesive prevents flow of the low-viscosity sealant/adhesive from contaminating the electrical terminal.

Abstract: A system and device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal, wherein the device further includes a first piece of heat shrink tubing having a predetermined length, wherein the first piece of heat shrink tubing has been placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal; a second piece of heat shrink tubing having a predetermined length, wherein the second piece of heat shrink tubing has a smaller diameter than the first piece of heat shrink tubing, and wherein the second piece of heat shrink tubing is placed partially inside the end of the first piece of heat shrink tubing that extends over the wire attachment portion of the electrical terminal; and a band of adhesive placed within the first piece of heat shrink tubing adjacent to the second piece of heat shrink tubing.

Abstract: A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.

Abstract: A method of forming a composite article, wherein the method includes providing a composite formulation, the composite formulation including a polymer matrix and at least one additive distributed in the polymer matrix at a concentration of between 10% and 50%, by volume, the at least one additive having a molar percentage of carbon that is equal to or less than 90%, feeding the composite formulation to a printing head of an additive manufacturing device, heating the composite formulation to form a heated composite formulation, extruding the heated composite formulation through a nozzle in the printing head, and depositing the heated composite formulation onto a platform to form the composite article. Also provided is a composite article produced from a composite formulation having at least one additive distributed in a polymer matrix.

Abstract: A composite formulation and a composite article are provided. The composite article includes at least two layers of a composite formulation including a polymer matrix and conductive particles distributed within the polymer matrix, the conductive particles forming, by volume, between 20% and 50% of the composite formulation. The conductive particles in each of the at least two layers include at least one morphology selected from the group consisting of fibrous, dendritic, and flake, and the morphology of the conductive particles in one of the at least two layers differs from the morphology of the conductive particles in another one of the at least two layers. The composite formulation includes a polymer matrix and between 30% and 45%, by volume, tin-coated copper conductive particles at a copper/tin ratio of between 3/1 and 3/2, the conductive particles including at least two morphologies selected from the group consisting of fibrous, dendritic, and flake.

Abstract: A clock generation circuit coupled to an integrator circuit uses a variable resistance that is adjusted in a transconductance bias feedback circuit. This resistance is calibrated to the reciprocal of the transconductance of the input amplifier. The product of the adjusted resistance and a capacitance in the clock generation circuit provides a time constant for the settling time of the integrator and controls a pulse width of an adaptively controlled duty cycle output clock.