Abstract: A BGA packaging method for an IC includes steps of providing a first dry film to a copper plate, plating nickel-copper to form circuits on one side of the copper plate, providing a second dry film, selectively plating nickel-gold, removing the dry films, providing an insulating layer, providing a back plate, attaching a chip, wire bonding, encapsulating the chip and wires with plastic, etching copper, providing solder resist and attaching solder balls. By this method, a packaged IC with excellent electrical characteristics and heat dissipation can be obtained through a simple procedure.

Abstract: A packaging method for a ball grid array (BGA) integrated circuit (IC) without utilizing a base plate as a supporting plate, and therefore reducing the thickness of the packaged BGA IC. In the method, a copper sheet is used as a supporting plate first. After resin is applied to coat a chip implanted on the copper sheet and connecting wires thereof has hardened, the hardened resin is sufficiently firm to support the IC, so the copper sheet can be etched. Accordingly, a base plate is not necessary.

Abstract: A solid tape automated bonding method includes steps of: applying a pattern of a first dry film on a first portion of a copper plate; forming wiring; forming bumps; removing dry film and exposing the wiring and the bumps; selectively laminating an insulator layer onto portions of the exposed copper plate and the wiring; laminating a metal layer on the insulator layer; applying glue on the metal layer, the bumps, and respective exposed portions of the wiring and the copper plate; etching the copper plate thus exposing one side of the wiring as ball pads and exposing one side of the insulator layer; coating solder resist on the exposed bottom side of the insulator layer; removing the glue; attaching a die against the bumps; applying mold compound onto the die so as to fix the die in place; and attaching solder balls onto the ball pads. This method provides relatively high density of wiring and simplification in manufacturing.