Abstract: A robot includes a limit device and an energy storehouse, the limiting device may lock or loosen a battery opened in the energy storehouse, the limiting device includes a first connecting member, a transmission rod, and a second connecting member. The first connecting member includes a first main body portion and two first connecting elements arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod includes a first end and a second end arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member includes two indexing buckles arranged at intervals, each of the indexing buckles includes a first limiting groove and a second limiting groove.

Abstract: A semiconductor package includes a substrate, first bumps, a first chip, metal pillars, second bumps and a second chip. The substrate includes first and second conductive pads which are located on a top surface of the substrate. Both ends of the first bumps are connected to the first conductive pads and the first chip, respectively. Both ends of the metal pillars are connected to the second conductive pads and one end of the second bumps, respectively. A cross-sectional area of each of the metal pillars is larger than that of each of the second bumps. The second chip is connected to the other end of the second bumps and located above the first chip.

Abstract: A light emitter that operates through a display may cause display artifacts, even when the light emitter operates using non-visible wavelengths. To mitigate artifacts caused by a light emitter operating through a display, the display may have a higher density of thin-film transistor sub-pixels than emissive sub-pixels. This allows for a region in the display to include emissive sub-pixels but be free of thin-film transistor sub-pixels. The light emitter may operate through this region in the display. Additionally, to reduce the amount of space occupied in the inactive area of a display by gate driver circuitry, at least a portion of the gate driver circuitry may be positioned in the active area of the display. To accommodate the gate driver circuitry, emissive sub-pixels may be laterally shifted relative to corresponding thin-film transistor sub-pixels.

Abstract: A package structure includes a semiconductor device, a molding compound, a first dielectric layer, and a through-via. The molding compound is in contact with a sidewall of the semiconductor device. The first dielectric layer is over the molding compound and the semiconductor device. The through-via is in the molding compound and the first dielectric layer. The through-via is a continuous element and in contact with the first dielectric layer.

Abstract: Semiconductor devices including the use of solder materials and methods of manufacturing are provided. In embodiments the solder materials utilize a first tensile raising material, a second tensile raising material, and a eutectic modifier material. By utilizing the materials a solder material can be formed and used with a reduced presence of needles that may otherwise form during the placement and use of the solder material.

Abstract: In a wire drawing method, processing stability is ensured by preventing a shape from deforming non-uniformly. The wire drawing method includes: using a first wire that includes a center member, a plurality of first peripheral wires surrounding the center member, and an outer shell disposed outside the first peripheral wires; and reducing a cross-sectional diameter of the first wire by wire drawing. A shape of a cross section perpendicular to a longitudinal direction of the first peripheral wire is a substantially isosceles trapezoidal shape including a long side in contact with the outer shell, a short side in contact with the center member, and a first oblique side and a second oblique side that are in contact with the adjacent peripheral wires.

Abstract: A ceiling fan blade assembly structure includes a blade holder, multiple fan blades, and multiple locking assemblies. Multiple fan blade assembly portions are disposed at an outer side of the blade holder. Each fan blade assembly portion includes two first side plates parallel to each other, a first radial positioning portion, and two first vertical positioning portions disposed on the two first side plates. Each fan blade has a fan blade connection portion that includes two second side plates, a second radial positioning portion, and two second vertical positioning portions. The second and the first radial positioning portions are engaged with each other, and the two second and first vertical positioning portions are engaged with each other. Accordingly, the fan blade connection portion is preliminarily positioned on the fan blade assembly portion. Through the locking assembly, the first and the second radial positioning portions are locked together.

Abstract: A manufacturing method of a package-on-package structure includes at least the following steps. Top packages are mounted on a top side of a reconstructed wafer over a flexible tape, where conductive bumps at a bottom side of the reconstructed wafer is attached to the flexible tape, and during the mounting, a shape geometry of the respective conductive bump changes and at least a lower portion of the respective conductive bump is embraced by the flexible tape. The flexible tape is released from the conductive bumps after the mounting.

Abstract: Examples of light source distance alterations are described herein. An example device for providing light source distance alterations can include a display that includes a light source coupled to a piezo material to alter a distance between the light source and a corresponding aperture of an aperture layer.

Abstract: A system performs adaptive thermal ceiling control at runtime. The system includes computing circuits and a thermal management module. When detecting a runtime condition change that affects power consumption in the system, the thermal management module determines an adjustment to the thermal ceiling of a computing circuit, and increases the thermal ceiling of the computing circuit according to the adjustment.

Abstract: A display device and a housing of the display device are provided. The housing of the display device includes a reflective cover. The reflective cover has a plurality of segments formed on a front side of the reflective cover and a plurality of segment structures correspondingly formed on a rear side of the reflective cover. At least one of the segment structures has a notch formed thereat. Positions of the notches of the at least two adjacent ones of the segment structures are not opposite to each other.

Abstract: A capacitor on a fin structure includes a fin structure. A dielectric layer covers the fin structure. A first electrode extension is embedded within the fin structure. A first electrode penetrates the dielectric layer and contacts the first electrode extension. A second electrode and a capacitor dielectric layer are disposed within the dielectric layer. The capacitor dielectric layer surrounds the second electrode, and the capacitor dielectric layer is between the second electrode and the first electrode extension.

Abstract: A semiconductor device includes a substrate, a gate structure on the substrate, a source/drain (S/D) region and a contact. The S/D region is located in the substrate and on a side of the gate structure. The contact lands on and connected to the S/D region. The contact wraps around the S/D region.

Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.

Abstract: A heat dissipation system of an electronic device including a body, a plurality of heat sources disposed in the body, and at least one centrifugal heat dissipation fan disposed in the body is provided. The centrifugal heat dissipation fan includes a housing and an impeller disposed in the housing on an axis. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions, and the plurality of outlets respectively correspond to the plurality of heat sources.

Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.

Abstract: An illumination system including a plurality of light-emitting elements, a light combining module, a first lens group, a second lens group and a wavelength conversion device is provided. The plurality of light-emitting elements provide a plurality of first light beams. The light combining module is used for combining the plurality of first light beams into a second light beam. The wavelength conversion device is used for converting the second light beam into the third light beam or reflecting the second light beam. The first lens group has a first central axis. The first lens group includes a first part and a second part which are symmetrical with respect to the first central axis and have equal areas, and a luminous flux of the second light beam passing through the first part is greater than a luminous flux passing through the second part.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.

Abstract: An automatic nucleic acid detection system and a method thereof are disclosed. The automatic nucleic acid detection method includes: performing, by an automatic control subsystem, on a nucleic acid extraction machine platform, a nucleic acid extraction on one or more specimens in a sample tray to generate one or more corresponding nucleic acids in the sample tray; distributing, by the automatic control subsystem, on a nucleic acid distribution machine platform, the nucleic acid in each hole of the sample tray and a first reagent into a plurality of holes of a detection tray, wherein the number of holes of the detection tray is greater than that of the sample tray; and performing, by the automatic control subsystem, on a nucleic acid detection machine platform, a nucleic acid detection on the detection tray.

Abstract: A method for making iridium oxide nanoparticles includes dissolving an iridium salt to obtain a salt-containing solution, mixing a complexing agent with the salt-containing solution to obtain a blend solution, and adding an oxidating agent to the blend solution to obtain a product mixture. A molar ratio of a complexing compound of the complexing agent to the iridium salt is controlled in a predetermined range so as to permit the product mixture to include iridium oxide nanoparticles.