Patents by Inventor Ting Huang
Ting Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11916738Abstract: Example service processing methods and apparatus are described. One example method includes obtaining a service template set by a first controller. The service template set includes one or more service templates. The first controller sends service template information corresponding to the service template set to a second controller. The first controller receives a first message sent by the second controller. The first message includes first service template information corresponding to a first service template, and the first service template information is determined by the second controller according to a requirement of a first service. The first controller performs provisioning of the first service based on the first service template that is determined based on the first service template information. The second controller determines a corresponding service template according to a service requirement, to trigger the first controller to perform service provisioning based on the service template.Type: GrantFiled: January 19, 2023Date of Patent: February 27, 2024Assignee: Huawei Technologies Co., Ltd.Inventors: Juan Zheng, Xubao Zhang, Junjie Huang, Bo Wu, Ting Liao
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Patent number: 11915977Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.Type: GrantFiled: April 12, 2021Date of Patent: February 27, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang, Sheng-Chau Chen, Shih Pei Chou, Chia-Chieh Lin
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Patent number: 11913981Abstract: An electrostatic sensing system configured to sense an electrostatic information of a fluid inside a fluid distribution component and including an electrostatic sensing assembly, a signal amplifier and an analog-to-digital converter. The electrostatic sensing assembly includes a sensing component, and a shield. The sensing component is configured to be disposed at the fluid distribution component. The sensing component is disposed through the fluid distribution component so as to be partially located in the fluid distribution component. The shield surrounds a part of the sensing component that is located in the fluid distribution component. At least part of the shield is located on an upstream side of the sensing component. The signal amplifier is electrically connected to the sensing component. The analog-to-digital converter is electrically connected to the signal amplifier. The shield has an opening spaced apart from the sensing component.Type: GrantFiled: December 21, 2020Date of Patent: February 27, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Mean-Jue Tung, Ming-Da Yang, Shi-Yuan Tong, Yu-Ting Huang, Chun-Pin Wu
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Publication number: 20240061344Abstract: A method for manufacturing a lithographic mask for an integrated circuit includes performing an optical proximity correction (OPC) process to an integrated circuit mask layout to produce a corrected mask layout. The method further includes performing an inverse lithographic technology (ILT) process to the corrected mask layout to enhance the corrected mask layout to produce an OPC-ILT-enhanced mask layout. The method also includes performing an inverse lithographic technology (ILT) process to the corrected mask layout to enhance the corrected mask layout to produce an OPC-ILT-enhanced mask layout.Type: ApplicationFiled: November 1, 2023Publication date: February 22, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hsu-Ting HUANG, Tung-Chin WU, Shih-Hsiang LO, Chih-Ming LAI, Jue-Chin YU, Ru-Gun LIU, Chin-Hsiang LIN
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Publication number: 20240054088Abstract: A microcontroller, a method, and an electronic system for logic analysis are provided. The microcontroller includes a counting unit, a control unit, and a buffer unit. The counting unit counts with a preset period and outputs a count value. The control unit is coupled to the counting unit and receives a plurality of data and the count value. The buffer unit is coupled to the control unit and performs First In, First Out (FIFO) operations. In response to state transition of at least one datum, the control unit records the current state of the data and the count value and thereby generates transmission data. The control unit then stores the transmission data in the buffer unit.Type: ApplicationFiled: November 30, 2022Publication date: February 15, 2024Inventor: Kuo-Ting HUANG
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Publication number: 20240047512Abstract: A method of forming a semiconductor structure includes following steps. A substrate is provided. The substrate has an active region, an isolation structure adjacent to the active region, and a contact on the active region. A dielectric stack is formed on the substrate. A poly layer is formed on the dielectric stack. The poly layer and the dielectric stack are etched to form an opening to expose the contact of the substrate. A conductive film is formed in the opening and an ALD oxide layer is deposited on a sidewall of the opening. In addition, a semiconductor structure is also disclosed herein.Type: ApplicationFiled: October 17, 2023Publication date: February 8, 2024Inventor: Shih-Ting HUANG
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Patent number: 11894437Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.Type: GrantFiled: May 14, 2021Date of Patent: February 6, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shuen-Shin Liang, Chih-Chien Chi, Chien-Shun Liao, Keng-Chu Lin, Kai-Ting Huang, Sung-Li Wang, Yi-Ying Liu, Chia-Hung Chu, Hsu-Kai Chang, Cheng-Wei Chang
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Publication number: 20240030915Abstract: This disclosure provides example interface circuits, interface circuit protection methods, and terminal devices. An example interface circuit includes a switching unit, a power input end, a first function pin, a second function pin, a control signal input end, a detection port, a grounding output end, a first resistor, a second resistor, a third resistor, a fourth resistor, and an on-off apparatus. The switching unit includes a wire grounding GND end, a circuit power supply Vcc end, a first switch circuit, and a second switch circuit. The on-off apparatus includes an input pin, a first on-off pin, and a second on-off pin. The switching unit is configured to switch, in response to a control signal that is input through the control signal input end, functions corresponding to the first function pin and the second function pin.Type: ApplicationFiled: July 29, 2021Publication date: January 25, 2024Inventors: Ting HUANG, Chen ZHU, Yingqun FENG
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Patent number: 11875532Abstract: The disclosure provides a feature point position detection method and an electronic device. The method includes: obtaining a plurality of first relative positions of a plurality of feature points on a specific object relative to a first image capturing element; obtaining a plurality of second relative positions of the plurality of feature points on the specific object relative to a second image capturing element; and in response to determining that the first image capturing element is unreliable, estimating a current three-dimensional position of each feature point based on a historical three-dimensional position and the plurality of second relative positions of each feature point.Type: GrantFiled: October 14, 2022Date of Patent: January 16, 2024Assignee: Acer IncorporatedInventors: Yen-Hsien Li, Shih-Ting Huang, Chao-Shih Huang
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Patent number: 11875126Abstract: A method for training a dialog generation model includes: acquiring a dialog data set, and encoding a post in the dialog data set by using an encoder in the dialog generation model to obtain an encoded representation of the post; fusing, by using a decoder in the dialog generation model, the encoded representation of the post and knowledge information corresponding to the post that is obtained from a knowledge base question answering model through transfer learning to obtain a predicted response corresponding to the post; determining a value of a loss function of the dialog generation model based on the predicted response and the annotated response that correspond to the post; and updating a model parameter of the dialog generation model based on the value of the loss function. A method, an apparatus, a device, and a computer storage medium for generating a dialog are also provided.Type: GrantFiled: July 6, 2021Date of Patent: January 16, 2024Assignees: SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY, CHINESE ACADEMY OF SCIENCES, TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITEDInventors: Min Yang, Wei Bi, Xiao Jiang Liu, Lei Chen, Ting Ting Huang
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Publication number: 20240005475Abstract: The present invention provides a photomask inspection method, including steps of defining an anchor ratio, providing a photomask and measuring the photomask to obtain a measured ratio, wherein the measured ratio is equal to a value of an image intensity extremum divided by an image intensity threshold or is equal to a value of the image intensity threshold divided by the image intensity extremum when the photomask is measured in an image measurement system tool for a specific critical dimension, and if the measured ratio is larger than the anchor ratio, the photomask is regarded as passing the inspection, and if the measured ratio is smaller than the anchor ratio, the photomask is regarded as failing the inspection.Type: ApplicationFiled: August 1, 2022Publication date: January 4, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Pai-Chi Chen, Chian-Ting Huang, Yung-Feng Cheng
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Patent number: 11850143Abstract: A tissue repair device and a method for using the same are provided. The tissue repair device includes a body portion and at least one wire. The body portion includes an inner layer and an outer layer. The inner layer is close to a tissue, wherein the inner layer includes a hydrophilic structure, and the outer layer includes a hydrophobic structure. The wire is connected to the body portion to fix the body portion to the tissue.Type: GrantFiled: April 29, 2021Date of Patent: December 26, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Chieh Huang, Jeng-Liang Kuo, Hui-Ting Huang, Shiun-Yin Chang, Meng-Hsueh Lin, Cheng-Yi Wu, Lih-Tao Hsu, Pei-I Tsai, Hsin-Hsin Shen, Chih-Yu Chen, Kuo-Yi Yang, Chun-Hsien Ma
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Publication number: 20230407072Abstract: A polypropylene composition includes (A) a polypropylene, (B1) a first copolymer of ethylene and ?-olefin having a density of 0.891 to 0.912 g/cm3, and (B2) a second copolymer of ethylene and ?-olefin having a density in the range of 0.859 to 0.881 g/cm3, wherein the amount of (A) the polypropylene is in the range from 71 to 87 wt % based on the total amount of the polymer composition, and wherein the ratio between the amount of the (B2) second copolymer of ethylene and ?-olefin and the amount of the (B1) first copolymer of ethylene and ?-olefin is in the range from 3.8 to 1.0. The polypropylene composition has improved stress whitening resistance. A battery case including the polypropylene composition is also disclosed.Type: ApplicationFiled: December 6, 2021Publication date: December 21, 2023Inventors: Ting Huang, Chaodong Jiang, Yang Yang, Hongtao Shi, Xin Kong, Christelle Marie Hélène Grein, Chunfa Li
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Patent number: 11846729Abstract: A virtual reality positioning device including a casing, a plurality of lenses, and a plurality of optical positioning components is provided. The casing has a plurality of holes. The lenses are installed in the holes, respectively, where a field angle of each of the lenses is greater than or equal to 120 degrees and less than or equal to 160 degrees, and the lenses include convex lenses or Fresnel lenses. The optical positioning components are installed in the casing and aligned to the lenses, respectively. In addition, a virtual reality positioning system and manufacturing method of a virtual reality positioning device are provided.Type: GrantFiled: April 1, 2021Date of Patent: December 19, 2023Assignee: Acer IncorporatedInventors: Li Lin, Ker-Wei Lin, Chun-Ta Chen, Chun-Yu Chen, Hao-Ming Chang, Chun-Hsien Chen, Shih-Ting Huang, Hui-Yen Wang
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Patent number: 11848485Abstract: An antenna module includes a feeding end, a first radiator, a second radiator, a third radiator, and a ground structure. The first radiator excites a first frequency and a second frequency. The second radiator extends from the first radiator and excites a third frequency with a part of the first radiator. The third radiator extends from the first radiator and excites a fourth frequency with a part of the first radiator. The ground structure includes a main ground surface and an extending portion extending from the main ground surface. The main ground surface is located below the feeding end, and the extending portion extends from the main ground surface to a bottom of the first radiator and is apart from the first radiator. An extending direction of a portion of the first radiator above the extending portion is orthogonal to an extending direction of the extending portion.Type: GrantFiled: December 17, 2020Date of Patent: December 19, 2023Assignee: PEGATRON CORPORATIONInventors: Chin-Ting Huang, Sony Chayadi, Hsi-Kai Hung, Chun-Kai Wang
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Patent number: 11840508Abstract: A catalyst system for olefin polymerization contains a main catalyst and a cocatalyst. The cocatalyst contains a twelve-membered ring compound represented by formula (M). The catalyst system is suitable for preparing polypropylene products having high stereoregularity and low ash, and can regulate the melt index of the products within a wide range by adjusting the amount of hydrogenation. It is also suitable for copolymerization systems to improve the copolymerization yield.Type: GrantFiled: July 24, 2020Date of Patent: December 12, 2023Assignees: CHINA PETROLEUM & CHEMICAL CORPORATION, BEIJING RESEARCH INSTITUTE OF CHEMICAL INDUSTRY, CHINA PETROLEUM & CHEMICAL CORPORATIONInventors: Jie Lin, Xiaofan Zhang, Ting Huang, Junhui Zhang, Junling Zhou, Zhufang Sun, Xianzhi Xia, Hui Zhao, Zifang Guo, Jin Zhao, Haitao Liu, Meiyan Fu, Jigui Zhang, Lin Qi, Lian Yan, Wei Cen, Yu Wang
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Patent number: 11841619Abstract: A method for manufacturing a lithographic mask for an integrated circuit includes performing an optical proximity correction (OPC) process to an integrated circuit mask layout to produce a corrected mask layout. The method further includes performing an inverse lithographic technology (ILT) process to the corrected mask layout to enhance the corrected mask layout to produce an OPC-ILT-enhanced mask layout. The method also includes performing an inverse lithographic technology (ILT) process to the corrected mask layout to enhance the corrected mask layout to produce an OPC-ILT-enhanced mask layout.Type: GrantFiled: August 16, 2021Date of Patent: December 12, 2023Assignee: TAIWAN SEMINCONDUTOR MANUFACTURING COMPANY, LTD.Inventors: Hsu-Ting Huang, Tung-Chin Wu, Shih-Hsiang Lo, Chih-Ming Lai, Jue-Chin Yu, Ru-Gun Liu, Chin-Hsiang Lin
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Publication number: 20230395719Abstract: A method for fabricating a semiconductor device includes the steps of forming a gate structure on a substrate, forming an epitaxial layer adjacent to the gate structure, and then forming a first cap layer on the epitaxial layer. Preferably, a top surface of the first cap layer includes a curve concave upward and a bottom surface of the first cap layer includes a planar surface higher than a top surface of the substrate.Type: ApplicationFiled: August 17, 2023Publication date: December 7, 2023Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chi-Hsuan Tang, Chung-Ting Huang, Bo-Shiun Chen, Chun-Jen Chen, Yu-Shu Lin
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Publication number: 20230392830Abstract: A Stirling freezer includes a cabinet body, at least one power unit, a pipeline, and a plurality of Stirling cooling modules. The cabinet body has a refrigerating space, a cold end space, and a hot end space. The power unit is connected to the pipeline. The Stirling cooling modules each include a pipe and a passive displacer. The passive displacer is reciprocally, movably disposed in the pipe to partition the pipe into a cold end and a hot end. The cold end is located in the cold end space. The hot end is located in the hot end space. The hot end is connected to the pipeline. The cold end absorbs thermal energy of the cold end space to form a low-temperature environment. Air flows between the cold end space and the refrigerating space, so that the refrigerating space also forms a low-temperature environment.Type: ApplicationFiled: August 18, 2023Publication date: December 7, 2023Inventors: CHING-HSIANG CHENG, SHANG-TING HUANG
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Patent number: 11838694Abstract: A heat dissipation device for a projector includes a light source, a light valve, a prism set, a shading element, and a projection lens. The light source emits a light beam. The light valve is disposed downstream of a light path of the light source to receive the light beam, convert a part of the light beam into image light and another part of the light beam into an ineffective light beam. The prism set includes at least one prism, receiving the image light and the ineffective light beam. The shading element includes a heat dissipation part and is disposed downstream of a light path of the prism set and used to block the ineffective light beam from the prism set. The projection lens is disposed downstream of the light path of the prism set.Type: GrantFiled: July 26, 2022Date of Patent: December 5, 2023Assignee: Young Optics Inc.Inventors: Wei-Cheng Lo, Yu-Ting Huang