Patents by Inventor Ting Liu

Ting Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220148972
    Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes a redistribution layer which includes a first dielectric layer, a conductive layer and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test pattern that includes a first conductive pattern, and the first conductive pattern is formed of the conductive layer.
    Type: Application
    Filed: December 8, 2020
    Publication date: May 12, 2022
    Inventors: Yeong-E CHEN, Cheng-En CHENG, Yu-Ting LIU
  • Publication number: 20220145853
    Abstract: An automatic recognition, management and control system for dangerous sources in wind turbines, including an intelligent service unit, a telecontrol platform, a graphic workstation, an intelligent analysis unit, a network unit, an intelligent binocular perception terminal, an intelligent perception terminal and an intelligent recognition terminal, where the telecontrol platform and the graphic workstation are both connected to the intelligent service unit, a signal output end of the intelligent analysis unit is connected to a signal input end of the intelligent service unit through a dedicated line, and signal output ends of the intelligent binocular perception terminal, the intelligent perception terminal and the intelligent recognition terminal are all connected to a signal input end of the intelligent analysis unit through the network unit.
    Type: Application
    Filed: August 16, 2021
    Publication date: May 12, 2022
    Inventors: Guoqing Li, Ting Liu, Renjie Bai, Shiying Li, Jiarui Xue, Yunpeng Li, Yan Liu, Da An
  • Publication number: 20220142225
    Abstract: An intelligent control system and method of thin plate dryer for cut tobacco are provided. The system includes a factor searching and screening unit, a control unit, an early warning unit. The control unit adopts a dual-model control method and establishes a process parameter control model and an energy balance model, the control unit calculates the moisture discharge opening value in real time according to the dual-model; the early warning unit is configured to connected with the control unit, and send out an alarm information based on early warning signal. The present disclosure is designed to transform the traditional control into intelligent precision control, improve product quality, reduce product differences between batches and build an intelligent early warning function.
    Type: Application
    Filed: September 7, 2021
    Publication date: May 12, 2022
    Inventors: Zijuan Li, Bo Liu, Yang Gao, Wangchang Miao, Ting Fang, Weidong Yao, Dongsheng Du, Liyuan Zhao, Jiaojiao Chen, Xiaohui Jia, Zheng Zhou, Yanshu Ma, Wenhui Chang, Wei Wei, Minglei Ma, Zixian Feng
  • Publication number: 20220135792
    Abstract: A bio-resin composition, a bio-resin composite, and a bio-foam material are provided. The bio-resin composition includes a polymer matrix, a toughener, and an antistatic agent. The weight ratio of the polymer matrix to the toughener is between 90:10 and 60:40. Based on the total weight of the polymer matrix and the toughener, the content of the antistatic agent is between 1% and 10%.
    Type: Application
    Filed: November 2, 2021
    Publication date: May 5, 2022
    Applicant: Industrial Technology Research Institute
    Inventors: Sheng-Ju Liao, Sheng-Lung Chang, Shun-Wen Cheng, Yu-Ting Liu, Shihn-Juh Liou
  • Publication number: 20220139872
    Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).
    Type: Application
    Filed: October 30, 2020
    Publication date: May 5, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Che-Ting LIU, Jheng-Yu HONG, Yu-Ting LU, Po-Chun LEE, Chih-Hsiang HSU
  • Patent number: 11322411
    Abstract: Embodiments disclosed herein relate to a pre-deposition treatment of materials utilized in metal gates of different transistors on a semiconductor substrate. In an embodiment, a method includes exposing a first metal-containing layer of a first device and a second metal-containing layer of a second device to a reactant to form respective monolayers on the first and second metal-containing layers. The first and second devices are on a substrate. The first device includes a first gate structure including the first metal-containing layer. The second device includes a second gate structure including the second metal-containing layer different from the second metal-containing layer. The monolayers on the first and second metal-containing layers are exposed to an oxidant to provide a hydroxyl group (—OH) terminated surface for the monolayers. Thereafter, a third metal-containing layer is formed on the —OH terminated surfaces of the monolayers on the first and second metal-containing layers.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: May 3, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Yen Tsai, Chung-Chiang Wu, Tai-Wei Hwang, Hung-Chin Chung, Wei-Chin Lee, Da-Yuan Lee, Ching-Hwanq Su, Yin-Chuan Chuang, Kuan-Ting Liu
  • Patent number: 11311986
    Abstract: A screwdriver rotation structure includes a main body, a control member, a driving member, multiple first rolls, and multiple second rolls. The main body has multiple first recesses and multiple first pillars. Each of the first recesses has a first face. Each of the first pillars has two second faces, two third faces, and a first pivot portion. The main body has multiple second pivot portions. The control member has multiple third pivot portions and multiple second pillars. Each of the second pillars has a fourth face, a fifth face, and a fourth pivot portion. The control member has a fifth pivot portion and a mounting portion. Each of the first rolls is received in one of the first recesses. Each of the second rolls is received in one of the first recesses.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: April 26, 2022
    Assignee: Ningbo King Mount Co., Ltd.
    Inventor: Kuan-Ting Liu
  • Publication number: 20220123124
    Abstract: Semiconductor devices having improved gate electrode structures and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a gate structure over a semiconductor substrate, the gate structure including a high-k dielectric layer; an n-type work function layer over the high-k dielectric layer; an anti-reaction layer over the n-type work function layer, the anti-reaction layer including a dielectric material; a p-type work function layer over the anti-reaction layer, the p-type work function layer covering top surfaces of the anti-reaction layer; and a conductive cap layer over the p-type work function layer.
    Type: Application
    Filed: February 2, 2021
    Publication date: April 21, 2022
    Inventors: Shih-Hang Chiu, Chung-Chiang Wu, Jo-Chun Hung, Wei-Cheng Wang, Kuan-Ting Liu, Chi On Chui
  • Publication number: 20220120561
    Abstract: This disclosure relates to an apparatus and methods for applying X-ray reflectometry (XRR) in characterizing three dimensional nanostructures supported on a flat substrate with a miniscule sampling area and a thickness in nanometers. In particular, this disclosure is targeted for addressing the difficulties encountered when XRR is applied to samples with intricate nanostructures along all three directions, e.g. arrays of nanostructured poles or shafts. Convergent X-ray with long wavelength, greater than that from a copper anode of 0.154 nm and less than twice of the characteristic dimensions along the film thickness direction, is preferably used with appropriate collimations on both incident and detection arms to enable the XRR for measurements of samples with limited sample area and scattering volumes. In one embodiment, the incident angle of the long-wavelength focused X-ray is ?24°, and the sample area is ?25 ?m×25 ?m.
    Type: Application
    Filed: November 22, 2021
    Publication date: April 21, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-Ting LIU, Wen-Li WU, Bo-Ching HE, Guo-Dung CHEN, Sheng-Hsun WU, Wei-En FU
  • Patent number: 11302622
    Abstract: The present disclosure provides an electronic device including a substrate, a first pad, a second pad and an integrated circuit chip. The first pad is disposed on the substrate. The second pad is disposed on the first pad and electrically connected to the first pad. The integrated circuit chip is disposed on the second pad and is electrically connected to the second pad. The second pad has a plurality of curved corners.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: April 12, 2022
    Assignee: InnoLux Corporation
    Inventors: Mei-Chi Hsu, Yu-Chin Lin, Yu-Ting Liu
  • Patent number: 11302582
    Abstract: Embodiments disclosed herein relate to a pre-deposition treatment of materials utilized in metal gates of different transistors on a semiconductor substrate. In an embodiment, a method includes exposing a first metal-containing layer of a first device and a second metal-containing layer of a second device to a reactant to form respective monolayers on the first and second metal-containing layers. The first and second devices are on a substrate. The first device includes a first gate structure including the first metal-containing layer. The second device includes a second gate structure including the second metal-containing layer different from the second metal-containing layer. The monolayers on the first and second metal-containing layers are exposed to an oxidant to provide a hydroxyl group (—OH) terminated surface for the monolayers. Thereafter, a third metal-containing layer is formed on the —OH terminated surfaces of the monolayers on the first and second metal-containing layers.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: April 12, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Yen Tsai, Chung-Chiang Wu, Tai-Wei Hwang, Hung-Chin Chung, Wei-Chin Lee, Da-Yuan Lee, Ching-Hwanq Su, Yin-Chuan Chuang, Kuan-Ting Liu
  • Patent number: 11291279
    Abstract: The present invention relates to a suitcase, including a case body and a plurality of wheel assemblies. The case body has a cuboid shape and includes a front portion, a rear portion, a plurality of top cylindrical projections, at least one bottom tubular projection, and four sidewalls. The rear portion is connected to the front portion. The top cylindrical projections are on the rear portion and protrude outwardly. The bottom tubular projection is on the rear portion and protrudes outwardly in the opposite direction of the top cylindrical projections. The sidewalls surround the bottom tubular projection. There is a space between the bottom tubular projection and the sidewalls. The wheel assemblies are connected to the case body by closely engaged the wheel assemblies to the top cylindrical projections, or by closely engaged the wheel assemblies in the space.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: April 5, 2022
    Assignee: FON DA TECH CO, LTD
    Inventor: Yung-Ting Liu
  • Publication number: 20220096337
    Abstract: The presently claimed invention relates to liquid crystal lipid particles. The presently claimed invention relates to liquid crystal lipid particles which are used in topical composition which has high moisturization efficacy, excellent skin feel, skin softness, and skin smoothness benefits.
    Type: Application
    Filed: January 27, 2020
    Publication date: March 31, 2022
    Inventors: Zhao Ting Liu, Yang Zhang, Dong Ryeol Lee, Zhi Rao, Na Zhao
  • Patent number: 11287253
    Abstract: The present disclosure relates to a device and a method for measuring a thickness of an ultrathin film on a solid substrate. The thickness of the target ultrathin film is measured from the intensity of the fluorescence converted by the substrate and leaking and tunneling through the target ultrathin film at low detection angle. The fluorescence generated from the substrate has sufficient and stable high intensity, and therefore can provide fluorescence signal strong enough to make the measurement performed rapidly and precisely. The detection angle is small, and therefore the noise ratio is low, and efficiency of thickness measurement according to the method disclosed herein is high. The thickness measurement method can be applied into In-line product measurement without using standard sample, and therefore the thickness of the product can be measured rapidly and efficiently.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: March 29, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-Ting Liu, Han-Yu Chang, Bo-Ching He, Guo-Dung Chen, Wen-Li Wu, Wei-En Fu
  • Patent number: 11287867
    Abstract: A power sequence monitoring system is disclosed, and comprises: a microprocessor and a control module. The microprocessor comprises a first conversion unit and a second conversion unit. The first conversion unit is used for converting a power-on signal received from a power management chip to a first digital signal, and the second conversion unit is adopted for converting a power-off signal received form the power management chip to a second digital signal. After receiving the first digital signal and the second digital signal from the microprocessor, and the control module outputs a plurality of power monitoring data to an electronic device, such that a user easily knows the power signal state of the host computer by the system of the present invention.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: March 29, 2022
    Assignee: LANNER ELECTRONICS INC.
    Inventors: Pu-Sung Lin, Tseng-Hua Tung, Yi-Hsien Liu, Chien-Hsun Lin, Chang-Ting Liu
  • Publication number: 20220081699
    Abstract: Disclosed are methods of releasing or enriching for steviol glycosides produced by yeast. The disclosed methods enhance or improve the release or enrichment of the steviol glycosides.
    Type: Application
    Filed: May 3, 2021
    Publication date: March 17, 2022
    Inventors: James C. ANDERSON, Robert J. BROWER, III, Ting Liu CARLSON, Belit FLORES, Dan S. GASPARD, Kristopher T. MORTENSON, Richard NYGAARD, Nicole PAULSON, Maribeth RASMUSSEN
  • Publication number: 20220074939
    Abstract: A method for determining immune competence against severe acute respiratory syndrome coronavirus 2 (SARS-CoV-2) includes obtaining a blood sample from a subject in need thereof, detecting, in the blood sample, levels of binding antibodies against SARS-CoV-2 spike S1 protein and its receptor binding domain (RBD), and calculating a weighted value using a regression model. Another method for determining immune competence against SARS-CoV-2 is also disclosed.
    Type: Application
    Filed: September 9, 2021
    Publication date: March 10, 2022
    Inventors: Shin-Ru SHIH, Kuan-Ting LIU, Guang-Wu CHEN, Chung-Guei HUANG, Kar-Yee YU, Hou-Chen LEE, Peng-Nien HUANG, Yu-Nong GONG, Rei-Lin KUO, Chih-Ching WU, Yu-An KUNG, Sheng-Yu HUANG
  • Publication number: 20220077382
    Abstract: In one aspect, an integrated circuit includes a first conductive layer and a magnetoresistance element (MRE) disposed over and coupled to the first layer through first vias. The MRE is magnetized to produce a first magnetic orientation. The first layer is disposed over and coupled to a second conductive layer in the circuit through second vias. The circuit also includes a metal filler disposed proximate to the MRE. The metal filler is positioned over and coupled to the second layer through third vias. The circuit also includes a thermal dissipation path resulting from a physical input applied to the first MRE. The thermal dissipation path extends through the first through third vias, the first and second layers, an integrated circuit interconnection, and the metal filler.
    Type: Application
    Filed: September 8, 2020
    Publication date: March 10, 2022
    Applicant: Allegro MicroSystems, LLC
    Inventors: Sundar Chetlur, Maxim Klebanov, Paolo Campiglio, Yen Ting Liu
  • Patent number: 11271122
    Abstract: Semiconductor optoelectronic devices having a dilute nitride active layer are disclosed. In particular, the semiconductor devices have a dilute nitride active layer with a bandgap within a range from 0.7 eV and 1 eV. Photodetectors comprising a dilute nitride active layer have a responsivity of greater than 0.6 A/W at a wavelength of 1.3 ?m.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: March 8, 2022
    Assignee: ARRAY PHOTONICS, INC.
    Inventors: Radek Roucka, Sabeur Siala, Aymeric Maros, Ting Liu, Ferran Suarez, Evan Pickett
  • Patent number: 11270994
    Abstract: A gate structure includes a gate dielectric layer, a work function layer, a metal layer, and a barrier layer. The work function layer is on the gate dielectric layer. The metal layer is over the work function layer. The barrier layer is sandwiched between the metal layer and the work function layer. The barrier layer includes silicon or aluminum.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: March 8, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ji-Cheng Chen, Ching-Hwanq Su, Kuan-Ting Liu, Shih-Hang Chiu