Patents by Inventor Ting Liu

Ting Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200374838
    Abstract: A system and method for allocating network resources are disclosed herein. In one embodiment, the system and method are configured to perform: transmitting a message to a wireless communication device for the wireless communication device to select either a first cell where the wireless communication device currently stays, or a second cell to stay. In some embodiments, the message indicates information about the first cell in which a first radio access technology (RAT) is used and the second cell in which a second RAT, different from the first RAT, is used.
    Type: Application
    Filed: August 10, 2020
    Publication date: November 26, 2020
    Inventors: Xiubin SHA, Bo Dai, Ting Lu, Xu Liu
  • Publication number: 20200374170
    Abstract: Methods, systems, and devices are disclosed for digital wireless communication, and more specifically, for initializing and using demodulation reference signals. In one exemplary aspect, a method of wireless communication performed by a communication node includes generating a first portion of an initial value of a demodulation reference signal (DMRS) based, at least in part, on combining a time index and at least a portion of an ID index. The method also includes generating a second portion of the initial value of the DMRS based, at least in part, on the ID index, and generating the initial value of the DMRS by combining at least the first and second portions. The method further includes transmitting or receiving the DMRS.
    Type: Application
    Filed: August 11, 2020
    Publication date: November 26, 2020
    Inventors: Wenhao LIU, Peng HAO, Feng BI, Zhisong ZUO, Ting MIAO
  • Publication number: 20200373487
    Abstract: The present disclosure is directed to a method for the formation of resistive random-access memory (RRAM) structures with a low profile between or within metallization layers. For example, the method includes forming, on a substrate, a first metallization layer with conductive structures and a first dielectric layer abutting sidewall surfaces of the conductive structures; etching a portion of the first dielectric layer to expose a portion of the sidewall surfaces of the conductive structures; depositing a memory stack on the first metallization layer, the exposed portion of the sidewall surfaces, and a top surface of the conductive structures; patterning the memory stack to form a memory structure that covers the exposed portion of the sidewall surfaces and the top surface of the conductive structures; depositing a second dielectric layer to encapsulate the memory stack; and forming a second metallization layer on the second dielectric layer.
    Type: Application
    Filed: May 24, 2019
    Publication date: November 26, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Ming Wang, Chia-Wei Liu, Jen-Sheng Yang, Wen-Ting Chu, Yu-Wen Liao, Huei-Tzu Wang
  • Publication number: 20200371207
    Abstract: A multi-target dynamic simulation test system for vehicle-mounted millimeter-wave (MMW) radar. The test system includes an antenna turntable, a radar pan-and-tilt head (PTH), a radar echo simulation module, a control module, a signal acquisition module and a display. A test radar is driven by the radar PTH to pan or tilt. The radar PTH and the test radar are both placed in a darkroom module. An antenna is driven by the antenna turntable to pan. The control module sends expected states of the test radar and the antennas to the radar PTH and the antenna turntable, respectively, and sends relative states between host vehicle and virtual targets to the test radar after processing by the radar echo simulation module. The signal acquisition module acquires and stores a detection signal of the test radar, and transmits the detection signal of the test radar to the display for real-time display.
    Type: Application
    Filed: May 18, 2020
    Publication date: November 26, 2020
    Applicant: Jilin University
    Inventors: Kunyang Cai, Ting Qu, Bingzhao Gao, Wenqi Qu, Sihan Liu
  • Publication number: 20200373264
    Abstract: An embodiment is a method including depositing a first dielectric layer over a molding compound and a chip and patterning a first opening in the first dielectric layer to expose a contact of the chip. A first metallization layer is deposited over the first dielectric layer and in the first opening, where a portion of the first metallization layer in the first opening has a flat top. A second dielectric layer is deposited over the first metallization layer and the first dielectric layer. A second metallization layer is deposited in a second opening in the second dielectric layer, where the second metallization layer does not have a flat top within the second opening.
    Type: Application
    Filed: August 10, 2020
    Publication date: November 26, 2020
    Inventors: Wan-Ting Shih, Nai-Wei Liu, Jing-Cheng Lin, Cheng-Lin Huang
  • Publication number: 20200368306
    Abstract: The present disclosure provides a method for regulating expression of PDGFC, FGF2, IGF1R, PTGIS, NOS3, EDN1, PLAT, PROC, VWF, F3, SERPINE1, IL-8, ICAM1, VCAM1, and CASP8 genes, including administering to a subject in need thereof a composition including an effective amount of a plant extract, wherein the plant extract includes at least one combination selected from the group consisting of a grape seed extract and a Four seasons spring tea extract, a black tea extract and a spinach extract, the grape seed extract and the spinach extract, the grape seed extract and a green coffee bean extract, a red wine extract and a Pu-erh tea extract, and the grape seed extract and the Pu-erh tea extract.
    Type: Application
    Filed: April 3, 2018
    Publication date: November 26, 2020
    Inventors: Yung-Hsiang LIN, I-Hui CHEN, Kai-Wen KAN, Fu Chen LIU, Ciao-Ting CHEN
  • Publication number: 20200368207
    Abstract: Disclosed herein is a ganetespib-containing particle, which includes an active ingredient selected from ganetespib, a pharmaceutically acceptable salt of ganetespib, and a combination thereof, and an amphiphilic chitosan-based carrier carrying the active ingredient. Also disclosed herein are a pharmaceutical composition including the ganetespib-containing particle, and use of such pharmaceutical composition in treating cancer.
    Type: Application
    Filed: July 24, 2019
    Publication date: November 26, 2020
    Inventors: Yan-Hwa WU LEE, Dean-Mo LIU, Wei-Ting HUANG, Ru-Tsun MAI, Yi-Hsin CHEN
  • Publication number: 20200368307
    Abstract: The present invention provides a composition containing plant extracts and the use thereof. Compared to a single plant extract, the combination of the plant extracts of the present invention can effectively enhance the synthesis of collagen. The plant extracts constituting the composition include: an extract of grape seed, black tea, green tea, red wine, citrus, spinach, green coffee bean, blueberry, Pu-erh tea, or Four Seasons Spring tea.
    Type: Application
    Filed: April 3, 2018
    Publication date: November 26, 2020
    Inventors: Yung-Hsiang LIN, I-Hui CHEN, Kai-Wen KAN, Fu Chen LIU, Ciao-Ting CHEN
  • Publication number: 20200367800
    Abstract: Disclosed is a method for identifying driving fatigue based on a CNN-LSTM deep learning model including: collecting electroencephalograph signals of a subject during simulated driving; randomly issuing an operating command during simulated driving, and dividing the electroencephalograph signals into fatigue data and non-fatigue data according to a reaction time for the subject to complete the operating command; performing band-pass filtering and mean removal preprocessing on the electroencephalograph signals, and respectively extracting N minutes of fatigue electroencephalograph signal data and N minutes of non-fatigue electroencephalograph signal data to be detected; performing independent component analysis on the electroencephalograph signal data to remove interference signals; establishing a CNN-LSTM model and setting network parameters of the CNN-LSTM model; transmitting the electroencephalograph signal data with interference signals removed to a CNN network for feature extraction; and reshaping data of
    Type: Application
    Filed: March 22, 2019
    Publication date: November 26, 2020
    Inventors: Hongtao WANG, Xucheng LIU, Cong WU, Cong TANG, Zi An PEI, Hongwei YUE, Peng CHEN, Ting LI
  • Patent number: 10846855
    Abstract: A method for converting scan information of computed tomography scanner into bone parameters includes the steps of: providing a computed tomography scanner; providing a test object and two phantoms of known components; using the computed tomography scanner to obtain a corresponding test object scan information and two phantoms scan information; receiving the test object scan information and the two phantoms scan information through a computing device; using the computing device to calculate an energy attenuation coefficient of the computed tomography scanner through a physical function model including the known components and the two phantoms scan information; providing the computing device with an energy correction coefficient; and enabling the computing device to obtain a bone parameter of the test object through a true relationship function that includes the energy attenuation coefficient, the test object scan information and the energy correction coefficient.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: November 24, 2020
    Assignees: HIWIN TECHNOLOGIES CORP., CHINA MEDICAL UNIVERSITY
    Inventors: Yi-Wen Chen, Cheng-Ting Shih, Hung-Chuan Hsu, Yi-Cheng Liu
  • Patent number: 10847460
    Abstract: Examples of an integrated circuit a having an advanced two-dimensional (2D) metal connection with metal cut and methods of fabricating the same are provided. An example method for fabricating a conductive interconnection layer of an integrated circuit may include: patterning a conductive connector portion on the conductive interconnection layer of the integrated circuit using extreme ultraviolet (EUV) lithography, wherein the conductive connector portion is patterned to extend across multiple semiconductor structures in a different layer of the integrated circuit; and cutting the conductive connector portion into a plurality of conductive connector sections, wherein the conductive connector portion is cut by removing conductive material from the metal connector portion at one or more locations between the semiconductor structures.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: November 24, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Kam-Tou Sio, Ru-Gun Liu, Shun Li Chen, Shih-Wei Peng, Tien-Lu Lin
  • Patent number: 10844414
    Abstract: Disclosed are methods for producing steviol glycosides, such as rebaudioside D and rebaudioside M, using engineered yeast. The methods include growing yeast on non-fermentative carbon sources. Other methods include growing yeast on one or more polysaccharides in which saccharification and fermentation of the polysaccharides occurs simultaneously.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: November 24, 2020
    Assignee: Cargill, Incorporated
    Inventors: James C. Anderson, Ting Liu Carlson, Arlene M. Fosmer
  • Patent number: 10844170
    Abstract: Disclosed are a preparation method of a phosphorus-nitrogen-silicon-containing polymeric flame retardant and application thereof. The chemical structure of the polymeric flame retardant is wherein m=10˜100, n=10˜100. The synergistic flame-retardant effect between the phosphorus, nitrogen, and silicon in the phosphorus-nitrogen-silicon-containing polymeric flame retardant increases the flame retardancy of epoxy resin.
    Type: Grant
    Filed: November 23, 2017
    Date of Patent: November 24, 2020
    Assignee: XIAMEN UNIVERSITY
    Inventors: Lizong Dai, Ting Chen, Cheng Liu, Shicheng Wang, Guorong Cehn, Conghui Yuan, Yiting Xu, Birong Zeng, Wei'ang Luo
  • Publication number: 20200360268
    Abstract: An injectable pharmaceutical composition containing meloxicam, and a preparation method therefor. The pharmaceutical composition includes meloxicam nanoparticles, a surface stabilizer, and a sedimentation inhibiting agent. The pharmaceutical composition has good stability, is not easy to settle, and is applicable to industrial large-scale production.
    Type: Application
    Filed: August 23, 2018
    Publication date: November 19, 2020
    Inventors: Qiong SUN, Haixian SHI, Kai LIU, Ting LIU, Congjian SHI, Xinxin CHEN, Fujuan CHAI
  • Publication number: 20200364838
    Abstract: The present disclosure provides a technical solution related to processing images in image transformation by fusion. More particularly, an image of an object of an original picture may be transferred onto an image of a corresponding object in a template picture by fusion. During the transformation by fusion, the processing of fusion may be done on each pixel by using a pixel weight graph, so that the image of the object in the original picture may be better integrated into the template picture with the features of the object in the original picture maintained well in the picture processed by fusion.
    Type: Application
    Filed: December 13, 2018
    Publication date: November 19, 2020
    Inventors: Chengcheng Liu, Peng Cheng, Shuo Wang, Ting Sun, Yuwei Cao, Yueyang Chen
  • Patent number: 10840227
    Abstract: A semiconductor package includes an integrated passive device (IPD) including one or more passive devices over a first substrate; and metallization layers over and electrically coupled to the one or more passive devices, where a topmost metallization layer of the metallization layers includes a first plurality of conductive patterns; and a second plurality of conductive patterns interleaved with the first plurality of conductive patterns. The IPD also includes a first under bump metallization (UBM) structure over the topmost metallization layer, where the first UBM structure includes a first plurality of conductive strips, each of the first plurality of conductive strips electrically coupled to a respective one of the first plurality of conductive patterns; and a second plurality of conductive strips interleaved with the first plurality of conductive strips, each of the second plurality of conductive strips electrically coupled to a respective one of the second plurality of conductive patterns.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: November 17, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo, Chih-Hsuan Tai, Hao-Yi Tsai, Chuei-Tang Wang, Chung-Shi Liu, Chen-Hua Yu, Chiahung Liu
  • Patent number: 10840265
    Abstract: A display panel includes a substrate having a display region and a peripheral region, first and second sub pixels, first and second gate driving units. The display region includes a first area having first scan lines and first sub pixels and a second area having second scan lines and second sub pixels. A portion of the first sub pixels and a portion of the second sub pixels are respectively electrically connected to the first and second scan line. The first gate driving unit includes a first driving transistor. The second gate driving unit includes a second driving transistor. The number of the first sub pixels driven by the first gate driving unit is less than the number of the second sub pixels driven by the second gate driving unit. The channel width of the first driving transistor is less than the channel width of the second driving transistor.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: November 17, 2020
    Assignee: HANNSTAR DISPLAY CORPORATION
    Inventors: Hsuan-Chen Liu, Chien-Ting Chan, Chung-Lin Chang
  • Patent number: 10840287
    Abstract: An interconnect apparatus and a method of forming the interconnect apparatus is provided. Two substrates, such as wafers, dies, or a wafer and a die, are bonded together. A first mask is used to form a first opening extending partially to an interconnect formed on the first wafer. A dielectric liner is formed, and then another etch process is performed using the same mask. The etch process continues to expose interconnects formed on the first substrate and the second substrate. The opening is filled with a conductive material to form a conductive plug.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: November 17, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Chia-Chieh Lin, Shu-Ting Tsai, Jiech-Fun Lu, Shih-Chang Liu, Yeur-Luen Tu, Chia-Shiung Tsai
  • Patent number: D902981
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: November 24, 2020
    Assignee: TDK TAIWAN CORP.
    Inventors: Fu-Yuan Wu, Kun-Shih Lin, Shang-Yu Hsu, Yi-Ho Chen, Shih-Ting Huang, Shou-Jen Liu, Chien-Lun Huang, Yi-Hsin Nieh, Chen-Chi Kuo, Chia-Pin Hsu, Yu-Huai Liao, Shin-Hua Chen, Yu-Cheng Lin, Shao-Chung Chang, Kuo-Chun Kao, Chia-Hsiu Liu, Chao-Chun Chang, Yuan-Shih Liao
  • Patent number: D902982
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: November 24, 2020
    Assignee: TDK TAIWAN CORP.
    Inventors: Fu-Yuan Wu, Kun-Shih Lin, Shang-Yu Hsu, Yi-Ho Chen, Shih-Ting Huang, Shou-Jen Liu, Chien-Lun Huang, Yi-Hsin Nieh, Chen-Chi Kuo, Chia-Pin Hsu, Yu-Huai Liao, Shin-Hua Chen, Yu-Cheng Lin, Shao-Chung Chang, Kuo-Chun Kao, Chia-Hsiu Liu, Chao-Chun Chang, Yuan-Shih Liao