Abstract: A reflective illumination device is disclosed, which is comprised of a light-guiding screen with light reflecting ability and at least a directional light source; wherein the light-guiding screen includes a reflecting surface having a semi-Fresnel lens structure arranged thereon. The semi-Fresnel lens structure, being designed basing on the principle of Fresnel lens, is the equivalent of a parabolic mirror that has spiral cut ridges for focusing light to a focal point, whereas the profile of the ridges can be a planar surface, a curved surface or the combination thereof.

Abstract: A light emitting diode package structure having a heat-resistant cover and a method of manufacturing the same include a base, a light emitting diode chip, a plastic shell, and a packaging material. The plastic shell is in the shape of a bowl and has an injection hole thereon. After the light emitting diode chip is installed onto the base, the plastic shell is covered onto the base to fully and air-tightly seal the light emitting diode chip, and the packaging material is injected into the plastic shell through the injection hole until the plastic shell is filled up with the packaging material to form a packaging cover, and finally the plastic shell is removed to complete the LED package structure.

Abstract: A direct backlight module is disclosed, which comprises: a frame; at least a light source, being arranged in the frame; a diffuser, being disposed over the frame; and at least an optical film, being disposed over the diffuser, comprising a substrate having a top surface and a bottom surface; wherein a diffusion unit and a collimation unit are formed on the top surface while using the diffusion unit for diffusing light incident to the bottom surface and the collimation unit for collimating light incident to the bottom surface. The direct backlight module of the invention is capable of enhancing luminous efficiency, and further, it has a comparatively simple structure so that the manufacturing cost of the optical film can be reduced.

Abstract: The present invention discloses an optical film with array of microstructures, having a first optical surface and a second optical surface for receiving an incident light. The optical film comprises at least a transparent microstructure formed on the first optical surface, wherein the microstructure further comprises: a first side for scattering the incident light; and a second side for collimating the incident light.

Abstract: A light emitting diode structure using a heat conducting medium as a grounding circuit includes a heat dissipating body, a support frame, and a base, wherein the upper half of the heat dissipating body has a circular heat dissipating column having a plane for preinstalling a light emitting diode chip, and the lower half of the heat dissipating body has a circular contact disc, and both left and right ends of the support frame separately include a plurality of pins, and a pin is connected to a circular contact end for fixing the heat dissipating column of the heat dissipating body, and then both are buried inside the base, and the bottom surface of the heat dissipating body contact disc is protruded from the bottom of the base, and the plurality of pins of the support frame is extended outward from both left and right sides of the base.

Abstract: The present invention relates to a light source package structure, which comprises: an accommodating space for accommodating a light source, a first refraction surface, and at least a second refraction surface. The first refraction surface receives light discharging from the light source while refracting the same to form a first refracting light, the upper part of the first refraction surface further comprising a refracting structure for refracting the light emitted from the light source. The second refraction surface receives and refracts the first refracting light to form a discharging light being emitted out of the light source package structure. Wherein, an included angle is formed between the normal vector of a portion of the second refraction surface and the central axis of the light source package structure. It is noted that the aforesaid package structure can be used in various packaging for improving refraction.

Abstract: The present invention discloses a light modulation element, having a first optical surface and a second optical surface receiving an incident light, the light modulation element comprising: at least a transparent diffusion unit, for scattering the incident light, each being placed on the first optical surface; and at least a transparent collimation unit, for collimating the incident light, each being formed on top of the diffusion unit.

Abstract: A light guide plate is provided. The light guide plate has a transparent substrate having a first optical face and a second optical face, a first micro structure and a second micro structure respectively corresponding to the first optical face and the second optical face. The first micro structure has a tunable composite optical effect with light collection and diffusion functions so as to increase brightness and evenness of exit light. The second micro structure has a design of curved face to destroy total reflection of light, such that bright lines can be effectively prevented from occurrence by avoiding the light outputting from the direction over against the first optical face. A back light unit having the light guide plate is further provided in the present invention.

Abstract: A direct backlight module is disclosed, which comprises: a frame; at least a light source, being arranged in the frame; a diffuser, being disposed over the frame; and at least an optical film, being disposed over the diffuser, comprising a substrate having a top surface and a bottom surface; wherein a diffusion unit and a collimation unit are formed on the top surface while using the diffusion unit for diffusing light incident to the bottom surface and the collimation unit for collimating light incident to the bottom surface. The direct backlight module of the invention is capable of enhancing luminous efficiency, and further, it has a comparatively simple structure so that the manufacturing cost of the optical film can be reduced.

Abstract: The present invention discloses an optical film with array of microstructures, having a first optical surface and a second optical surface for receiving an incident light. The optical film comprises at least a transparent microstructure formed on the first optical surface, wherein the microstructure further comprises: a first side for scattering the incident light; and a second side for collimating the incident light.

Abstract: A heat dissipating apparatus for lighting utility includes a casing, a light-focusing unit, a light-reflecting unit, a heat-dissipating unit, a light generator, a wind generator, a cover and a circuit board. The heat-dissipating unit absorbs a heat generated from the light generator, the wind generator circulates air outside the casing and inside the casing, whereby the heat absorbed by the heat-dissipating unit is dissipated outside the casing.

Abstract: The present invention discloses an optical element, having a first optical surface and a second optical surface for receiving an incident light, the optical element comprising: at least a transparent diffusion unit, for scattering the incident light, each being placed on the first optical surface; and at least a transparent collimation unit, for collimating the incident light, each being place on the first optical surface abutted and adjacent to the diffusion unit in an alternative manner.

Abstract: The present invention discloses a light modulation element, having a first optical surface and a second optical surface receiving an incident light, the light modulation element comprising: at least a transparent diffusion unit, for scattering the incident light, each being placed on the first optical surface; and at least a transparent collimation unit, for collimating the incident light, each being formed on top of the diffusion unit.

Abstract: A method for fast macroblock mode decision is disclosed. The method includes: (A) determining if a motion cost at the origin (0, 0) or a prediction motion vector (PMV) for a 4n*4n macroblock is smaller than a first threshold; (B) if the motion cost is smaller than the first threshold, determining a macroblock mode as 4n*4n and ending the method; (C) if the motion cost is not smaller than the first threshold, using an adaptive diversity search strategy to perform motion estimation on four 2n*2n blocks associated with the 4n*4n macroblock; (D) determining if all motion costs of the four 2n*2n blocks in step (C) are smaller than a second threshold; and (E) if step (D) determines that the motion costs of the four 2n*2n blocks are smaller than the second threshold, determining the macroblock mode as 2n*2n and ending the method.

Abstract: The invention discloses a heat pump type water heater employing energy in the hot air, including a compressor, a condenser unit, a throttle valve and an evaporator unit connected to each other, in which said condenser unit is composed of a plurality of condensers, each condenser is composed of a water tank and a heat radiator within the water tank, and each water tank is provided with an inlet and an outlet in a water piping system and a hot water outlet. According to the invention, the water heater produced hot water by absorbing the heat energy in the environment using heat pump principle so that the heat pollution to the environment is reduced and the energy is saved because of supplying hot water while providing refrigerating capacity. By connecting a plurality of condensers in series, hot water with different temperatures from 45° C.-100° C.

Abstract: A heat dissipating apparatus for lighting utility includes a casing, a light-focusing unit, a light-reflecting unit, a heat-dissipating unit, a light generator, a wind generator, a cover and a circuit board. The heat-dissipating unit absorbs a heat generated from the light generator, the wind generator circulates air outside the casing and inside the casing, whereby the heat absorbed by the heat-dissipating unit is dissipated outside the casing.

Abstract: The present invention relates to process for fabricating supersphere solid immersion lens (SSIL). The procedure of the present invention comprises the steps of: firstly, coating a positive photoresist layer on a substrate, followed by first exposure and second exposure with different exposure dose separately by first mask and second mask to form the positive photoresist structure with different dimensions and depths. The first exposure dose is supplied enough to make sure the patterns of the first mask can be observed on the positive photoresist layer during the alignment of the second exposure process. And the following reflow process forms a supersphere solid immersion lens (SSIL) structure.

Abstract: An interface for personal communications systems is described which provides rapid identification of a caller and limited access based on a variety of parameters obtained from caller identification information encoded by the telephone company. The incoming telephone call information is compared to a preprogrammed access matrix to determine if the caller is authorized to access the personal communications system connected to the interface. A telephone call screening method and apparatus which incorporates the encoded caller identification is also described.