Patents by Inventor Ting Wang

Ting Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220246838
    Abstract: The present disclosure relates to an integrated circuit. The integrated circuit includes a an inter-layer dielectric (ILD) structure laterally surrounding a conductive interconnect. A dielectric protection layer is disposed over the ILD structure and a passivation layer is disposed over the dielectric protection layer. The passivation layer includes a protrusion extending outward from an upper surface of the passivation layer. A bottom electrode continuously extends from over the passivation layer to between sidewalls of the passivation layer. A data storage element is over the bottom electrode and a top electrode is over the data storage element.
    Type: Application
    Filed: April 20, 2022
    Publication date: August 4, 2022
    Inventors: Harry-Hak-Lay Chuang, Hung Cho Wang, Tong-Chern Ong, Wen-Ting Chu, Yu-Wen Liao, Kuei-Hung Shen, Kuo-Yuan Tu, Sheng-Huang Huang
  • Publication number: 20220246549
    Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor device, the method including forming a plurality of photodetectors in a substrate. A device isolation structure is formed within the substrate. The device isolation structure laterally wraps around the plurality of photodetectors. An outer isolation structure is formed within the substrate. The device isolation structure is spaced between sidewalls of the outer isolation structure. The device isolation structure and the outer isolation structure comprise a dielectric material.
    Type: Application
    Filed: April 21, 2022
    Publication date: August 4, 2022
    Inventors: Tung-Ting Wu, Chen-Jong Wang, Jen-Cheng Liu, Yimin Huang, Chin-Chia Kuo
  • Publication number: 20220247562
    Abstract: Physimetric-based data security for coded distributed temperature sensing (DTS) in which physimetric information is extracted from a coded-DTS interrogator which is unique for each interrogator at each operating run time—and used to reconstruct a final temperature determination from DTS data. The physimetric information includes coded-DTS pulse code and coded-DTS pulse profile information as a key to permit secure sharing with authorized users. The pulse code and pulse profile information are encrypted and made available to an authorized user. The authorized user can then decrypt the pulse code and pulse profile information and subsequently use this key information (pulse profile and pulse code files) to retrieve temperature information from for example, a remote computer providing a continuous raw data feed—without being susceptible to eavesdropping.
    Type: Application
    Filed: January 31, 2022
    Publication date: August 4, 2022
    Applicant: NEC LABORATORIES AMERICA, INC
    Inventors: Qiang WANG, Junqiang HU, Jian FANG, Yaowen LI, Ting WANG
  • Publication number: 20220245347
    Abstract: An entity recognition method, apparatus, electronic device, and computer-readable storage medium are provided. The method includes: determining at least one entity boundary word corresponding to a text sequence; determining at least one entity candidate region in the text sequence based on the at least one entity boundary word; and performing entity recognition on the text sequence and identifying at least one entity in the text sequence based on the at least one entity candidate region.
    Type: Application
    Filed: April 7, 2022
    Publication date: August 4, 2022
    Applicants: SAMSUNG ELECTRONICS CO., LTD., BEIJING SAMSUNG TELECOM R&D CENTER
    Inventors: Huadong WANG, Ting Chen
  • Patent number: 11404533
    Abstract: A capacitance structure includes a substrate, a plurality of rod capacitors and an oxide layer. The rod capacitors are located on a top surface of the substrate and form a capacitor array. The oxide layer covers a top and a side of the capacitor array and a portion of the substrate. The rod capacitors extend along a first direction perpendicular to a second direction in which the top surface of the substrate extends. The oxide layer extends from the top of the capacitor array to the substrate along a third direction, and an angle is formed between the first and third directions.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: August 2, 2022
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Lai-Cheng Tien, Wei-Chuan Fang, Yu-Ting Lin, Mao-Ying Wang
  • Patent number: 11404333
    Abstract: A semiconductor device includes a first semiconductor die, a second semiconductor die, a dielectric layer, a first redistribution layer and a second redistribution layer. The first semiconductor die includes a first bonding pad and a second bonding pad. The second semiconductor die includes a third bonding pad and a fourth bonding pad. The dielectric layer covers the first semiconductor die and the second semiconductor die, and defines a first opening exposing the first bonding pad and the second bonding pad and a second opening exposing the third bonding pad and the fourth bonding pad. The first redistribution layer is disposed on the dielectric layer, and electrically connects the first bonding pad and the third bonding pad. The second redistribution layer is disposed on the dielectric layer, and electrically connects the second bonding pad and the fourth bonding pad.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: August 2, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yuan-Ting Lin, Che Wei Chang, Chi-Yu Wang
  • Publication number: 20220235271
    Abstract: A hybrid silicone composite for high temperature insulation applications is disclosed. The hybrid silicone composite is formed of a mixture of liquid high consistency silicone rubber and solid high consistency silicone rubber and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, over molded, compression molded, cast, laminated, extruded, calendered, adhered or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.
    Type: Application
    Filed: January 28, 2021
    Publication date: July 28, 2022
    Inventors: Dejie TAO, Yiliang WU, Lananh PHAM, Lei WANG, Ting GAO, Andre Martin DRESSEL, Frank SCHABERT
  • Publication number: 20220238384
    Abstract: According to one example, a semiconductor device includes a first region comprising a plurality of nanosheets vertically stacked above a substrate, a second region comprising a fin protruding from the substrate, a first gate structure wrapping around each of the nanosheets, and a second gate structure disposed over the top surface and sidewalls of the fin. A top surface of a topmost nanosheet of the plurality of nanosheets is vertically offset from a top surface of the fin.
    Type: Application
    Filed: April 11, 2022
    Publication date: July 28, 2022
    Inventors: Wen-Ting Lan, Kuan-Ting Pan, Shi Ning Ju, Kuo-Cheng Chiang, Chih-Hao Wang
  • Publication number: 20220236105
    Abstract: An advance in the art is made according to aspects of the present disclosure directed to the detection and localization of a substantially static weight situated on aerial telecommunications fiber optic cable through the effect of phase-distributed acoustic sensing (?-DAS) and signal analysis of ambient data. In sharp contrast to the prior art, our inventive method does not require a special optical fiber arrangement or type of fiber nor is it susceptible to range limitations that plague the prior art.
    Type: Application
    Filed: January 24, 2022
    Publication date: July 28, 2022
    Applicant: NEC LABORATORIES AMERICA, INC
    Inventors: Sarper Ozharar, Yue Tian, Ting Wang, Yangmin Ding
  • Patent number: 11397302
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: July 26, 2022
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 11396557
    Abstract: The present application provides a bispecific antibody or an antibody mixture with common light chains and a preparation method therefor. the present application also provides a nucleic acid molecule encoding the antibody or the mixture, a recombinant vector and a recombinant cell comprising the nucleic acid molecule, as well as a detection and quantitation method for the antibody or the mixture.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: July 26, 2022
    Assignee: Jiangsu Alphamab Biopharmaceuticals Co., Ltd.
    Inventors: Ting Xu, Tao Xu, Xiaoxiao Wang, Qian Li, Minjie Pang, Huimin Zhang, Li Han, Qingqing Zhang
  • Publication number: 20220229477
    Abstract: A heat dissipation system of a portable electronic device is provided. The heat dissipation system includes a body and at least one fan. A heat source of the portable electronic device is disposed in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet, at least one flow outlet, and at least one spacing portion. The flow outlet faces toward the heat source, and the spacing portion surrounds the flow inlet and abuts against the body, so as to isolate the flow inlet and the heat source in two spaces independent of each other in the body.
    Type: Application
    Filed: January 11, 2022
    Publication date: July 21, 2022
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Chun-Chieh Wang, Shu-Hao Kuo
  • Publication number: 20220229042
    Abstract: Disclosed is a bioinstrumentation apparatus including a main unit, a detection portion, a light source, and an optics sensor. The bioinstrumentation apparatus is a kind of home health care device for testing Triglycerides automatically without requiring any chemical reagent or blood specimen.
    Type: Application
    Filed: January 21, 2021
    Publication date: July 21, 2022
    Applicant: Taiwan RedEye Biomedical Inc.
    Inventors: Shuo-Ting Yan, I-Hua Wang, Chen-Chung Chang
  • Publication number: 20220231471
    Abstract: An electrical connection module and a power supply integration structure of a connection interface of the electrical connection module are disclosed. The electrical connection module includes a connection body and a terminal structure. The connection body has a jack communicating with the inside of the connection body for installing the terminal structure in the connection body to communicate with the jack. The terminal structure includes multiple terminals arranged in two rows. Each row has one or more power terminals. The power terminal in one row is defined as a positive pin, the power terminal of the other row is defined as a negative pin. An end of the power terminal in each row is electrically connected to a conductive part respectively. The electrical connection module is disposed across a power guide base, and the conductive part is in contact with the power guide base to for the power integration.
    Type: Application
    Filed: March 22, 2021
    Publication date: July 21, 2022
    Inventors: Yun-Chang YANG, Siang-Ting WANG
  • Publication number: 20220228409
    Abstract: A pivot device with an interlocking lifting mechanism includes a first interlocking member to which first and second shafts and a second interlocking member are pivotably connected. A torque device is mounted around the first and second shafts. A third interlocking member is pivotably connected to the second interlocking member and includes a sliding groove. A fixing seat includes a pivotal member extending through the sliding groove. The second interlocking member is slidably received in a guiding groove of the guiding seat. When the first shaft pivots through a certain angle, the first interlocking member pivots about the second shaft and actuates the second interlocking member. The third interlocking member pivots relative to the fixing seat. The sliding groove slides relative to the pivotal member. The second distal end synchronously slides relative to the first guiding groove to lift an auxiliary screen unit connected to the third proximal end.
    Type: Application
    Filed: January 20, 2021
    Publication date: July 21, 2022
    Inventors: CHUN TI WANG, FU CHUN CHUNG, YU TING TING
  • Publication number: 20220228948
    Abstract: Aspects of the present disclosure describe distributed fiber optic sensing (DFOS) systems, methods, and structures that advantageously extend DFOS techniques to anomaly detection using optical magnetism switches (OMC) that are integrated into the DFOS system.
    Type: Application
    Filed: January 19, 2022
    Publication date: July 21, 2022
    Applicant: NEC LABORATORIES AMERICA, INC
    Inventors: Ming-Fang HUANG, Ting WANG
  • Patent number: 11394389
    Abstract: The present disclosure provides a buffer circuit and a buffer. The buffer circuit includes: an input follower circuit for following the voltage change of the first input signal; an input follower linearity boosting circuit for improving follower linearity of the input follower circuit; a first voltage bootstrap circuit for bootstrapping the voltage of the first input signal; a second voltage bootstrap circuit for bootstrapping the voltage of the second input signal; a third voltage bootstrap circuit for providing corresponding quiescent operation point voltage; a compensation follower circuit for following the compensation voltage; a compensation follower linearity boosting circuit for improving follower linearity of the compensation follower circuit; a first load for collecting the buffered voltage; a bias circuit for providing a bias current for the buffer; a bias linearity boosting circuit for improving linearity of the bias circuit; a second load for generating a nonlinear compensation current.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: July 19, 2022
    Assignee: NO.24 RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
    Inventors: Ting Li, Gangyi Hu, Ruzhang Li, Yong Zhang, Zhengbo Huang, Yabo Ni, Xingfa Huang, Jian'an Wang, Guangbing Chen, Dongbing Fu, Jun Yuan, Zicheng Xu
  • Patent number: 11392742
    Abstract: Implementations of the present disclosure provide coloring methods that sort and pre-color nodes of G0-linked networks in a multiple-patterning technology (MPT)-compliant layout design by coordinate. In one embodiment, a method includes identifying target networks in a circuit layout, each target network having two or more linked nodes representing circuit patterns, and each target network being presented in an imaginary X-Y coordinate plane, assigning a first feature to a first node in each target network, the first node is determined using a coordinate-based method, and assigning the first feature and a second feature to remaining nodes in each target network in an alternating manner so that any two immediately adjacent linked nodes in each target network have different features.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: July 19, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Ping Chiang, Ming-Hui Chih, Chih-Wei Hsu, Ping-Chieh Wu, Ya-Ting Chang, Tsung-Yu Wang, Wen-Li Cheng, Hui En Yin, Wen-Chun Huang, Ru-Gun Liu, Tsai-Sheng Gau
  • Patent number: D959381
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: August 2, 2022
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Hirotsugu Yamamoto, Ting Wang
  • Patent number: D959397
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: August 2, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Ting Xu, Jie Huang, Guang Cao, Mengyao Xie, Fei Wang