Patents by Inventor Ting Wang

Ting Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240251215
    Abstract: The present invention relates to a diaphragm for sound generating devices and a preparation method thereof, and a sound generating device. The diaphragm for sound generating devices comprises only one layer of a thermoplastic polyester elastomer film, wherein the thermoplastic polyester elastomer is formed by copolymerization of a polyester hard segment which is prepared by reacting an aromatic dicarboxylic acid with a dihydric alcohol and a soft segment containing an aliphatic polycarbonate, and the diaphragm has a thickness of 10-200 ?m, and a loss factor of 0.1-0.3 at a temperature of 23° C.
    Type: Application
    Filed: May 26, 2022
    Publication date: July 25, 2024
    Inventors: Ting WANG, Chun LI, Qiulin WEI
  • Publication number: 20240245767
    Abstract: The disclosure provides a composition comprising CpG ODN and one or more other adjuvants that work together with the immunomodulatory CpG ODN, such as an aluminum adjuvant, wherein the CpG ODN comprises or consists of a nucleotide sequence selected from SEQ ID NOs: 1-4, wherein at least one nucleotide in the nucleotide sequence is a chemically modified nucleotide having a structure of formula (I): wherein, Y is S or O, R is H or a positively charged counterion, B is independently an unmodified or modified nucleobase, and R1 is H, F, CI, OH, OMe, Me, O-ethyloxymethyl. Use of the composition, a pharmaceutical composition comprising the composition, a preparation method thereof, and use of the pharmaceutical composition are also disclosed.
    Type: Application
    Filed: April 29, 2022
    Publication date: July 25, 2024
    Inventors: Ligong WANG, Yan CHEN, Ting ZENG
  • Publication number: 20240245328
    Abstract: An improved near-infrared spectroscopy (NIRS) based handheld tissue oxygenation scanner employing a single transmitter-receiver pair, an integral inertial measurement sensor, an optional optical tracker, and wireless communications. Operational coordination among/between the elements are performed by a processor. The NIRS scanner device has a small foot print and permits the use of only a single transmitter/receiver pair to scan a large area of tissue manually, in real-time. Additional features and advantages of include battery power, hand held, may connect to a variety of computing devices via BlueTooth and/or WiFi, and may be modified to employ multiple transmitter/receivers to improve sensitivity and obtain absolute measurements.
    Type: Application
    Filed: January 21, 2024
    Publication date: July 25, 2024
    Applicant: NEC Laboratories America, Inc.
    Inventors: Sarper OZHARAR, Thomas FERREIRA de LIMA, Yue TIAN, Wataru KOHNO, Ting WANG
  • Publication number: 20240247076
    Abstract: The present invention relates to the pharmaceutical and biological field, and discloses a single-domain antibody against coagulation factor XI (FXI) and derived protein thereof. In particular, the present invention discloses a coagulation factor XI (FXI) binding protein derived from a single-domain antibody against coagulation factor XI (FXI) and use thereof.
    Type: Application
    Filed: July 2, 2021
    Publication date: July 25, 2024
    Inventors: Ting XU, Xiaoxiao WANG, Yuhao JIN, Kangping GUO, Ling WANG, Minjie PANG, Pilin WANG
  • Publication number: 20240246955
    Abstract: Heterobifunctional compounds (e.g., bi-functional small molecule compounds) and compositions comprising one or more of the heterobifunctional compounds are provided. The heterobifunctional compounds are used for the treatment of certain disease in a subject in need thereof. Methods for identifying such heterobifunctional compounds are also presented.
    Type: Application
    Filed: April 12, 2022
    Publication date: July 25, 2024
    Inventors: Jing LIU, Jialiang WANG, Xiaoran HAN, Ting YANG
  • Publication number: 20240250123
    Abstract: A method of forming a semiconductor device includes forming semiconductor strips protruding above a substrate and isolation regions between the semiconductor strips; forming hybrid fins on the isolation regions, the hybrid fins comprising dielectric fins and dielectric structures over the dielectric fins; forming a dummy gate structure over the semiconductor strip; forming source/drain regions over the semiconductor strips and on opposing sides of the dummy gate structure; forming nanowires under the dummy gate structure, where the nanowires are over and aligned with respective semiconductor strips, and the source/drain regions are at opposing ends of the nanowires, where the hybrid fins extend further from the substrate than the nanowires; after forming the nanowires, reducing widths of center portions of the hybrid fins while keeping widths of end portions of the hybrid fins unchanged, and forming an electrically conductive material around the nanowires.
    Type: Application
    Filed: February 29, 2024
    Publication date: July 25, 2024
    Inventors: Kuo-Cheng Chiang, Huan-Chieh Su, Shi Ning Ju, Kuan-Ting Pan, Chih-Hao Wang
  • Publication number: 20240247700
    Abstract: A method that includes measuring vibration levels in a semiconductor manufacturing apparatus, determining one or more sections of the semiconductor manufacturing apparatus that vibrate at levels greater than a predetermined vibration level, and reducing the vibration levels in the one or more sections to be at or within the predetermined vibration level by coupling one or more weights to an external surface of the semiconductor manufacturing apparatus in the one or more sections.
    Type: Application
    Filed: April 4, 2024
    Publication date: July 25, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Chen HO, Chih Ping LIAO, Chien Ting LIN, Jie-Ying YANG, Wei-Ming WANG, Ker-Hsun LIAO, Chi-Hsun LIN
  • Publication number: 20240249614
    Abstract: Disclosed are vehicle-infrastructure interaction systems and methods employing a distributed fiber optic sensing (DFOS) system operating with pre-deployed fiber-optic telecommunication cables buried alongside/proximate to highways/roadways which provide 24/7 continuous information stream of vehicle traffic at multiple sites; only require a single optical sensor cable that senses/monitors multiple locations of interest and multiple lanes of traffic; the single optical sensor cable measures multiple related information (multi-parameters) about a vehicle, including driving speed, wheelbase, number of axles, tire pressure, and others, that can be used to derive secondary information such as weight-in-motion; and overall information about a fleet of vehicles, such as traffic congestion or traffic-cargo volume. Different from merely traffic counts, our approach can provide the count grouped by vehicle-types and cargo weights.
    Type: Application
    Filed: January 19, 2024
    Publication date: July 25, 2024
    Applicant: NEC Laboratories America, Inc.
    Inventors: Shaobo HAN, Yuheng CHEN, Ming-Fang HUANG, Tingfeng LI, Ting WANG
  • Publication number: 20240250141
    Abstract: Semiconductor device and the manufacturing method thereof are disclosed. An exemplary semiconductor device comprises a dielectric layer formed over a conductive feature; a semiconductor stack formed over the dielectric layer, wherein the semiconductor stack including semiconductor layers stacked up and separated from each other; a first metal gate structure and a second metal gate structure formed over a channel region of the semiconductor stack, wherein the first metal gate structure and the second metal gate structure wrap each of the semiconductor layers of the semiconductor stack; and a first epitaxial feature disposed between the first metal gate structure and the second metal gate structure over a first source/drain region of the semiconductor stack, wherein the first epitaxial feature extends through the dielectric layer and contacts the conductive feature.
    Type: Application
    Filed: February 27, 2024
    Publication date: July 25, 2024
    Inventors: Chih-Chao Chou, Kuo-Cheng Chiang, Shi Ning Ju, Wen-Ting Lan, Chih-Hao Wang
  • Patent number: 12046480
    Abstract: A method of manufacturing a semiconductor device includes providing a semiconductor die and surrounding a sidewall of the semiconductor die with a dielectric material. The method further includes forming a post passivation interconnect (PPI) over the semiconductor die and electrically coupling the PPI with the semiconductor die. The method further includes molding the semiconductor die and the PPI into an integrated semiconductor package. The method further includes covering at least a portion of an outer surface of the integrated semiconductor package with a conductive layer, wherein the conductive layer is conformal to the morphology of the portion of the outer surface. Moreover, the method further includes forming a conductive path inside the integrated semiconductor package electrically coupled to the conductive layer and a ground terminal of the integrated semiconductor package.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: July 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Shou Zen Chang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Vincent Chen, Chuei-Tang Wang, Yen-Ping Wang, Hsien-Wei Chen, Wei-Ting Lin
  • Patent number: 12047242
    Abstract: Described is a novel framework, we call intent-based computing jobs assignment framework, for efficiently accommodating a clients' computing job requests in a mobile edge computing infrastructure. We define the intent-based computing job assignment problem, which jointly optimizes the virtual topology design and virtual topology mapping with the objective of minimizing the total bandwidth consumption. We use the Integer Linear Programming (ILP) technique to formulate this problem, and to facilitate the optimal solution. In addition, we employ a novel and efficient heuristic algorithm, called modified Steiner tree-based (MST-based) heuristic, which coordinately determines the virtual topology design and the virtual topology mapping. Comprehensive simulations to evaluate the performance of our solutions show that the MST-based heuristic can achieve an efficient performance that is close to the optimal performance obtained by the ILP solution.
    Type: Grant
    Filed: October 5, 2023
    Date of Patent: July 23, 2024
    Assignee: NEC Corporation
    Inventors: Philip Ji, Ting Wang, Zilong Ye
  • Publication number: 20240238432
    Abstract: A method for modifying glycoproteins is provided. The present disclosure also provides a method for producing glycoprotein-payload conjugates, the conjugates produced thereby, and the use thereof.
    Type: Application
    Filed: December 29, 2023
    Publication date: July 18, 2024
    Inventors: Shih-Hsien CHUANG, Yu-Wei LAI, Cheng-Chou YU, Shu-Ping YEH, Jin-Yu WANG, Shih-Chong TSAI, Wei-Ting SUN, Chin-Yi Huang
  • Publication number: 20240243821
    Abstract: Aspects are provided which resolve neighbor beam-wise interference. A UE obtains a plurality of reference signals from each of at least one neighbor base station, where each of the reference signals is obtained in a different beam, and each of the neighbor base station(s) is in a different neighbor cell. The UE then measures a signal strength associated with each of the reference signals, and the UE indicates one or more of the reference signals to a serving base station in a serving cell, where the signal strength of each of the reference signal(s) indicated to the serving base station exceeds a threshold RSRP. After the serving base station obtains the indication from the UE, the serving base station coordinates with the neighbor base station(s) to modify one or more transmission parameters in response to the indication.
    Type: Application
    Filed: July 9, 2021
    Publication date: July 18, 2024
    Inventors: Yiqing CAO, Peter GAAL, Bin HAN, Ting WANG, Xiao Feng WANG, Liangping MA, Alberto RICO ALVARINO, Yan LI, Zhimin DU, Lu GAO
  • Patent number: 12040219
    Abstract: A device includes a substrate, a first fin, a second fin, a first isolation structure, a second isolation structure, and a gate structure. The first fin extends from a p-type region of the substrate. The second fin extends from an n-type region of the substrate. The first isolation structure is over the p-type region and adjacent to the first fin. The first isolation structure has a bottom surface and opposite first and second sidewalls connected to the bottom surface, a first round corner is between the bottom surface and the first sidewall of the first isolation structure, and the first sidewall is substantially parallel to the second sidewall. The second isolation structure is over the n-type region and adjacent to the first fin. The first isolation structure is deeper than the second isolation structure. The gate structure is over the first isolation structure and covering the first fin.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: July 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsien-Chung Huang, Chiung-Wen Hsu, Mei-Ju Kuo, Yu-Ting Weng, Yu-Chi Lin, Ting-Chung Wang, Chao-Cheng Chen
  • Patent number: 12041582
    Abstract: This application provides example sidelink resource configuration methods and apparatuses. One example method includes receiving, by a first terminal, first configuration information of a sidelink resource, where the sidelink resource configured by using the first configuration information includes a common resource in resource pools or sidelink bandwidth part BWP resources of N terminals in a terminal group, the terminal group includes the first terminal, and N is a positive integer. The first terminal can then perform sidelink communication with a terminal in the terminal group on the sidelink resource.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: July 16, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Ting Wang, Hao Tang, Xinxian Li, Zhenfei Tang
  • Patent number: 12040412
    Abstract: Provided is a semiconductor device including a substrate, multiple first gate structures, and a protective structure. The substrate includes a first region and a second region. The first gate structures are disposed on the substrate in the first region. The protective structure conformally covers a sidewall of one of the first gate structures adjacent to the second region. The protective structure includes a lower portion and an upper portion disposed on the lower portion. The lower portion and the upper portion have different dielectric materials. A method of forming a semiconductor device is also provided.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: July 16, 2024
    Assignee: Winbond Electronics Corp.
    Inventors: Yu-Lung Wang, Yao-Ting Tsai, Jian-Ting Chen, Yuan-Huang Wei
  • Patent number: 12040329
    Abstract: A semiconductor device structure, along with methods of forming such, are described. The structure includes a semiconductor fin having a first portion having a first width and a second portion having a second width substantially less than the first width. The first portion has a first surface, the second portion has a second surface, and the first and second surfaces are connected by a third surface. The third surface forms an angle with respect to the second surface, and the angle ranges from about 90 degrees to about 130 degrees. The structure further includes a gate electrode layer disposed over the semiconductor fin and source/drain epitaxial features disposed on the semiconductor fin on opposite sides of the gate electrode layer.
    Type: Grant
    Filed: May 23, 2023
    Date of Patent: July 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen-Ting Lan, Shi Ning Ju, Kuo-Cheng Chiang, Kuan-Lun Cheng, Chih-Hao Wang
  • Publication number: 20240235668
    Abstract: A fast optical fiber identification system and method employing an acoustic pen that is connected to a portable device (such as a laptop, a smartphone, an iPad). The pen generates acoustic signals under the control of the portable device. The portable device interacts with a DFOS (Distributed Fiber Optic Sensor, e.g., a DAS or DVS) interrogator to notify the interrogator about the generated signals and receives a detection result from the interrogator. The result is either illustrated using a graph on the portable device, or as a tone of different volume, to indicate the strength of the pen's signal detected by the interrogator. As the pen touches/excites vibrationally/acoustically each of the fibers, the portable device notifies the user about the detected signal's strength or presence/no-presence, which allows a technician to quickly identify the fiber of interest.
    Type: Application
    Filed: October 11, 2023
    Publication date: July 11, 2024
    Applicant: NEC Laboratories America, Inc.
    Inventors: Junqiang HU, Yue-Kai HUANG, Ting Wang
  • Patent number: 12035120
    Abstract: Provided in the present disclosure is a diaphragm, comprising a diaphragm body, wherein the diaphragm body comprises a fixing portion at an outer side, a bendable ring portion provided protruding from an inner ring side of the fixing portion and elastically bendable, and an inner side portion at an inner ring side of the bendable ring portion, the diaphragm body is made of a waterproof and breathable material having waterproof and breathable micropores. According to the present disclosure, the diaphragm body is made of waterproof and breathable material having waterproof and breathable micropores so that the diaphragm body has micropores, and the sizes of the micropores are between the size of water molecules and the size of air molecules, such that air molecules can smoothly pass through the diaphragm, while the water molecules can be effectively prevented from passing therethrough.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: July 9, 2024
    Assignee: GOERTEK INC.
    Inventors: Xiaodong Cai, Ting Wang
  • Publication number: 20240224339
    Abstract: This disclosure provides systems, methods, and devices for wireless communication that support configuring associations between system information of at least one downlink (DL) anchor carrier and at least one random access channel (RACH) occasion (RO) of an uplink (UL) anchor carrier for initial access in flexible multicarrier operations. System information may be transmitted by a base station to a UE over the DL anchor carrier. In aspects, the at least one DL anchor carrier may be mapped to an UL anchor carrier, or to one or more candidate UL anchor carriers from which the UE may configurably select the UL anchor carrier, for initial access operations. In aspects, the UL anchor carrier and/or the one or more candidate UL anchor carriers may be respectively associated with one or more ROs. The UE may perform initial access operations over the UL anchor carrier using the associated one or more ROs.
    Type: Application
    Filed: July 16, 2021
    Publication date: July 4, 2024
    Inventors: Yiqing Cao, Jing Lei, Peter Gaal, Alberto Rico Alvarino, Kazuki Takeda, Juan Montojo, Wanshi Chen, Bin Han, Ting Wang, Yan Li, Zhimin Du, Kefeng Zhang