Abstract: An electrical connector includes an insulating housing, a plurality of first terminals, a plurality of second terminals, a metal element and a fastening assembly. The insulating housing has a first insulating body, a second insulating body surrounding the first insulating body, a third insulating body and a fourth insulating body. The third insulating body is disposed to a rear end of a top surface of the first insulating body. The fourth insulating body is disposed to a top surface of the third insulating body. The plurality of the first terminals are surrounded by the first insulating body and the second insulating body. The plurality of the second terminals are surrounded by the third insulating body. The metal element is disposed to an outer surface of the insulating housing. The fastening assembly is positioned above the fourth insulating body.

Abstract: A super resolution (SR) image generation circuit includes an image scale-up circuit, a stable SR processing circuit, a generative adversarial network (GAN) processing circuit, and a configurable basic block pool circuit. The image scale-up circuit is arranged to receive and process an input image to generate a scaled-up image. The stable SR processing circuit is arranged to receive a feature map of the input image to generate a stable delta value. The GAN processing circuit is arranged to receive the feature map to generate a GAN delta value. The configurable basic block pool circuit is arranged to dynamically configure a plurality of basic blocks according to a depth requirement of the input image, to generate a configuration result. The SR image generation circuit generates an SR image according to the scaled-up image, the stable delta value, and the GAN delta value.

Abstract: A heat dissipation system of an electronic device including a body, a plurality of heat sources disposed in the body, and at least one centrifugal heat dissipation fan disposed in the body is provided. The centrifugal heat dissipation fan includes a housing and an impeller disposed in the housing on an axis. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions, and the plurality of outlets respectively correspond to the plurality of heat sources.

Abstract: A separator for a lithium battery and a method for manufacturing the same are provided. The separator includes a substrate layer and a coating layer. The substrate layer is a polyolefin porous film and has a substrate thickness ranging from 10 to 30 micrometers. The coating layer is coated on the substrate layer, and has a coating layer thickness ranging from 1 to 5 micrometers. The coating layer includes a heat-resistant resin material and a plurality of inorganic ceramic particles glued in the heat-resistant resin material. The heat-resistant resin material has a melting point (Tm) or a glass transition temperature (Tg) of not less than 150° C. An average particle size of the inorganic ceramic particles is 10% to 40% of the coating layer thickness of the coating layer. The inorganic ceramic particles are stacked in the coating layer with a height of at least three layers.

Abstract: Provided is an isolated antigen-binding protein, wherein the drug is used for the treatment of tumor, and the isolated antigen-binding protein comprises a PD-L1 binding moiety and an OX40 binding moiety, wherein: the OX40 binding moiety is capable of recognizing and/or binding amino acid residues G70 and/or F71 in a human OX40 extracellular domain; and the PD-L1 binding moiety is capable of recognizing and/or binding amino acid residues I54, Y56, E58, Q66 and/or R113 in an N-terminal IgV domain of human PD-L1. Further provided is a use of the isolated antigen-binding protein in preparing a drug, wherein the drug is used for the treatment of tumors.

Abstract: An image sensor structure including a substrate, a first pixel structure, a second pixel structure, a dielectric layer, and a conductive layer stack is provided. The first pixel structure includes a first light sensing device. The second pixel structure includes a second light sensing device. The conductive layer stack includes conductive layers. The conductive layer stack has a first opening and a second opening. The first opening is located directly above the first light sensing device and passes through the conductive layers. The second opening is located directly above the second light sensing device and passes through the conductive layers. The second minimum width of the second opening is smaller than the first minimum width of the first opening. The luminous flux of the second pixel structure is different from the luminous flux of the first pixel structure.

Abstract: An integrated circuit includes a first and second active region, a first insulating region, and a first and second contact. The first and second active region extend in a first direction, and are on a first level. The first active region includes a first and second drain/source region. The second active region includes a third drain/source region. The first insulating region is over the first drain/source region. The first contact overlaps the third drain/source region, is electrically coupled to the third drain/source region and is located on a second level. The second contact includes a first and second portion. The first portion overlaps the first and second drain/source. The second portion overlaps the first contact, the first and third drain/source region, and the first insulating region, and is electrically coupled to the first portion, and electrically insulated from the first drain/source region.

Abstract: Aspects of the present disclosure describe distributed fiber optic sensing (DFOS) systems, methods, and structures that employ a distributed fiber optic sensor placement procedure that advantageously provides a desirable sensor coverage over a network at minimal cost.

Abstract: A terminal and a receptacle connector are provided. The terminal comprises a soldering segment, an upright arm and a bending arm. The soldering segment has a first end portion and the upright arm extends upwardly from the first end portion. The bending arm bends back and obliquely extends upwardly close to the upright arm and includes an upper bending segment and a contact segment extends upwardly from the upper bending segment. A shoulder portion is formed at each of at least one side edge of two side edges of each of at least one of the upright arm and the bending arm, the two side edges are connected with the soldering segment, the shoulder portion protrudes relative to a corresponding side edge of the soldering segment.

Abstract: The present invention relates to the field of printed circuit heat exchangers, and in particular, to a modular square-circular composite channel printed circuit heat exchanger. The modular square-circular composite channel printed circuit heat exchanger comprises a shell, wherein the shell is divided into an inlet diverter section, a first parallel heat exchange section, a core heat exchange section, a second parallel heat exchange section, and an outlet combiner section from left to right, a plurality of square fin channels and circular micro-channels are uniformly arranged in the shell along a length direction of the shell. According to the present invention, a ratio of an average thermal resistance of a hot side to an average thermal resistance of a cold side is close to 1, which ensures the heat exchange efficiency while taking into the account structure safety and prevents the local over-temperature.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure. The method includes forming a stack of semiconductor layers comprising a plurality of first semiconductor layers and a plurality of second semiconductor layers over a semiconductor substrate. A first stack of masking layers is formed over the stack of semiconductor layers with a first width and a second stack of masking layers is formed laterally offset from the stack of semiconductor layers with a second width less than the first width. A patterning process is performed on the semiconductor substrate and the stack of semiconductor layers, thereby defining a first fin structure laterally adjacent to a second fin structure. The first fin structure has the first width and the second fin structure has the second width. The stack of semiconductor layers directly overlies the first fin structure and has the first width.

Abstract: In a quick measurement module provided by the present invention, a first distance sensing unit and a second distance sensing unit are provided individually on a movable seat, so that when the movable seat is displaced along a linear shifting axis, the first distance sensing unit senses the distance from the first reference plane, and meanwhile, the second distance sensing unit senses the distance from the second reference plane, so as to sense the linearity accuracy in movement of the movable seat with respect to the first reference plane and the second reference plane. The first reference plane and the second reference plane are spaced apart by an angle other than a right angle, so that the linearity accuracy in movement in the two different planes, such as the horizontal linearity accuracy and vertical linearity accuracy, of the movable seat can be obtained through sensing.

Abstract: The present disclosure discloses an intelligent mapping method for a cloud tenant virtual network based on a reinforcement learning model, where a mapping algorithm is used to combine a resource abstraction model, Blocking Island, with a deep reinforcement learning algorithm, Actor-Critic, reasonably abstract underlying network resources by means of the Blocking Island model, and efficiently represent resource connectivity information of the entire network with an amount of available resources between nodes as a lower bound. The method specifically includes: (1): completing modeling of virtual network embedding; (2): modeling computing resources and bandwidth resources in a physical network; (3): constructing a neural network; and the like. Compared with the prior art, the present disclosure has better performance in average mapping cost, benefit-cost ratio, total benefit value and mapping success rate, further improves mapping accuracy, reduces the average mapping cost, and has a wide application prospect.

Abstract: An electronic system and a security authority delegation method thereof are provided. The electronic system includes a first host device, a second host device, a first security device, and a second security device. The first security device is connected to the first host device. The second security device is connected to the second host device and the first security device. The first security device performs an attestation process on the second security device. If the second security device passes the attestation process, the first security device enables the second security device to verify executable images of the second host device. If the second security device does not pass the attestation process, the first security device disables a function of the second security device, and the function includes verifying the executable image of the second host device.

Abstract: A data-driven street flood warning system that employs distributed fiber optic sensing (DFOS)/distributed acoustic sensing (DAS) and machine learning (ML) technologies and techniques to provide a prediction of street flood status along a telecommunications fiber optic cable route using the DFOS/DAS data and ML models. Operationally, a DFOS/DAS interrogator collects and transmits vibrational data resulting from rain events while an online web server provides a user interface for end-users. Two machine learning models are built respectively for rain intensity prediction and flood level prediction. The machine learning models serve as predictive models for rain intensity and flood levels based on data provided to them, which includes rain intensity, rain duration, and historical data on flood levels.

Abstract: The present disclosure provides use of Clostridium ghonii combined with a tumor angiogenesis inhibitor in preparing a pharmaceutical product for treating a tumor. The present disclosure further provides a drug for treating a tumor, where the drug includes active ingredients of Clostridium ghonii and a tumor angiogenesis inhibitor.

Abstract: A fusion protein is disclosed. The fusion protein of the invention comprises an Fc fragment of an immunoglobulin G and a bioactive molecule, wherein the Fc is a single chain Fc. The amino acids in the hinge of the Fc is mutated, substituted, or deleted so that the hinge of Fc cannot form disulfide bonds. Methods for producing and using the fusion protein of the invention are also provided.

Abstract: A device may receive, from a fiber sensor device, sensing data associated with a fiber optic cable, the sensing data being produced by an activity that poses a threat of damage to the fiber optic cable, and the sensing data identifying: amplitudes of vibration signals, frequencies of the vibration signals, patterns of the vibration signals, times associated with the vibration signals, and locations along the fiber optic cable associated with the vibration signals. The device may process, with a machine learning model, the sensing data to determine a threat level of the activity to the fiber optic cable, the machine learning model having been trained based on historical information regarding detected vibrations, historical information regarding sources of the detected vibrations, and historical information regarding threat levels to the fiber optic cable. The device may perform one or more actions based on the threat level to the fiber optic cable.

Abstract: An illumination system including a plurality of light-emitting elements, a light combining module, a first lens group, a second lens group and a wavelength conversion device is provided. The plurality of light-emitting elements provide a plurality of first light beams. The light combining module is used for combining the plurality of first light beams into a second light beam. The wavelength conversion device is used for converting the second light beam into the third light beam or reflecting the second light beam. The first lens group has a first central axis. The first lens group includes a first part and a second part which are symmetrical with respect to the first central axis and have equal areas, and a luminous flux of the second light beam passing through the first part is greater than a luminous flux passing through the second part.

Abstract: Systems, methods, and structures providing dynamic line rating (DLR) for overhead transmission lines based on distributed fiber optic sensing (DFOS)/distributed temperature sensing (DTS) to determine temperature of the electrical conductors. Environmental conditions such as wind speed, wind direction, and solar radiation data, are collected from environmental sensors and an acoustic modem that convert the digital data collected from the environmental sensors into generated vibration patterns that are subsequently used to vibrationally excite a DFOS optical sensor fiber. The DFOS system monitors the optical sensor fiber and detects, measures, and decodes the vibrational excitations. An Artificial Neural Network (ANN) determines a heat transfer correlation between the temperature of the optical sensor fiber and electrical conductor(s) (core temperature).