Patents by Inventor Ting Yang
Ting Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250110307Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: ApplicationFiled: December 12, 2024Publication date: April 3, 2025Inventors: Chao-Chang HU, Chih-Wei WENG, Chia-Che WU, Chien-Yu KAO, Hsiao-Hsin HU, He-Ling CHANG, Chao-Hsi WANG, Chen-Hsien FAN, Che-Wei CHANG, Mao-Gen JIAN, Sung-Mao TSAI, Wei-Jhe SHEN, Yung-Ping YANG, Sin-Hong LIN, Tzu-Yu CHANG, Sin-Jhong SONG, Shang-Yu HSU, Meng-Ting LIN, Shih-Wei HUNG, Yu-Huai LIAO, Mao-Kuo HSU, Hsueh-Ju LU, Ching-Chieh HUANG, Chih-Wen CHIANG, Yu-Chiao LO, Ying-Jen WANG, Shu-Shan CHEN, Che-Hsiang CHIU
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Publication number: 20250112088Abstract: A semiconductor structure is provided. The semiconductor structure includes a first low dielectric constant (low-k) layer, a first metal layer, a metal cap layer, a dielectric on dielectric (DoD) layer, an etch stop layer (ESL), a second low-k layer, a metal via and a second metal layer. The dielectric constant of the first low-k layer is less than 4. The first metal layer is embodied in the first low-k layer. The first low-k layer exposes the first metal layer. The metal cap layer is disposed on the first metal layer. The DoD layer is disposed on the first low-k layer. The etch stop layer is disposed on the metal cap layer and the DoD layer. The second low-k layer is disposed above the etch stop layer. The metal via is embodied in the second low-k layer and connected to the first metal layer.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Chin LEE, Yen Ju WU, Shao-Kuan LEE, Kuang-Wei YANG, Hsin-Yen HUANG, Jing Ting SU, Kai-Fang CHENG, Hsiao-Kang CHANG, Wei-Chen CHU, Shu-Yun KU, Chia-Tien WU, Ming-Han LEE, Hsin-Ping CHEN
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Patent number: 12266211Abstract: In implementations of the subject matter as described herein, there is provided a method for forgery detection of a face image. Subsequent to inputting a face image, it is detected whether a blending boundary due to the blend of different images exists in the face image, and then a corresponding grayscale image is generated based on a result of the detection, where the generated grayscale image can reveal whether the input face image is formed by blending different images. If a visible boundary corresponding to the blending boundary exists in the generated grayscale image, it indicates that the face image is a forged image; on the contrary, if the visible boundary does not exist in the generated grayscale image, it indicates that the face image is a real image.Type: GrantFiled: November 11, 2020Date of Patent: April 1, 2025Assignee: Microsoft Technology Licensing, LLCInventors: Jianmin Bao, Dong Chen, Hao Yang, Ting Zhang, Fang Wen, Baining Guo, Lingzhi Li
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Publication number: 20250104232Abstract: Provided in embodiments of the present application are an occlusion detection method for medical imaging, a medical imaging method, and a medical imaging system. The occlusion detection method for medical imaging includes: acquiring an image sequence, the image sequence including a plurality of images of an object in a time dimension; and according to at least one among confidence level change information and depth change information of a keypoint of the object in the plurality of images, determining an occlusion state of the keypoint.Type: ApplicationFiled: September 18, 2024Publication date: March 27, 2025Inventors: Ting Ye, Qingyu Dai, Xiaolan Liu, Hao Yang, Jian Cui, Ke Li
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Publication number: 20250105995Abstract: A transmission processing method, device and an apparatus are provided, which relates to the field of communication technology. The method is performed by a terminal, including: in a case that a transmission of an uplink channel and/or an uplink reference signal overlaps in time domain with any symbol in a set of symbols reception of synchronization signal blocks (SSBs), if at least one of the following conditions is fulfilled, sending, by the terminal, the uplink channel and/or the uplink reference signal the at least one condition includes: a network device adopts a defined first duplex mode; the terminal has a defined first capability; and the time domain resource and/or frequency domain resource of the uplink channel and/or uplink reference signal fulfills a defined first condition. The solution of the present disclosure solves the problem that the existing SSB transmission limits uplink transmission.Type: ApplicationFiled: December 21, 2022Publication date: March 27, 2025Inventors: Ting KE, Tuo YANG, Lijie HU, Fei WANG, Nan HU
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Publication number: 20250107082Abstract: A memory device includes a stack structure, a first stop layer, a dielectric layer, at least one separation wall and a conductive plug. The stacked structure is located over a substrate. The stacked structure has an opening exposing a stepped structure of the stacked structure. The first stop layer covers the stepped structure and at least at least one portion of sidewalls of the opening. The dielectric layer fills the opening and covers the first stop layer. The separation wall extends through the dielectric layer and the first stop layer in the opening. The conductive plug extends through the dielectric layer and the first stop layer, and is electrically connected to the stepped structure. The memory device may be a 3D NAND flash memory with high capacity and high performance.Type: ApplicationFiled: September 26, 2023Publication date: March 27, 2025Applicant: MACRONIX International Co., Ltd.Inventors: Chen-Yu Cheng, Chih-Kai Yang, Shih-Chin Lee, Tzung-Ting Han
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Patent number: 12262551Abstract: A method of manufacturing a semiconductor structure includes the following steps: providing a first semiconductor wafer, wherein the first semiconductor wafer includes a first dielectric layer and at least one first top metallization structure embedded in the first dielectric layer, and a top surface of the first dielectric layer is higher than a top surface of the first top metallization structure by a first distance; providing a second semiconductor wafer, wherein the second semiconductor wafer includes a second dielectric layer and at least one second top metallization structure embedded in the second dielectric layer, and a top surface of the second top metallization structure is higher than a top surface second dielectric layer of the by a second distance; and hybrid-bonding the first semiconductor wafer and the second semiconductor wafer.Type: GrantFiled: March 21, 2024Date of Patent: March 25, 2025Assignee: NANYA TECHNOLOGY CORPORATIONInventors: Ting-Cih Kang, Hsih-Yang Chiu
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Patent number: 12257514Abstract: A game board device is provided for carrying and identifying game pieces that are divided into different piece types. The game board device includes a board, a plurality of optically identifying modules, and a processing module electrically coupled to the optically identifying modules. The optically identifying modules respectively correspond in position to detection regions of the board. Each of the optically identifying modules includes a light emitter that can emit light toward the corresponding detection region and a light receiver that can receive light reflected by the corresponding detection region. When any one of the detection regions is in an unoccupied mode, the corresponding optically identifying module can emit an unoccupied signal. When any one of the detection regions is in an occupied mode, the corresponding optically identifying module enables an identification signal that corresponds to the piece type of the corresponding game piece to be emitted therefrom.Type: GrantFiled: March 14, 2024Date of Patent: March 25, 2025Assignee: PIXART IMAGING INC.Inventors: Chung-Ting Yang, Yen-Min Chang, Yen-Chang Wang
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Patent number: 12262642Abstract: A method for fabricating magnetoresistive random-access memory cells (MRAM) on a substrate is provided. The substrate is formed with a magnetic tunneling junction (MTJ) layer thereon. When the MTJ layer is etched to form the MRAM cells, there may be metal components deposited on a surface of the MRAM cells and between the MRAM cells. The metal components are then removed by chemical reaction. However, the removal of the metal components may form extra substances on the substrate. A further etching process is then performed to remove the extra substances by physical etching.Type: GrantFiled: November 17, 2023Date of Patent: March 25, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chang-Lin Yang, Chung-Te Lin, Sheng-Yuan Chang, Han-Ting Lin, Chien-Hua Huang
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Patent number: 12259709Abstract: A behavior recognition device for recognizing behaviors of a semiconductor manufacturing apparatus includes a storage device and a control unit. The storage device is configured to store log data of the semiconductor manufacturing apparatus. The control unit is cooperatively connected to the storage device, and configured to build a transition state model based on the log data to analyze behaviors related to wafer transfer sequences and manufacturing operations of the semiconductor manufacturing apparatus.Type: GrantFiled: November 23, 2023Date of Patent: March 25, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Kai-Ting Yang, Li-Jen Ko, Hsiang Yin Shen
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Publication number: 20250095332Abstract: Embodiments of the present disclosure provide a method and apparatus for video processing, a device, and a medium, the method includes: distributing first shoot frames to a recording unit and a content analysis unit during a shooting process; performing a recording processing on the first shoot frames by the recording unit to obtain a recorded video; and performing a content analysis processing on the first shoot frames by the content analysis unit to obtain content analysis results of the first shoot frames; in case of obtaining the recorded video, determining a content analysis result of the recorded video based on the content analysis results of the first shoot frames; the content analysis result of the recorded video is used when performing an edit processing on the recorded video.Type: ApplicationFiled: September 22, 2023Publication date: March 20, 2025Inventors: Guangde HUANG, Zhanpeng HUANG, Xuyue HAN, Ting LUO, Yihan YANG
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Publication number: 20250096209Abstract: A power module, having a bottom substrate, a device substrate arranged on the bottom substrate and an inductor assembly arranged on the device substrate. The device substrate having a first power device chip and a second power device chip embedded within the device substrate. Each power device chip has a first surface and a second surface. The first surface of each power device chip is covered by a top heat layer, and the second surface of each power device chip has a plurality of pins or pads exposed on the second surface of the device substrate, and connected to the bottom substrate.Type: ApplicationFiled: September 19, 2023Publication date: March 20, 2025Inventors: Ting Ge, Yingjiang Pu, Hunt Hang Jiang, Daocheng Huang, Yuanfeng Zhou, Qian Li, Cong Deng, Zhe Yang, Wenyang Huang
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Publication number: 20250095902Abstract: A power module having a bottom substrate, a device substrate arranged on the bottom substrate and an inductor assembly arranged on the device substrate. The inductor assembly has a first winding, a second winding, a first magnetic core part and a second magnetic core part. The first magnetic core part has a first portion disposed on a first horizontal level and a second portion disposed on a second horizontal level. The second magnetic core part has a first portion disposed on the second horizontal level and a second portion disposed on the first horizontal level. The first and second magnetic core parts are assembled to accommodate the first winding between the first portions of the first and second magnetic core part, and to accommodate the second winding between the second portions of the first and second magnetic core part.Type: ApplicationFiled: September 19, 2023Publication date: March 20, 2025Inventors: Ting Ge, Daocheng Huang, Zhe Yang, Wenyang Huang
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Publication number: 20250095147Abstract: A method and apparatus for determining the orientation of a subject during medical imaging, and a medical imaging system is provided. The method includes: acquiring an image sequence of a subject captured by a camera, the image sequence comprising a plurality of images based on a time sequence; determining, based on the image sequence, whether the state of the subject is abnormal; and in response to a determination result that the state of the subject is abnormal, determining the orientation of the subject by using a first orientation or a second orientation, wherein the first orientation is the orientation of the subject determined based on an image before a period when the state of the subject is determined to be abnormal, and the second orientation is the orientation of the subject determined based on an image after the period when the state of the subject is determined to be abnormal.Type: ApplicationFiled: September 18, 2024Publication date: March 20, 2025Inventors: Ting Ye, Xiaolan Liu, Qingyu Dai, Hao Yang, Jian Cui, Yuyang Huang
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Publication number: 20250095932Abstract: An electronic device includes a casing, an exterior button, a sliding assembly and an internal button. The casing includes an outer surface and an opening at the outer surface. The exterior button has a first side and a second side opposite to each other, the first side is pivotally connected to the casing so that the exterior button is rotatably disposed at the casing. The sliding assembly is movably disposed on the casing, and includes a sliding body, a toggle and a pusher, the sliding body is located in the casing, the toggle is fixed to the sliding body and exposed to the casing, and the pusher is linked with the sliding body in a first direction, and is movably disposed at the sliding body in a second direction. The inner button is located in the casing, and the sliding assembly is located between the outer button and the inner button.Type: ApplicationFiled: August 8, 2024Publication date: March 20, 2025Applicant: ASUSTeK COMPUTER INC.Inventors: Wei-Ting Cheng, Ching-Yuan Yang
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Publication number: 20250095195Abstract: A keypoint detection method is provided for medical imaging, a medical imaging method and a medical imaging system. The keypoint detection method for medical imaging includes: receiving an image sequence, the image sequence comprising a plurality of images of an object; performing keypoint detection on the plurality of images separately, and generating a keypoint image sequence; performing keypoint occlusion detection on the images in the image sequence; and determining keypoint distribution information according to the keypoint image sequence and a result of the keypoint occlusion detection.Type: ApplicationFiled: September 12, 2024Publication date: March 20, 2025Inventors: Qingyu Dai, Ting Ye, Xiaolan Liu, Hao Yang, Ke Li, Jian Cui
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Publication number: 20250086829Abstract: A method for defining valid die positions on an inspection wafer map includes the following steps. A position of a reference die in an inspection wafer map is obtained, and the position of the reference die is adjacent to a center point of the inspection wafer map. A map center data is obtained, and the coordinates of the reference die in the map center data is calculated. A relative offset between the coordinate system of the inspection wafer map and the coordinate system of the map center data is calculated according to the coordinates of the reference die in the map center data. The valid die positions of the map center data are returned to the inspection wafer map and the inspection wafer map is modified to generate a correct valid die map.Type: ApplicationFiled: October 24, 2023Publication date: March 13, 2025Inventors: Hsiang-Yuan HU, Tzu-Chung YANG, Chien-Ting LI, Ming-Hsiu LO
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Publication number: 20250087532Abstract: A method includes forming a metal layer over a dielectric layer; forming hard masks over the metal layer; etching the metal layer using the hard masks as etch mask to form metal features; selectively forming dielectric liners on opposite sidewalls of each of the metal features, while leaving surfaces of the hard masks and the dielectric layer exposed by the dielectric liners; and forming an inter-metal dielectric layer laterally surrounding the metal features.Type: ApplicationFiled: September 12, 2023Publication date: March 13, 2025Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Kuang-Wei YANG, Cheng-Chin LEE, Shao-Kuan LEE, Jing Ting SU, Hsin-Ning HUNG, Hsin-Yen HUANG, Hsiao-Kang CHANG
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Publication number: 20250082157Abstract: There is provided a robot including a first light source, a second light source, an image sensor and a processor. The processor is used to calculate an image quality of an image frame captured by the image sensor when the second light source is being turned on. The processor then determines whether to switch the second light source back to the first light source according to the image quality to accordingly identify the material of an operation surface.Type: ApplicationFiled: November 22, 2024Publication date: March 13, 2025Inventors: CHUNG-TING YANG, KAI-HO TSAI
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Publication number: 20250074776Abstract: The present invention provides a method for preparing an activated carbon, which includes impregnating a carbonaceous material with carbonated water; and exposing the carbonaceous material to microwave radiation to produce the activated carbon.Type: ApplicationFiled: September 1, 2023Publication date: March 6, 2025Inventors: Feng-Huei LIN, Chih-Chieh CHEN, Chih-Wei LIN, Chi-Hsien CHEN, Yue-Liang GUO, Ching-Yun CHEN, Chia-Ting CHANG, Che-Yung KUAN, Zhi-Yu CHEN, I-Hsuan YANG