Patents by Inventor Ting-Yu Shen

Ting-Yu Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for modulating stresses of a contact etch stop layer
    Publication number: 20080085607
    Abstract: A method for forming a semiconductor structure includes providing a substrate comprising a first device region, forming a metal-oxide-semiconductor (MOS) device in the first device region, forming a stressed layer over the MOS device, and performing a post-treatment to modulate a stress of the stressed layer. The post-treatment is selected from the group consisting essentially of ultra-violet (UV) curing, laser curing, e-Beam curing, and combinations thereof.
    Type: Application
    Filed: September 19, 2006
    Publication date: April 10, 2008
    Inventors: Chen-Hua Yu, Hung Chun Tsai, Hui-Lin Chang, Ting-Yu Shen, Yung-Cheng Lu
  • Bond pads and methods for fabricating the same
    Publication number: 20070080460
    Abstract: Bond pads for semiconductor devices and method for fabricating the same are provided. A bond pad has a first passivation layer having a plurality of openings. A conductive layer which overlies the openings and portions of the first passivation layer, having a first portion overlying the first passivation layer and a second portion overlying the openings. A second passivation layer overlies the first passivation layer and covers edges of the conductive layer.
    Type: Application
    Filed: October 11, 2005
    Publication date: April 12, 2007
    Inventors: Chen-Hua Yu, Shwang-Ming Jeng, Yung-Cheng Lu, Huilin Chang, Ting-Yu Shen, Yichi Liao