Patents by Inventor Tingting Cui

Tingting Cui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200328159
    Abstract: A panel-level chip device and a packaging method for forming the panel-level chip device are provided. The panel-level chip device includes a plurality of first bare chips disposed on a supporting base, and a plurality of first connection pillars. The panel-level chip device also includes a first encapsulation layer, and a first redistribution layer. The first redistribution layer includes a plurality of first redistribution elements and a plurality of second redistribution elements. Further, the panel-level chip device includes a solder ball group including a plurality of first solder balls. First connection pillars having a same electrical signal are electrically connected to each other by a first redistribution element. Each of remaining first connection pillars is electrically connected to one second redistribution element. The one second redistribution element is further electrically connected to a first solder ball of the plurality of first solder balls.
    Type: Application
    Filed: June 28, 2019
    Publication date: October 15, 2020
    Inventors: Kerui XI, Feng QIN, Jine LIU, Xiaohe LI, Tingting CUI
  • Publication number: 20200316591
    Abstract: A drive circuit and its drive method, and a panel and its drive method are provided. The drive circuit includes a step-up unit, a plurality of signal input terminals and a signal output terminal. The step-up unit includes a first module, a second module and a first capacitor. The first module is configured to transmit a signal of a third signal input terminal to a first electrode of the first capacitor. The second module is configured to transmit a signal of a fourth signal input terminal to a second electrode of the first capacitor at a first time period which generates a voltage difference between two electrodes of the first capacitor, and to transmit the signal of the fourth signal input terminal to the second electrode of the first capacitor at a second time period which further increases a signal of the first electrode of the first capacitor.
    Type: Application
    Filed: June 29, 2019
    Publication date: October 8, 2020
    Inventors: Kerui XI, Xiaohe LI, Feng QIN, Jine LIU, Tingting CUI, Baiquan LIN
  • Publication number: 20200316590
    Abstract: A drive circuit and its drive method, and a panel and its drive method are provided. The drive circuit includes a step-up unit, a plurality of signal input terminals and a signal output terminal, which are electrically connected with each other. The step-up unit includes a first module, a second module, a third module and a first capacitor, which are electrically connected with each other. The first module is configured to transmit a signal of a third signal input terminal to a first electrode of the first capacitor. The second module is configured to transmit a signal of a fourth signal input terminal to a second electrode of the first capacitor. The third module is configured to transmit a signal of the third signal input terminal to the second electrode of the first capacitor, which further increases the signal of the first electrode of the first capacitor.
    Type: Application
    Filed: June 27, 2019
    Publication date: October 8, 2020
    Inventors: Kerui XI, Feng QIN, Xiangjian KONG, Jiubin ZHOU, Guicai WANG, Yajie WANG, Tingting CUI
  • Publication number: 20200312772
    Abstract: Chip package structure and chip package method are provided. The chip package structure includes an encapsulating layer, a redistribution layer, a soldering pad group, and bare chips. Connecting posts is formed on a side of the bare chips. The encapsulating layer covers the bare chips and the connecting posts, while exposes a side of the connecting posts away from the bare chips. The redistribution layer on the connecting posts includes a first redistribution wire, a second redistribution wire, and a third redistribution wire. The first redistribution wire and the second redistribution wire are electrically connected to at least one connecting post respectively, and the third redistribution layer is electrically connected to remaining connecting posts. The soldering pad group on the redistribution layer includes an input soldering pad electrically connected to the first redistribution wire and an output soldering pad electrically connected to the second redistribution wire.
    Type: Application
    Filed: June 14, 2019
    Publication date: October 1, 2020
    Inventors: Kerui XI, Feng QIN, Jine LIU, Xiaohe LI, Tingting CUI, Yuan DING
  • Publication number: 20200306754
    Abstract: A microfluidic chip, a method for driving a microfluidic chip and an analysis apparatus are provided. An exemplary microfluidic chip includes a substrate; a number of M driving electrodes disposed on a side of the substrate and arranged along a first direction; and a number of N signal terminals electrically connected to the number of M driving electrodes. Any three adjacent driving electrodes are connected to different signal terminals, respectively; a number of A of the number of M driving electrodes are connected to a same signal terminal; and M, N and A are positive integers, and M?4, N?3, M>N, and A?2.
    Type: Application
    Filed: June 18, 2019
    Publication date: October 1, 2020
    Inventors: Kerui XI, Feng QIN, Jine LIU, Xiaohe LI, Tingting CUI
  • Publication number: 20200312779
    Abstract: Chip package method and chip package structure are provided. The chip package method includes: providing a transparent substrate including a first side and a second side; coating the first side of the transparent substrate with an organic polymer material layer; depositing a protective layer on the organic polymer material layer; forming alignment parts on the protective layer; attaching a plurality of chips including metal pins; forming an encapsulating layer on the protective layer; polishing the encapsulating layer to expose the metal pins; forming a first insulating layer; forming first through holes in the first insulating layer; forming metal parts extending along sidewalls of the first through holes; and irradiating the second side of the transparent substrate by a laser to lift off the transparent substrate. The metal parts are insulated from each other and electrically connected to the metal pins.
    Type: Application
    Filed: June 28, 2019
    Publication date: October 1, 2020
    Inventors: Kerui XI, Feng QIN, Jine LIU, Xiaohe LI, Tingting CUI
  • Publication number: 20200312763
    Abstract: Chip package structure and chip package method are provided. The chip package structure includes an encapsulating layer, a first metal layer, a second metal layer, and bare chips. The bare chips include first bare chips and second bare chips. First-connecting-posts are formed on a side of the first bare chips and on a side of the second bare chips. The encapsulating layer covers the bare chips and the first-connecting-posts. The first metal layer is disposed on the side of the first-connecting-posts away from the bare chips and includes first capacitor polar plates and conductive parts. The first capacitor polar plates are electrically connected to the first-connecting-posts on the first bare chips, and the conductive parts are electrically connected to the first-connecting-posts on the second bare chips. The second metal layer is disposed on a side of the first metal layer away from the encapsulating layer and includes second capacitor polar plates electrically connected to the conductive parts.
    Type: Application
    Filed: June 14, 2019
    Publication date: October 1, 2020
    Inventors: Kerui XI, Feng QIN, Jine LIU, Xiaohe LI, Tingting CUI, Xuhui PENG
  • Patent number: 10790225
    Abstract: Chip package structure and chip package method are provided. The chip package structure includes an encapsulating layer, a first metal layer, a second metal layer, and bare chips. The bare chips include first bare chips and second bare chips. First-connecting-posts are formed on a side of the first bare chips and on a side of the second bare chips. The encapsulating layer covers the bare chips and the first-connecting-posts. The first metal layer is disposed on the side of the first-connecting-posts away from the bare chips and includes first capacitor polar plates and conductive parts. The first capacitor polar plates are electrically connected to the first-connecting-posts on the first bare chips, and the conductive parts are electrically connected to the first-connecting-posts on the second bare chips. The second metal layer is disposed on a side of the first metal layer away from the encapsulating layer and includes second capacitor polar plates electrically connected to the conductive parts.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: September 29, 2020
    Assignee: SHANGHAI AVIC OPTO ELECTRONICS CO., LTD.
    Inventors: Kerui Xi, Feng Qin, Jine Liu, Xiaohe Li, Tingting Cui, Xuhui Peng
  • Patent number: 10733939
    Abstract: Disclosed are a pixel circuit, a display panel and a drive method for a pixel circuit. The pixel circuit comprises: a light-emitting element, configured for emitting light in response to a drive current; a drive transistor, configured for providing the drive current to the light-emitting element; a data write device, configured for writing a data signal to a gate electrode of the drive transistor; a hold device, electrically connected with the gate electrode of the drive transistor and configured for holding a voltage on the gate electrode of the drive transistor in a light-emitting stage; and a control device, electrically connected with the gate electrode of the drive transistor and configured for controlling the drive transistor to operate in a full cut-off region in a cut-off stage, wherein, the cut-off stage precedes the light-emitting stage.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: August 4, 2020
    Assignee: SHANGHAI TIANMA AM-OLED CO., LTD.
    Inventors: Kerui Xi, Junting Ouyang, Baiquan Lin, Tingting Cui
  • Publication number: 20200223789
    Abstract: The present disclosure discloses a rosin-based small molecular weight hydrogelator and an application thereof, and belongs to the fields of supramolecular chemistry, surfactant science and chemical utilization of rosin. The rosin-based small molecular hydrogel of the present disclosure can gel water at a very low concentration, and the critical gelling concentration is only 0.176 wt %. On average, each gelling agent molecule can hold 13,889 water molecules, which exhibits extremely high gel efficiency and the formed small molecular hydrogel also exhibits extremely high stability. This small molecule hydrogel is derived from the natural product rosin and has a mild nature. It can be used in the fields of drug sustained-release, tissue engineering, daily chemicals, medicine and so on.
    Type: Application
    Filed: March 27, 2020
    Publication date: July 16, 2020
    Inventors: Binglei SONG, Tingting YAN, Danping WANG, Zhenggang CUI
  • Patent number: 10699650
    Abstract: A driving method for an electrowetting panel is provided. The electrowetting panel includes M driving electrodes sequentially arranged along a first direction. The driving method includes providing electrical signals to the M driving electrodes, such that a droplet is acquired from a solution reservoir by the 1st driving electrode, and is driven to move by the M driving electrodes. During a droplet moving period, a pulse width of a driving signal of an mth driving electrode is Wm = ? i = 1 m ? ? W i , a pulse width of a non-driving signal between an ath driving signal and an (a+1)th driving signal of the mth driving electrode is Zma = ? i = m + 1 m + a ? ? W i . M, m, and a are positive integers, 1?m?M, and M?3. The end time of the 1st driving signal of the mth driving electrode and the end time of the mth driving signal of the 1st driving electrode are the same.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: June 30, 2020
    Assignee: SHANGHAI AVIC OPTO ELECTRONICS CO., LTD.
    Inventors: Kerui Xi, Feng Qin, Jine Liu, Xiaohe Li, Tingting Cui, Yuan Ding
  • Patent number: 10649250
    Abstract: A photosensitive detection module is provided, comprising a photosensitive circuit, wherein the photosensitive circuit comprises a first resistive element, a second resistive element, a third resistive element, a fourth resistive element to form a resistor bridge, a first input terminal connected to a node between the first resistive element and the third resistive element, a second input terminal connected to a node between the second resistive element and the fourth resistive element, a first output terminal connected to a node between the first resistive element and the second resistive element, and a second output terminal connected to a node between the third resistive element and the fourth resistive element. All four resistive elements have an identical initial resistance value. The first resistive element and the fourth resistive element are photosensitive resistive elements.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: May 12, 2020
    Assignee: SHANGHAI AVIC OPTOELECTRONICS CO., LTD.
    Inventors: Kerui Xi, Tingting Cui, Xiaohe Li
  • Patent number: 10607521
    Abstract: The embodiments of the present disclosure provide an emission controller, a control method thereof and a display device, capable of preventing luminance of sub-pixels from deviating from its standard value and improving display quality. The emission controller includes a plurality of emission control circuits each including: a first processing module configured to receive a first voltage signal, provide a first signal to a first node and a second signal to a second node; a second processing module configured to provide a third signal to a third node; a third processing module configured to receive a second voltage signal and provide a fourth signal to the first and third nodes; a fourth processing module configured to pull down signal at the first node; and a gating module configured to receive the first voltage signal and the second voltage signal and provide an emission control signal to the emission control signal terminal.
    Type: Grant
    Filed: November 23, 2018
    Date of Patent: March 31, 2020
    Assignee: SHANGHAI TIANMA AM-OLED CO., LTD.
    Inventors: Kerui Xi, Tingting Cui, Feng Qin, Xingyao Zhou, Boquan Lin
  • Patent number: 10607540
    Abstract: Provided are a display panel and a display device. A pixel circuit in the disclosed display panel includes a driving module, a data writing module, a storage module, and at least one control module. The data writing module is configured to write a data signal into a control terminal of the driving module. The storage module is electrically connected to the control terminal of the driving module for maintaining a voltage on the control terminal of the driving module in an emit-lighting phase. The control module is electrically connected to the control terminal of the driving module for writing a signal into the control terminal of the driving module prior to the light-emitting stage. At least one hollowed structure is provided on the continuous gate structure of the control transistor of the control module. At least one channel's width-to-length ratio is different from others among the overlapping portions' channels.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: March 31, 2020
    Assignee: SHANGHAI TIANMA AM-OLED CO., LTD.
    Inventors: Kerui Xi, Tingting Cui, Baiquan Lin, Junting Ouyang, Ruiyuan Zhou
  • Patent number: 10600353
    Abstract: Disclosed are a method for driving a pixel circuit, a display panel and a display device. The pixel circuit includes: a data write module, a drive transistor, a hold module and a light-emitting element. The method comprises, in a time period for a frame of display: a data writing stage in which a data signal is written by the data write module into a gate electrode of the drive transistor; a light-emitting stage in which a voltage on the gate electrode of the drive transistor is held by the hold module, the drive transistor supplies a drive current to the light-emitting element, and the light-emitting element emits light in response to the drive current; and a cut-off stage in which the drive transistor operates in a full cut-off region.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: March 24, 2020
    Assignee: SHANGHAI TIANMA AM-OLED CO., LTD.
    Inventors: Kerui Xi, Tingting Cui, Baiquan Lin, Junting Ouyang, Zhonglan Cai
  • Patent number: 10551956
    Abstract: An array substrate includes a plurality of pixel units defined by intersected gate electrode lines and data lines, a plurality of independent touch-control electrodes arranged in an array, and a touch-control circuit. The touch-control circuit includes a plurality of first switch units, a plurality of first control leads, a plurality of touch-detection terminals, and a control unit. The touch-control electrode is electrically connected to one touch-control terminal through at least one of the first switch units. The first switch unit is electrically connected to the control unit through at least one of the first control leads. The first control lead is configured between any of neighboring rows of the pixel units. Further, when the array substrate is in a touch detection phase, the control unit is capable of controlling an ON status of the first switch units to allow row-by-row control of touch detection for the plurality of touch-control electrodes.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: February 4, 2020
    Assignees: Shanghai AVIC OPTO Electronics Co., Ltd., Tianma Micro-electronics Co., Ltd.
    Inventors: Kerui Xi, Tingting Cui
  • Publication number: 20190393245
    Abstract: In an array substrate, an electronic paper display panel and a drive method thereof, and a display device, a display area includes multiple sub-display areas. A plurality of scanning lines in each sub-display area are electrically insulated from each other, corresponding scanning lines in different sub-display areas are electrically connected to each other and display time of each sub-display area is controlled through control signal lines. When a control chip and a flexible circuit board are employed, only a small number of control chips and/or flexible circuit boards, or even only one control chip and/or one flexible circuit board, may drive multiple sub-display areas to display pictures.
    Type: Application
    Filed: November 13, 2018
    Publication date: December 26, 2019
    Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.
    Inventors: Kerui Xi, Tingting Cui, Feng Qin, Jine Liu, Xiaohe Li
  • Patent number: 10515597
    Abstract: A display device and a driving method thereof are provided. The display device has a display panel and a field-sequential backlight module arranged opposite to the display panel. The display panel includes a light incident surface and a light exit surface arranged opposite to the light incident surface. The field-sequential backlight module is disposed at a side of the display panel close to the light incident surface, and includes a plurality of light sources of three different colors. The display panel include a first substrate, a second substrate disposed opposite to the first substrate, and a liquid crystal layer sandwiched between the first substrate and the second substrate. The liquid crystal layer is configured to enable the display device to switch between an opaque or translucent state and a transparent state without introducing any polarizers to the display device.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: December 24, 2019
    Assignee: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Tingting Cui, Kerui Xi, Yumin Han
  • Patent number: 10514813
    Abstract: An electronic paper display panel, a touch detecting method thereof and an electronic device are provided. The electronic paper display panel includes: a first substrate and a pixel electrode array which is arranged on the first substrate; an inductance coil array disposed between the first substrate and the pixel electrode array and including a plurality of inductance coils arranged in array, each inductance coil has an input terminal and an output terminal; a plurality of driving lines arranged with the plurality of inductance coils respectively, each driving line is electrically connected to the input terminal of the corresponding inductance coil; and a plurality of touch lines arranged with the plurality of inductance coils respectively, each touch line is electrically connected to the output terminal of the corresponding inductance coil.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: December 24, 2019
    Assignee: SHANGHAI AVIC OPTO ELECTRONICS CO., LTD.
    Inventors: Kerui Xi, Tingting Cui
  • Publication number: 20190361307
    Abstract: A 3D printed display panel includes two opposing substrates and a black matrix formed on one of the substrates. The light proof areas of the black matrix include multiple first portions, multiple second portions and multiple third portions arranged to form a grid structure. The first portions and the third portions are alternately arranged in a direction of the scanning lines, the second portions and the third portions are alternately arranged in a direction of the data lines. Meshes of the grid structure are aperture zones of the black matrix. The aperture zones are in one-to-one correspondence with the pixel units. A vertical projections of the scanning lines and the data lines on the second substrate are located in the lightproof areas; where a minimum width of one first portion is X, a minimum width of one second portion is Y, and |X?Y|?2 ?m.
    Type: Application
    Filed: August 6, 2019
    Publication date: November 28, 2019
    Inventors: Kerui XI, Chen WANG, Feng QIN, Xiaohe LI, Jine LIU, Tingting CUI