Patents by Inventor To-An TING

To-An TING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12195866
    Abstract: A plating membrane includes a support structure extending radially outward from a nozzle that is to direct a flow of a plating solution toward a wafer. The plating membrane also includes a frame, supported by the support structure, having an inner wall that is angled outward from the nozzle. The outward angle of the inner wall relative to the nozzle directs a flow of plating solution from the nozzle in a manner that increases uniformity of the flow of the plating solution toward the wafer, reduces the amount of plating solution that is redirected inward toward the center of the plating membrane, reduces plating material voids in trenches of the wafer (e.g., high aspect ratio trenches), and/or the like.
    Type: Grant
    Filed: July 28, 2023
    Date of Patent: January 14, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yung-Hsiang Chen, Hung-San Lu, Ting-Ying Wu, Chuang Chihchous, Yu-Lung Yeh
  • Patent number: 12199436
    Abstract: A micro-power wind-solar hybrid energy harvesting and power generating device including a solar power generation module, a wind power generation module, a control module, an energy storage module, and an accessory structure are provided. The solar power generation module is mainly composed of a solar thin film cell and a corresponding interface control circuit, and the wind power generation module includes a wind-induced vibration structure, a cantilever beam structure, a piezoelectric element, and a corresponding interface control circuit. The solar thin film cell is mounted at a top of the wind-induced vibration structure, and interface control circuits, the energy storage module, etc. are all arranged inside the wind-induced vibration structure. The control module is configured to handle an energy harvesting and power generating algorithm of the wind-solar hybrid power generating device to maximize the power generation quality and the power generation efficiency of the device.
    Type: Grant
    Filed: October 11, 2022
    Date of Patent: January 14, 2025
    Assignees: State Grid Jiangsu Electric Power Co., Ltd. Research Institute, STATE GRID JIANGSU ELECTRIC POWER CO., LTD., TAIZHOU POWER SUPPLY BRANCH OF STATE GRID JIANGSU ELECTRIC POWER CO., LTD., JIANGSU ELECTRIC POWER RESEARCH INSTITUTE CO., LTD.
    Inventors: Yongling Lu, Zhen Wang, Chengbo Hu, Jinggang Yang, Jun Jia, Guojiang Zhang, Rong Sun, Hui Fu, Rushan Wang, Ting Chen, Nan Yao, Ziquan Liu, Xueqiong Zhu, Hai Xue
  • Patent number: 12198297
    Abstract: The present invention discloses an image enlarging method having super resolution enlarging mechanism that includes the steps outlined below. An enlarging module of a neural network system receives an input image to generate an enlarged image. A front end convolutional path included in a neural network module of the neural network system receives the input image to perform convolution to generate a front end operation output result. Branching convolutional paths included in the neural network module respectively receive the front end operation output result to perform convolution to generate groups of output image residues. A mixing module of the neural network system weights the output image residues according to weighing settings related to image regions of the input image and mixes the weighted output image residues to generate a group of final output image residue such that an enhancement module enhances the enlarged image to generate an output enlarged image.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: January 14, 2025
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Yen-Lin Chen, Cheng-Yu Kuan, Yi-Ting Bao
  • Patent number: 12197712
    Abstract: Systems and processes for operating an intelligent automated assistant are provided. In one example, a plurality of data items selected by a user are received, wherein a plurality of confidence values corresponding to the plurality of data items are identified. The plurality of data items is ordered. The first data item is displayed, and updated context information associated with the electronic device is received. An update to the plurality of confidence values is detected, wherein the updated plurality of confidence values includes a third confidence value associated with a third data item of the plurality of ordered data items. In accordance with a determination that the third confidence value is higher than a first confidence value of the first data item, an order of the plurality of ordered data items is modified, and the third data item of the plurality of ordered data items is displayed.
    Type: Grant
    Filed: December 13, 2023
    Date of Patent: January 14, 2025
    Assignee: Apple Inc.
    Inventors: John L. Blatz, Akshay Aggarwal, Radhika Bhargava, Daiwei Liu, Pallavika Ramaswamy, Kelvin Ting Pui So
  • Patent number: 12194015
    Abstract: The present invention provides a composition, comprising ferrous amino acid chelate particles sintered from ferrous amino acid chelate, wherein the average particle size of the ferrous amino acid chelate particles ranges from 500 nm to 2600 nm, and the average molecular weight of the particles ranges from 1,500 Dalton to 600,000 Dalton. Besides, the present invention can be used for manufacturing a medicament for treating or ameliorating a pancreas-related disease, wherein the medicament comprises an effective amount of the composition and a pharmaceutically acceptable carrier.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: January 14, 2025
    Assignee: PROFEAT BIOTECHNOLOGY CO., LTD.
    Inventors: Tsun-Yuan Lin, Mu-Kuei Chen, Tsang-Tse Chen, Hsun-Jin Jan, Chai-Hui Fu, Kai-Ting Wang
  • Patent number: 12194054
    Abstract: The present application provides an application of Chidamide in combination with R-CHOP in preparing a drug used for treating B-cell lymphoma, and also provides a drug comprising Chidamide and R-CHOP. Chidamide in combination with R-CHOP has a synergistic therapeutic effect on B-cell lymphoma.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: January 14, 2025
    Assignees: SHENZHEN CHIPSCREEN BIOSCIENCES CO., LTD., RUI JIN HOSPITAL AFFILIATED TO SHANGHAI JIAO TONG UNIVERSITY SCHOOL OF MEDICINE
    Inventors: Xianping Lu, Weili Zhao, Xin Fu, Pengpeng Xu, Ting Liu
  • Patent number: 12197022
    Abstract: An assembly alignment structure for optical component includes an optical fiber, comprising: a combined fiber segment and a plurality of bare fiber segments; a cover plate, having a first installation surface disposed with a plurality of guide grooves, an installation groove, and at least one first coupling groove, the bare fiber segments being in the corresponding in the guide grooves; a lens, arranged in the installation groove; a chip, having a signal receiving surface; a carrier plate, having a second installation surface disposed with at least one second coupling groove, the chip being fixed on the second installation surface; and at least one positioning post; wherein when the cover plate and carrier plate are aligned, the positioning post is located in the first and second coupling grooves, and the optical fiber and the lens are fixed and aligned between the carrier plate and the cover plate.
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: January 14, 2025
    Assignee: FOCI FIBER OPTIC COMMUNICATIONS, INC.
    Inventors: Ting-Ta Hu, Po-Yi Wu
  • Patent number: 12198361
    Abstract: Aspects of the present disclosure describe systems, methods, and structures for anti-spoofing 3D face reconstruction using infrared structured light that advantageously reconstructs 3D face structures for facial recognition and detect face surface material(s) such that human skin may be effectively distinguished from artifacts thereby providing additional security for facial recognition including immunity from 2D/3D print attacks including face masks and special make-ups.
    Type: Grant
    Filed: May 16, 2021
    Date of Patent: January 14, 2025
    Assignee: NEC Corporation
    Inventors: Yue Tian, Ting Wang, Shengtao Sun
  • Patent number: 12198991
    Abstract: A test structure for use in a dynamic random access memory is provided. A first gate structure is disposed in a semiconductor substrate. First and second source/drain regions are disposed in the semiconductor substrate and at two sides of the first gate structure. A bit line structure is disposed on the first source/drain region. A dielectric layer is disposed on the semiconductor substrate and the bit line structure. A first landing pad is disposed on the dielectric layer. A first contact plug is disposed in the dielectric layer and electrically connects the second source/drain region and the first landing pad. A conductive layer is disposed on and electrically connected to the first landing pad, in which a first upper surface of the first landing pad is entirely covered by the conductive layer, and the conductive layer has a substantially planar upper surface.
    Type: Grant
    Filed: May 3, 2022
    Date of Patent: January 14, 2025
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Chiang-Lin Shih, Hsueh-Han Lu, Yu-Ting Lin
  • Patent number: 12198996
    Abstract: An integrated fan-out package includes a first redistribution structure, a die, a plurality of conductive structures, an encapsulant, and a second redistribution structure. The die is bonded to the first redistribution structure through flip-chip bonding. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The second redistribution structure is disposed on the encapsulant and is electrically connected to the first redistribution structure through the conductive structures. The second redistribution structure includes at least one conductive pattern layer that is in physical contact with the encapsulant. Top surfaces of the conductive structures contacting the second redistribution structure are coplanar with a top surface of the encapsulant.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: January 14, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shin-Puu Jeng, Hsien-Wen Liu, Shih-Ting Hung, Yi-Jou Lin, Tzu-Jui Fang, Po-Yao Chuang
  • Patent number: 12200925
    Abstract: Methods, systems and apparatus for managing capacitors in memory devices, e.g., three-dimensional (3D) memory devices are provided. In one aspect, a capacitor includes: a first terminal, a second terminal conductively insulated from the first terminal, and a capacitance structure that includes a plurality of layers sequentially stacked together. At least one layer includes: one or more first conductive parts and one or more second conductive parts that are conductively insulated in the layer, the one or more first conductive parts being conductively coupled to the first terminal, the one or more second conductive parts being conductively coupled to the second terminal. The at least one layer is configured such that at least one of the one or more second conductive parts forms at least one subordinate capacitor with at least one adjacent first conductive part.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: January 14, 2025
    Assignee: Macronix International Co., Ltd.
    Inventors: Jung-Chuan Ting, Chih-Ting Hu
  • Patent number: 12199097
    Abstract: A device includes a substrate, a first semiconductor channel over the substrate, and a second semiconductor channel over the substrate laterally offset from the first semiconductor channel. A first gate structure and a second gate structure are over and laterally surround the first and second semiconductor channels, respectively. A first inactive fin is between the first gate structure and the second gate structure. A dielectric feature over the inactive fin includes multiple layers of dielectric material formed through alternating deposition and etching steps.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: January 14, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Ruei Jhan, Kuan-Ting Pan, Kuo-Cheng Chiang, Kuan-Lun Cheng, Chih-Hao Wang
  • Patent number: 12196370
    Abstract: Disclosed is a gas fuel supply system including a main fuel inlet, a pressure regulating valve, a pneumatically controlled shutoff bleeder valve and a main fuel outlet that are connected through pipes. The pneumatically controlled shutoff bleeder valve includes a pneumatic control valve and a shutoff bleeder valve. The shutoff bleeder valve is configured to open or close a gas fuel delivery passage from the main fuel inlet to the main fuel outlet, or configured to discharge the gas fuel in the pipe. The pneumatic control valve is configured to control the shutoff bleeder valve to be in a desired state. The gas fuel supply system does not need connection to an additional gas source, and the gas supply stability is improved.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: January 14, 2025
    Assignee: YANTAI JEREH PETROLEUM EQUIPMENT & TECHNOLOGIES CO., LTD.
    Inventors: Haibo Zhang, Lining Xu, Wangwang Zhuo, Ting Zhang, Qiong Wu, Wanchun Zha, Jianglei Zou, Fulun Bi, Cong Zhang
  • Patent number: 12200947
    Abstract: A semiconductor device includes a substrate having a magnetic tunneling junction (MTJ) region and a logic region, a magnetic tunneling junction (MTJ) on the MTJ region and a first metal interconnection on the MTJ. Preferably, a top view of the MTJ includes a circle and a top view of the first metal interconnection includes an ellipse overlapping the circle.
    Type: Grant
    Filed: December 26, 2023
    Date of Patent: January 14, 2025
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ting-Hsiang Huang, Yi-Chung Sheng, Sheng-Yuan Hsueh, Kuo-Hsing Lee, Chih-Kai Kang
  • Patent number: 12199037
    Abstract: A method of manufacturing an ECO base cell includes forming first and second active areas on opposite sides of, and having corresponding long axes arranged parallel to, a first axis of symmetry; forming non-overlapping first, second and third conductive structures having long axes in a second direction perpendicular to the first direction and parallel to a second axis of symmetry, each of the first, second and third conductive structures to correspondingly overlap the first and second active areas, the first conductive structure being between the second and third conductive structures; removing material from central regions of the second and third conductive structures; and forming a fourth conductive structure being over the central regions of the second and third conductive structures and occupying an area which substantially overlaps a first segment of the first conductive structure and a first segment of one of the second and third conductive structures.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: January 14, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Li-Chun Tien, Shun Li Chen, Ting-Wei Chiang, Ting Yu Chen, XinYong Wang
  • Patent number: 12198752
    Abstract: A memory device includes a high density or 3D data memory and a 3D reference memory. The reference memory is used to generate a reference signal used to sense data in the data memory. Conversion circuitry converts signals from one memory cell or a group of memory cells in the reference memory into a reference signal. The reference signal is applied to a sense amplifier to sense data stored in a selected memory cell in the data memory.
    Type: Grant
    Filed: June 6, 2023
    Date of Patent: January 14, 2025
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Teng-Hao Yeh, Hang-Ting Lue, Cheng-Lin Sung, Yung-Feng Lin
  • Patent number: 12198427
    Abstract: Techniques for adaptively visualizing content in an artificial environment based on the attention of a user. In one particular aspect, a computer-implemented method is provided that includes obtaining input data from a user, inferring content that is of interest to the user based on features gathered from the user's attention in the input data, identifying virtual content data based on the content that is of interest to the user, determining modifications to be applied to the virtual content data based on relevancy, applying the modifications to the virtual content data to generate a final format for the virtual content data, and rendering virtual content in the extended reality environment displayed to the user based on the final format for the virtual content data. The virtual content rendered from relevant virtual content data is more prominently displayed as compared to the virtual content rendered from semi-relevant and non-relevant virtual content data.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: January 14, 2025
    Assignee: META PLATFORMS TECHNOLOGIES, LLC
    Inventor: Ting Zhang
  • Patent number: 12200857
    Abstract: The present disclosure provides a package device including a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.
    Type: Grant
    Filed: September 27, 2023
    Date of Patent: January 14, 2025
    Assignee: InnoLux Corporation
    Inventors: Yeong-E Chen, Cheng-En Cheng, Yu-Ting Liu
  • Patent number: 12196781
    Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner spring elements along their lengths. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: January 14, 2025
    Assignee: Microfabrica Inc.
    Inventors: Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
  • Patent number: D1057646
    Type: Grant
    Filed: May 16, 2023
    Date of Patent: January 14, 2025
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Ting-Yun Lu, Yi-Chih Hsu, Jui-Yang Hung, Shih-Hsiu Lee, Ming-Jen Hsu