Abstract: The invention provides hyperspectral imaging-based methods that enable effective, efficient and non-invasive detection and characterization of thermal and ionizing radiation exposure in tissue. The methods allow for complete visualization and quantification of oxygenation and perfusion changes in thermal burn or ionizing radiation impacted skin and enables rapid identification of individuals exposed to such exposures and allows early prediction of extent of injury in normal tissue after exposure.

Abstract: A ceiling fan motor structure includes a housing, a magnetic ring, and a cover. The housing has an annular wall and a shielding plate which jointly define a receiving room. The open side of the annular wall forms an opening. The housing has an annular edge around the opening. The annular wall has a plurality of projections projecting from the inner wall surface of the receiving room. The magnetic ring has a plurality of recesses on its outer periphery and is placed into the receiving room of the housing in a way in which the recesses are respectively aligned with the projections and in which each projection is placed in the corresponding recess to prevent relative rotation between the magnetic ring and the housing. The cover closes the opening and is fixedly connected to the housing.

Abstract: A semiconductor device fabrication method includes irradiating a first surface of a substrate with a radiation beam. While irradiating the first surface of the substrate, a precursor gas is introduced near the first surface to deposit a layer including a first material. The precursor gas is removed from near the first surface after the depositing the layer. After the removing the precursor gas and prior to forming another layer over the layer, while irradiating a second surface of the layer, a cleaning gas is introduced near the second surface of the layer to transform the first material into a second material.

Abstract: A touch panel for narrowing bezel region and a touch display device using the same is disclosed. The touch panel includes a first transparent substrate, a first conduction layer, a transparent optical glue layer, a second transparent substrate and a second conduction layer from bottom to top. A bezel region of the first transparent substrate is provided with first conduction pads respectively connected with second conduction pads respectively through first conduction wires. The second transparent substrate is provided with third conduction pads. The second transparent substrate is penetrated with penetrating holes respectively arranged over the second conduction pads and respectively neighboring the third conduction pads. A third conduction layer is arranged on the third conduction pads and fills the penetrating holes. The second conduction pads are respectively connected with the third conduction pads through the third conduction layer in the penetrating holes.

Abstract: A multi-band antenna includes a metal backing plate, a radiating conductor, a non-conductor and a connector. The non-conductor is interleaved between the metal backing plate and the radiating conductor. The connector is connected to the metal backing plate and the radiating conductor, and the connector is configured to adjust a connection path between the metal backing plate and the radiating conductor to adjust an antenna operation band.

Abstract: A fingerprint identification device includes a substrate, at least two electrode areas, at least one dedicated sensing signal line, plural electrode selection switch groups, and plural signal lines. Each electrode area has plural electrodes. The signal lines are divided into plural first directional signal lines and plural second directional signal lines. The first directional signal lines are perpendicular to the second directional signal lines. The plural electrode selection switch groups sequentially or dynamically select at least one electrode as a sensing electrode block in each electrode area. The plural electrode selection switch groups configure the electrodes surrounding the sensing electrode block as at least two corresponding deflection electrode blocks. Each sensing electrode block is corresponding to at least two deflection electrode blocks. Each deflection electrode block has plural electrodes.

Abstract: A method for controlling a flying object floating in the air includes the steps of: a) maintaining the flying object at a current position in the air; b) determining whether a first user input is received; c) in the affirmative, allowing the flying object to be moved arbitrarily without use of a remote controller and without returning to the current position; d) detecting position information of the flying object; e) determining whether a second user input different from the first user input is received; and f) in the affirmative, repeating steps a) to e) with the current position being updated according to the position information. detected in step d).

Abstract: The present disclosure relates to an electromigration (EM) sign-off methodology that determines EM violations of components on different electrical networks of an integrated chip design using separate temperatures. In some embodiments, the method determines a plurality of actual temperatures that respectively correspond to one or more components within one of a plurality of electrical networks within an integrated chip design. An electromigration margin is determined for a component within a selected electrical network of the plurality of electrical networks. The electromigration margin is determined at one of the plurality of actual temperatures that corresponds to the component within the selected electrical network. The electromigration margin is compared to an electromigration metric to determine if an electromigration violation of the component within the selected electrical network is present.

Abstract: A stackable microelectronic package includes a first microelectronic die attached to and electrically connecting with a first substrate. A second microelectronic die is attached to the first die on one side, and to a second substrate on the other side. Electrical connections are made between the first die and the first substrate, between the second die and the second substrate, and between the first and second substrates, e.g., via wire bonding. The electrical connecting elements are advantageously encased in a molding compound. Exposed contacts on the first and/or second substrates, not covered by the molding compound, provide for electrical connections between the package, and another package stacked onto the package. The package may avoid coplanarity factors, can be manufactured using existing equipment, allows for intermediate testing, and can also offer a thinner package height.

Abstract: The present disclosure provides a method of repairing a mask. The method includes receiving a mask that includes a patterned feature, the patterned feature producing a phase-shift and having a transmittance; identifying a defect region on the mask; and forming a repair feature over the defect region on the mask, wherein forming the repair feature includes forming a first patterned material layer over the defect region and forming a second patterned material layer over the first patterned material layer to form the repair feature, the repair feature producing the phase-shift and having the transmittance.

Abstract: A stylus includes electrically conductive pen body including accommodation chamber and connection portion at end of accommodation chamber, core member mounted in accommodation chamber, and pen cap made of electrically non-conductive material and including conical base, mounting portion located at rear side of conical base and fastenable to connection portion, insertion hole for passing of core member, grooves located at periphery of conical base and conducting layer coated on surface of conical base, surface of each groove and surface of mounting portion for conduction with electrically conductive pen body. After long uses, part of conducting layer in each groove can be maintained intact and in integrity with part of conducting layer at mounting portion. Conducting layer can be positively and electrically conducted with electrically conductive material of pen body to provide effective shielding effect for protection of internal electronic components of stylus against external EMI and static electricity.

Abstract: A display panel includes a first substrate and a second substrate facing the first substrate. The first and substrate includes a plurality of pixel areas and a non-pixel area disposed adjacent to the pixel areas. The display panel further includes a plurality of signal lines disposed on the second substrate. The display panel further includes a color filter disposed on the first substrate or the second substrate. The display panel further includes an inorganic layer disposed on the color filter layer, an organic layer disposed on the inorganic layer, and a conductive layer disposed on the organic layer.

Abstract: The present disclosure provides systems and methods for storing, reading, and writing data using particle-based acoustic wave driven shift registers. The shift registers may physically shift particles along rows and/or columns of wells through the interactions of two parallel surfaces. A transducer may generate an acoustic wave to displace one or more of the two parallel surfaces. The particles may be transferred to and/or otherwise constrained by a buffer surface during at least a portion of the acoustic wave, such that the particles may be shifted during one or more cycles of the acoustic wave. In various embodiments, the amplitude of the acoustic wave may correspond to the spacing distance between each of the wells. The wells may be physical and/or potential wells.

Abstract: A non-volatile memory device is provided. The non-volatile memory device includes a substrate area, two storage units, a spacer structure and two control units. The storage units include two anti-fuse gates each having a gate dielectric layer between the anti-fuse gate and the substrate area and two diffusion areas. The spacer structure is formed on the substrate area and between the two anti-fuse gates and contacts thereto. Each of the diffusion areas is a first doping area doped with a first type dopant contacting one of the two anti-fuse gates. Each of the control units includes a select gate formed on the substrate area and a second doping area. A first side of the select gate contacts one of the diffusion areas of the storage unit. The second doping area is doped with the first type dopant and contacts a second side of the select gate.

Abstract: The present invention relates to a method for removing water from swollen superabsorbent polymers in a gel state, and a method for recycling sanitary absorbent articles using the same. According to the method of the present invention, water is removed from swollen superabsorbent polymers by immersing swollen superabsorbent polymers in a gel state into a composition wherein sea water that is readily available and calcium chloride that is readily available at low cost are mixed for a specified period of time. The method makes it possible to easily and economically remove water from swollen SAPs in a gel state. Thus, the method provides an economical and environmentally-friendly means for recycling sanitary absorbent articles comprising an absorbent that consists of SAP and cellulose pulp, after being used for absorbing human waste.

Abstract: An integrated structure of power amplifier and acoustic wave device comprises: a compound semiconductor epitaxial substrate, a power amplifier upper structure formed on a first side of said compound semiconductor epitaxial substrate, and a film bulk acoustic resonator formed on a second side of said compound semiconductor epitaxial substrate; wherein forming an epitaxial structure on a compound semiconductor substrate to form said compound semiconductor epitaxial substrate; wherein said first side of said compound semiconductor epitaxial substrate and said power amplifier upper structure form a power amplifier; said second side of said compound semiconductor epitaxial substrate and said film bulk acoustic resonator form an acoustic wave device; the integrated structure of power amplifier and acoustic wave device on the same compound semiconductor epitaxial substrate is capable of reducing the component size, optimizing the impedance matching, and reducing the signal loss between power amplifier and acoustic w

Abstract: A method at a user equipment (UE) includes measuring a signal quality of each cell detected from a plurality of frequencies included in a connection release message from a radio access technology (RAT) . The measuring may occur during a long-period SIB collection for a previously determined target cell. The method also includes determining a new target cell in place of a previously determined target cell based at least in part on a signal quality of each cell measured during the long-period SIB collection for the previously determined target cell.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate; a first nanowire disposed over the substrate; a second nanowire disposed over the substrate; a first pad formed at first ends of the first and second nanowires, a second pad formed at second ends of the first and second nanowires, wherein the pads comprise different materials than the nanowires; and a gate surrounding at least a portion of each of the first and second nanowires.

Abstract: An integrated circuits structure includes a semiconductor substrate, at least an non-planar field effect transistor (FET) device formed on the semiconductor substrate, and an interconnection structure formed on the semiconductor substrate. The non-planar FET device includes a plurality of fins and a gate electrode. The interconnection structure includes a plurality of first group metals and a plurality of second group metals. The first group metals are formed on the non-planar FET and the second group metals are formed on the first group metals. The first group metals include a first metal pitch and the second group metals include a second metal pitch. The second metal pitch is 1.2-1.5 times to the first metal pitch.