Patents by Inventor To-Mei Wang

To-Mei Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190056217
    Abstract: A three dimensional image measurement system including a first optical system and a second optical system is provided. The first optical system is adapted to output a structural light beam and a zero order light beam. There is an angle between the structural light beam and the zero order light beam. The first optical system performs an optical operation to project the structural light beam to a three dimensional object to obtain three dimensional information of the three dimensional object. The second optical system is adapted to receive the zero order light beam and perform another optical operation by using the zero order light beam. The first optical system includes a plurality of optical elements. The value of the angle between the structural light beam and the zero order light beam is determined according to position parameters of the optical elements.
    Type: Application
    Filed: October 25, 2017
    Publication date: February 21, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Wen Chen, Te-Mei Wang
  • Patent number: 10212178
    Abstract: Data packets transmitted to and from an IoT device are obtained and at least one of the data packets are analyzed using deep packet inspection to identify transaction data from payload of the at least one of the data packets. An event log is generated for the IoT device from the transaction data, the event log, at least in part, used to generate a historical record for the IoT device. The IoT device into a device profile based on the historical record for the IoT device. The event log is updated in real-time to indicate current operation of the IoT device. Abnormal device behavior of the IoT device is determined using the event log and the device profile. The device profile is updated to indicate the abnormal device behavior of the IoT device.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: February 19, 2019
    Assignee: ZingBox, Ltd.
    Inventors: Gong Cheng, Pui-Chuen Yip, Zhiwei Xiao, Ran Xia, Mei Wang
  • Publication number: 20190026504
    Abstract: The present disclosure provides a QR code graphic manufacturing device, which comprises a gray-scaled adjusting module, a data-hiding module, and an error-diffusion module. The gray-scaled adjusting module is used to adjust a gray-scaled value of an original image to generate a modified gray-scaled image. The data-hiding module and the error-diffusion module are respectively used to process the modified gray-scaled image and a QR code, and to generate a QR code graphic with a better hidden effect.
    Type: Application
    Filed: October 22, 2017
    Publication date: January 24, 2019
    Inventors: His-Chun WANG, Chun-Shien LU, Jia-Chi HO, Shan-Hua YEH, Yu-Mei WANG, Chia-Tsen SUN, Pei-Chun KUAN
  • Publication number: 20190014137
    Abstract: Techniques for providing Internet of Things (IoT) device security are disclosed. An applicable system includes IoT devices coupled to an evolving context-aware IoT device security system. In a specific implementation, the system uses common factor aggregation of event parameters to determine IoT device personality.
    Type: Application
    Filed: April 9, 2018
    Publication date: January 10, 2019
    Inventors: Jun Du, Mei Wang, Ran Xia, Zhiwei Xiao
  • Patent number: 10172485
    Abstract: A decorative and connectable display arrangement that includes a housing of multi-sided form having opposed first and second sides and a bottom, an inner support frame that is disposed within the housing and including a cap member having an open top port, and at least one decorative member that is supported within the housing and extends upwardly through the open top port. The decorative member includes a base piece that is pivotally supported in the housing and a stem piece extending from the base piece and extending through the open top port. A solar energy source or panel is supported in the inner support frame and is effective for driving the at least one decorative member in a predetermined motion direction. The housing has 3 on opposed sides thereof an interlock tongue and groove mechanism that enables adjacent ones of the housings to be engaged together.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: January 8, 2019
    Assignee: Fourstar Group Inc.
    Inventors: Yu-Chi Wu, Hsiu-Mei Wang
  • Patent number: 10177032
    Abstract: Devices, packaging devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes a molding material and a plurality of through-vias disposed within the molding material. A dummy through-via and an integrated circuit die are also disposed within the molding material. An interconnect structure is disposed over the molding material, the plurality of through-vias, the dummy through-via, and the integrated circuit die.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: January 8, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Wei Chen, An-Jhih Su, Jo-Mei Wang
  • Publication number: 20180279712
    Abstract: Woven hats and methods for manufacturing woven hats by using an ultrasonic sewing technology without a sewing thread are disclosed. One illustrative method comprises steps such as: cutting a raw material of a hat crown into a plurality of pieces, then bonding such material in pairs using an ultrasonic sewing machine, applying to seam areas a hot-pressing bonding technology of heat-seal adhesive tape, and/or otherwise completing the manufacturing of the hat crown; manufacturing a visor by using a high-frequency hot-pressing technology; manufacturing a sweatband by using a one-time hot-pressing technology; bonding the hat crown, the visor, and the sweatband with an ultrasonic sewing machine; and fixing a rear fastener or a tail belt through rivets. The disclosed technology makes it easier to realize intelligent and automatic reformation of the manufacturing line.
    Type: Application
    Filed: March 28, 2018
    Publication date: October 4, 2018
    Inventor: Ai'mei Wang
  • Publication number: 20180251884
    Abstract: A hard coating, which is to disposed to cover a surface of a tool substrate, has a total thickness of 0.5-20 ?m and includes an A layer and nanolayer-alternated layer that are alternately laminated by physical vapor deposition. The nanolayer-alternated layer includes a B layer and C layer that are alternately laminated. The A layer has a thickness of 50-1000 nm and is AlCr(SiC) nitride that is represented by a composition formula of [Al1-W-XCrW(SiC)X]N wherein an atomic ratio W is 0.20-0.80 and an atomic ratio X is 0.01-0.20. The B layer has a thickness of 1-100 nm and is TiAl nitride that is represented by a composition formula of [Ti1-YAlY]N wherein an atomic ratio Y is 0.30-0.85. The C layer has a thickness of 1-100 nm and is Ti(SiC) nitride represented by a composition formula of [Ti1-Z(SiC)Z]N wherein an atomic ratio Z is 0.05-0.45. The nanolayer-alternated layer has a thickness of 50-1000 nm.
    Type: Application
    Filed: September 4, 2015
    Publication date: September 6, 2018
    Applicant: OSG CORPORATION
    Inventors: Masatoshi SAKURAI, Mei WANG
  • Publication number: 20180243837
    Abstract: A hard coating, which is to be disposed to cover a surface of a substrate, has a total thickness of 0.5-20 ?m, and includes an A layer and nanolayer-alternated layer that are alternately laminated by physical vapor deposition. The nanolayer-alternated layer includes a B layer and a C layer that are alternately laminated. The A layer has a thickness of 50-1000 nm and is AlCr nitride that is represented by a composition formula of [Al1-UCrU]N wherein an atomic ratio U is 0.20-0.80. The B layer has a thickness of 1-100 nm and is TiAl nitride that is represented by a composition formula of [Ti1-WAlW]N wherein an atomic ratio W is 0.30-0.85. The C layer has a thickness of 1-100 nm and is TiSi nitride that is represented by a composition formula of [Ti1-YSiY]N wherein an atomic ratio Y is 0.05-0.45. The nanolayer-alternated layer has a thickness of 50-1000 nm.
    Type: Application
    Filed: September 4, 2015
    Publication date: August 30, 2018
    Applicant: OSG CORPORATION
    Inventors: Masatoshi SAKURAI, Mei WANG, Hiroaki SUGITA
  • Patent number: 9998719
    Abstract: A non-planar surface projecting system, an auto-calibration method thereof and an auto-calibration device thereof are provided. In an embodiment of the non-planar surface auto-calibration method, a depth map of a projection surface is measured, a corresponding area corresponding to a projecting area and a depth sensing area is calibrated; and in the corresponding area, an interactive content is adjusted according to the depth map of the projection surface.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: June 12, 2018
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Te-Mei Wang, Zen-Chung Shih
  • Publication number: 20180157143
    Abstract: An electrophoretic display panel including a first electrode layer, a second electrode layer, an electrophoretic display layer and a low surface energy coating layer is provided. The first electrode layer has a first surface and a second surface corresponding to the first surface. The electrophoretic display layer is disposed between the first electrode layer and the second electrode layer. The electrophoretic display layer has a third surface. The third surface of the electrophoretic display layer and the second surface of the first electrode layer have a gap therebetween. A gap distance of the gap is changed with a press operation. The low surface energy coating layer is coated on at least one of the second surface of the first electrode layer and the third surface of the electrophoretic display layer.
    Type: Application
    Filed: December 5, 2017
    Publication date: June 7, 2018
    Applicant: E Ink Holdings Inc.
    Inventors: Hsiao-Lung Cheng, Pin-Cheng Chiu, Ya-Mei Wang, Chi-Mao Hung
  • Publication number: 20180142214
    Abstract: An in vitro method for screening a testing compound to evaluate its potential as a liver drug of the disclosure is provided. The method includes applying the testing compound to cells of an isolated human liver tumor cell line, named as ITRI-H28, measuring a cell viability of the cells and determining the effect of the testing compound on the cells by calculating a half maximal inhibitory concentration (IC50) of the testing compound.
    Type: Application
    Filed: January 3, 2018
    Publication date: May 24, 2018
    Applicant: Industrial Technology Research Institute
    Inventors: Mei-Wei Lin, Dian-Kun Li, Ling-Mei Wang, Ching-Huai Ko, Chin-Pen Lai, Chun-Min Liu, Hsiang-Wen Tseng
  • Publication number: 20180143181
    Abstract: An in vitro method for screening a testing compound to evaluate its potential as a liver drug is provided. The method includes applying the testing compound to cells of an isolated human liver tumor cell line, named as ITRI-H16, measuring a cell viability of the cells and determining the effect of the testing compound on the cells by calculating a half maximal inhibitory concentration (IC50) of the testing compound.
    Type: Application
    Filed: January 3, 2018
    Publication date: May 24, 2018
    Applicant: Industrial Technology Research Institute
    Inventors: Mei-Wei Lin, Dian-Kun Li, Ling-Mei Wang, Ching-Huai Ko, Chin-Pen Lai, Chun-Chung Wang, Hsiang-Wen Tseng
  • Publication number: 20180144139
    Abstract: Techniques for assessing risks of IoT device. A system utilizing such techniques can include a packet analysis based IoT device risk assessment system and an IoT device risk assessment system. A method utilizing such techniques can include extraction of IoT device risk factors from a device profile of an IoT device and application of assessment weights to the IoT device risk factors to assess a risk level of an IoT device.
    Type: Application
    Filed: November 21, 2016
    Publication date: May 24, 2018
    Applicant: ZingBox, Ltd.
    Inventors: Gong Cheng, Mayuresh Ektare, Mei Wang
  • Patent number: 9941248
    Abstract: Package structures, PoP devices and methods of forming the same are disclosed. A package structure includes a first chip, a redistribution layer structure, a plurality of UBM pads, a plurality of connectors and a separator. The redistribution layer structure is electrically connected to the first chip. The UBM pads are electrically connected to the redistribution layer structure. The connectors are electrically connected to the UBM pads. The separator is over the redistribution layer structure and surrounds the connectors.
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: April 10, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tien-Chung Yang, An-Jhih Su, Hsien-Wei Chen, Jo-Mei Wang, Wei-Yu Chen
  • Publication number: 20180080718
    Abstract: The heat pipe comprises a shell and an inner zeolite coated structure. The shell has an inner surface. The inner surface surrounds an enclosed chamber. The chamber is partially filled with a working fluid in a vacuum. The working fluid may be changed into a liquid phase or a gas phase by following temperature change. The coating material comprises a zeolite, a binder and an additive. The material is sintered on the inner surface of the heat pipe. Consequently, the zeolite coating is formed between the inner surface and the enclosed chamber. Thus, the present invention uses a porous material of zeolite with pore size smaller than grooves and meshes to have excellent evaporation heat transfer and capillary force. The zeolite coating of the present invention does not fail without air isolation. The present invention is inner manufactured under atmospheric condition so has no size limitation.
    Type: Application
    Filed: September 19, 2016
    Publication date: March 22, 2018
    Inventors: Heng-Yi Li, Meng-Chang Tsai, To-Mei Wang
  • Patent number: 9922939
    Abstract: An embodiment device package includes a device die, a molding compound surrounding the device die, a conductive through inter-via (TIV) extending through the molding compound, and an electromagnetic interference (EMI) shield disposed over and extending along sidewalls of the molding compound. The EMI shield contacts the conductive TIV, and the conductive TIV electrically connects the EMI shield to an external connector. The external connector and the EMI shield are disposed on opposing sides of the device die.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: March 20, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chen, Hsien-Wei Chen, An-Jhih Su, Jo-Mei Wang, Tien-Chung Yang
  • Publication number: 20180074648
    Abstract: A tapping detecting device, a tapping detecting method and a smart projecting system using the same are provided. The tapping detecting device comprises a fingertip size providing unit, a laser emitting unit, a laser sensing unit and a processing unit. The fingertip size providing unit is used for providing the size of a fingertip of a finger. The laser emitting unit is used for providing a laser at a parallel surface above a plane. The laser sensing unit is used for capturing a reflecting image which shows the reflection of the laser caused by the fingertip. The processing unit is used for obtaining a reflecting region according to the reflecting image, and for adjusting a threshold value according to the size of the fingertip. If the area of the reflecting region is larger than the threshold value, then the processing unit deems that the fingertip touches the plane.
    Type: Application
    Filed: December 13, 2016
    Publication date: March 15, 2018
    Inventors: Fu-Song HSU, Te-Mei WANG
  • Patent number: 9912088
    Abstract: A micro plug connector has an insulative housing with multiple mounting holes, multiple terminals respectively mounted in the mounting holes, and a shielding shell covering the insulative housing and the terminals. Each terminal has a mounting section mounted in the insulative housing, a welding section protruding backward from a rear end of the mounting section and protruding out of a rear portion of the insulative housing, and an electrical connection section protruding forward from a front end of the mounting section and partially exposed out of a corresponding one of the mounting holes. Each of at least one of the terminals has an anti-bending protrusion abutting against an inner top surface defined in the corresponding one of the mounting holes. The anti-bending protrusion prevents a distal end of the electrical connection section of the terminal from bending up and contacting the shielding shell by accident.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: March 6, 2018
    Assignee: ADVANCED-CONNECTEK INC.
    Inventors: Ming-Lung Chien, Ming-Yung Chang, Yu-Bin Li, Er-Li Huang, Yao-Mei Wang
  • Publication number: 20180026010
    Abstract: A package structure has first and second dies, a molding compound, a first redistribution layer, at least one first through interlayer via (TIV), second through interlayer vias (TIVs), an electromagnetic interference shielding layer and conductive elements. The first die is molded in the molding compound. The second die is disposed on the molding compound. The first redistribution layer is located between the conductive elements and the molding compound and electrically connected to the first and second dies. The molding compound is located between the second die and the first redistribution layer. The first and second TIVs are molded in the molding compound and electrically connected to the first redistribution layer. The second TIVs are located between the first die and the first TIV. The electromagnetic interference shielding layer is in contact with the first TIV. The conductive elements are connected to the first redistribution layer.
    Type: Application
    Filed: July 21, 2016
    Publication date: January 25, 2018
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Li-Hsien Huang, An-Jhih Su, Hsien-Wei Chen, Hua-Wei Tseng, Jo-Mei Wang, Tien-Chung Yang, Kuan-Chung Lu