Abstract: A mounting bracket for a foldable transport device includes a top portion, a bottom portion, a front wall connecting the top portion and the bottom portion, a first foot peg mounted to the mounting bracket by a first pin and moveably connected to the mounting bracket between a stowed configuration and a riding configuration, and a second foot peg mounted to the mounting bracket by a second pin and moveably connected to the mounting bracket between a stowed configuration and a riding configuration.

Abstract: A light guide assembly includes a housing element, at least one light guide element, and at least one light-shielding element. The housing element includes an outer surface and an inner surface. The light guide element is configured for a light to pass therethrough. The light guide element includes a light entrance surface, at least one light exit surface, and at least one wall surface. The wall surface surrounds and is connected to an edge of the light exit surface and extends toward the light entrance surface. The light exit surface is in contact with the inner surface. The at least one light-shielding element surrounds the at least one wall surface and is in contact with the inner surface.

Abstract: A semiconductor device structure and methods of forming the same are described. The structure includes a first semiconductor material disposed over a substrate and a dielectric layer disposed on the first semiconductor material. The dielectric layer includes a dopant. The structure further includes a second semiconductor material disposed on the dielectric layer, a first semiconductor layer in contact with the second semiconductor material, and a first dielectric spacer in contact with the first semiconductor layer, wherein the first dielectric spacer includes the dopant.

Abstract: A rear wheel latching mechanism for a personal transport device and a corresponding personal transport device are provided. The mechanism includes a rear wheel attached to an arm, which includes an inner extrusion that slides on one axis of a fixed frame in a horizontal direction. The fixed frame comprises an outer extrusion that surrounds the inner extrusion. The mechanism also includes a rear wheel cam-latch, configured to lock the inner extrusion and the outer extrusion together. The rear wheel cam-latch allows the rear wheel to articulate when the rear wheel cam-latch is unlatched between a stored state and a deployed state. The mechanism also includes a rear wheel pin that catches and holds the rear wheel in the deployed state to fix a front portion of the inner extrusion and a rear portion of the outer extrusion before the rear wheel cam-latch clamps the inner and outer extrusions together.

Abstract: An image processing method is applied to a driver-end device, including obtaining an image-to-be-printed and extracting a text part and an image part from the image-to-be-printed. The image processing method includes converting all extracted image parts on one page into first image data. The image processing method includes converting the extracted text part into a page description language. The image processing method includes generating an image instruction based on the first image data and inserting the image instruction into the page description language to form a target page description language. The image processing method also includes sending the target page description language to an image forming device to execute an image forming job.

Abstract: A semiconductor device, and method of fabricating the same, includes a first substrate, the first substrate including at least one visible light photosensor disposed between a first side and a second side of the first substrate, a second substrate including an infrared light photosensor disposed between a second side of the second substrate and a first side of the second substrate, and a metalens disposed between the visible light photosensor and the infrared light photosensor, the metalens configured to focus infrared light impinging on a surface of the first substrate onto the infrared light photosensor.

Abstract: A gait evaluating system including a processor is provided. The processor identifies whether a gait type of the user belongs to a normal gait, a non-neuropathic gait or a neuropathic gait based on step feature values of a user and walking limb feature values of the user. In response to that the gait type of the user belongs to the non-neuropathic gait, the processor controls the display panel to display a first auxiliary information, a second auxiliary information, and a third auxiliary information. The first auxiliary information indicates a potential sarcopenia of the user. The second auxiliary information indicates a dietary guideline for muscle building and muscle strengthening. The third auxiliary information shows a motion instruction video for regaining or maintaining muscle strength of the user.

Abstract: In an embodiment, an interposer has a first side, a first integrated circuit device attached to the first side of the interposer with a first set of conductive connectors, each of the first set of conductive connectors having a first height, a first die package attached to the first side of the interposer with a second set of conductive connectors, the second set of conductive connectors including a first conductive connector and a second conductive connector, the first conductive connector having a second height, the second conductive connector having a third height, the third height being different than the second height, a first dummy conductive connector being between the first side of the interposer and the first die package, an underfill disposed beneath the first integrated circuit device and the first die package, and an encapsulant disposed around the first integrated circuit device and the first die package.

Abstract: The invention discloses an astaxanthin (AST) nanoemulsion and its manufacturing method. The manufacturing method comprising steps of: adding an AST material into a peanut oil and mixing them uniformly to obtain an AST oil; adding 0.25-1.5 (w/w) % of a surfactant into the AST oil and mixing them uniformly to obtain a mixed solution; and adding water into the mixed solution to obtain an AST emulsion precursor; and shaking the AST emulsion precursor to obtain the AST nanoemulsion.

Abstract: This disclosure is directed to a circuit that includes a substrate, a target device on the substrate, and an electrostatic discharge (ESD) device electrically coupled to the target device. The ESD device includes an ESD detection circuit electrically coupled to a first reference voltage supply and a second reference voltage supply, an inverter circuit electrically coupled to the ESD detection circuit and configured to trigger in response to an ESD event on the first or second reference voltage supply, a rectifier circuit electrically coupled to the inverter circuit and configured to rectify a current discharged from the inverter circuit, and a transistor electrically coupled to the rectifier circuit and configured to discharge a remaining current passing through the rectifier circuit.

Abstract: A semiconductor device includes a substrate, a stiffener ring over the substrate, and an adhesive ring between the substrate and the stiffener ring. The adhesive ring includes a first part, a second part and a third part disposed between the first part and the second part. The first part and the second part have a first thickness, and the third part has a second thickness greater than the first thickness. The third part of the adhesive ring is covered by the stiffener ring.

Abstract: A semiconductor device including a first semiconductor die, a second semiconductor die, an insulating encapsulation and a warpage control pattern is provided. The first semiconductor die includes an active surface and a rear surface opposite to the active surface. The second semiconductor die is disposed on the active surface of the first semiconductor die. The insulating encapsulation is disposed on the active surface of the first semiconductor die and laterally encapsulates the second semiconductor die. The warpage control pattern is disposed on and partially covers the rear surface of the first semiconductor die.

Abstract: A lens groups includes a first lens, a transflective film, a second lens, a composite film, a third lens and a fourth lens arranged in sequence. The first lens includes a first surface and a second surface. The second lens comprises a third surface and a fourth surface, the third surface faces to the second surface. The transflective film is attached to the third surface and the composite film is attached to the fourth surface. The composite film includes a phase retardation layer and a reflective polarizing layer, and the phase retardation layer is attached to the fourth surface. The third lens includes a fifth surface and a sixth surface, the fifth surface faces to the fourth surface. The fourth lens comprises a seventh surface and an eighth surface, the seventh surface faces to the sixth surface. A near-to-eye display device is further disclosed.

Abstract: The present disclosure provides a two-stage cavitation generator for organic wastewater treatment, including a shrouded impeller, a stator, and a rotor. The shrouded impeller includes a front cover plate, blades, and a rear cover plate. Several blades are evenly distributed between the front cover plate and the rear cover plate. A working surface of the blade is an arc surface, and a back of the blade protrudes locally, so that a flow channel between the back of the blade and a working surface of its adjacent blade is narrowed locally, forming a throat structure. An outlet of the shrouded impeller is provided with the stator and the rotor, and the stator is located at an outer edge of the front cover plate and fixed on an inner wall of a volute. The rotor is mounted on the rear cover plate.

Abstract: A HDR tone mapping system includes several modules. A semantic segmentation module is used to extract semantic information from the input image. An image decomposition module is used to decompose the input image to a high-bit base layer and a detail layer. A statistics module is used to generate statistics of pixels of the input image according to the semantic information. A curve computation module is used to generate a tone curve from the statistics. A compression module is used to compress the high-bit base layer to a low-bit base layer according to the tone curve, the statistics and the semantic information. A detail adjustment module is used to tune the detail layer according to the semantic information and the statistics to generate an adjusted detail layer. An image reconstruction module is used to combine the adjusted detail layer and the low-bit base layer to generate an output image.

Abstract: A circuit wiring determining method includes: obtaining information used to describe a port and a pin; determining a plurality of candidate connection paths based on the information about the port and the pin; obtaining a cost value of each candidate connection path by using a machine learning model, where the cost value indicates impact of the candidate connection path on a total quantity of connection paths between a plurality of ports and a plurality of pins; and determining at least one target connection path from the plurality of candidate connection paths based on the cost value. In this application, the cost value of the candidate connection path is effectively evaluated by using the machine learning model, and a preferred target connection path is determined based on the cost value, to increase a quantity of connections between the ports and the pins of an entire circuit.

Abstract: A patch cord for transmitting between a single mode fiber (SMF) and a multi-mode fiber (MMFs) has a MMF, SMF, and a photonic crystal fiber (PCF) with a hollow core placed between the SMF and MMF. A mode field diameter (MFD) of the PCF hollow core section is in the range of 16 to 19 microns, the length of the PCF is between 1 cm to 10 cm, the MMF has 50±2 microns core diameter, the SMF has a 6-9 microns core diameter, and the coupling between the PCF mode to the MMF fundamental mode is maximized.

Abstract: A semiconductor structure and a method of forming the same are provided. An exemplary method of forming the semiconductor structure includes receiving a workpiece including a fin structure over a front side of a substrate, recessing a source region of the fin structure to form a source opening, extending the source opening into the substrate to form a plug opening, forming a semiconductor plug in the plug opening, planarizing the substrate to expose the semiconductor plug from a back side of the substrate, performing a first wet etching process to remove a portion of the substrate, performing a pre-amorphous implantation (PAI) process to amorphize a rest portion of the substrate, performing a second wet etching process to remove the amorphized rest portion of the substrate to form a dielectric opening, depositing a dielectric layer in the dielectric opening, and replacing the semiconductor plug with a backside source contact.

Abstract: A power converter is coupled between a power source and multiple loads, and the power converter includes a first switch module. The switch module includes an inductor, a first switch, a second switch, a third switch, and a fourth switch. The first switch, the second switch, the third switch, and the fourth switch are configured to be turned on or turned off so that the inductor is stored energy or released energy to converter the power source into multiple voltages to the multiple loads.

Abstract: A display picture synchronization method includes a source device that sends a first picture frame and a first specified display time corresponding to the first picture frame to each of the sink devices. If each of the sink devices successfully receives the first picture frame and determines that the first picture frame is capable of being displayed based on the first specified display time, each of the devices for performing picture frame synchronization display displays the first picture frame based on the first specified display time. Each of the devices for performing picture frame synchronization display does not display the first picture frame if a first sink device in the sink devices fails to receive the first picture frame or successfully receives the first picture frame but determines that the first picture frame is incapable of being displayed based on the first specified display time.