Abstract: A vibration attenuator, for an ultrasonic transducer having a transducer shaft, having: a compressible sleeve mountable on said shaft wherein said sleeve comprises vibration attenuating material; a housing for said sleeve mountable on the shaft, and a compression device attachable to the housing and for compressing the sleeve, wherein the sleeve snugly abuts against said shaft when compressed.

Abstract: A grounding plug structure configured for push-type snap lock fastening in circuit board screw holes is provided with a resilient deformable conductive member. When a circuit board with one or more such plug structures fastened thereto is mounted with respect to a tray or chassis, the conductive portion of the plug structure is deformed against a surface of the tray, forming an effective conductive pathway, e.g., for grounding, between the tray and the circuit board. In this way, grounding pathways can be established while eliminating the need for at least some screw mounting and/or standoff structures.

Abstract: The present invention provides for an apparatus and method for verifying a product and monitoring conditions of the product during shipping, storage and use. The apparatus includes at least one controller configured to provide functional control to the apparatus. A memory is coupled with controller, and configured to store at least the product identification. The apparatus includes a communication interface coupled with the controller, and is configured to communicate at least the product identification stored in the memory. The controller couples with at least one sensor positioned proximate the product. The sensor is configured to measure at least one condition of the product. The apparatus monitors conditions of the product by initiating at least one measurement of the product conditions, and storing at least one of the measurements. The apparatus further communicates the measurements of the product conditions to allow the determination of the quality of the product.

Abstract: A system, methods, and computer readable medium for providing automated customer support of semiconductor manufacturing equipment is disclosed. Sensors attached to the semiconductor manufacturing equipment can be monitored by either an automated program or a service technician to detect alarm conditions. Upon detection of an alarm condition, a remotely located customer support system can be contacted and provided with key values indicating the nature of the alarm condition. The remotely located customer support system can use the key values to query a database for electronic text files containing instructions for a service technician to follow when taking corrective action to resolve the alarm condition. When an electronic text file is found to be associated with the key value in the database, the electronic text file is transmitted to a service technician who services the manufacturing equipment at the customer site.

Abstract: A cooling device for a notebook personal computer which has a personal computer body accommodating an exothermic electronic element and a display hinged in an openable/closable manner to the personal computer body through a hinge mechanism, including a first heat pipe having a first end portion arranged along the display and a second end portion arranged in parallel with a center line of rotation of said hinge mechanism; a second heat pipe having a first end portion arranged on the electronic element in a heat transferable manner and a second end portion arranged in thermal contact with the second end portion of said first heat pipe; and a connector defining a first hole having an axis and configured to receive the second portion of the first heat pipe, a second hole having an axis different from the axis of the first hole and configured to receive the second portion of the second heat pipe, the first and second holes communicating with each other; wherein at least one of the second end portions is positioned

Abstract: An electronic device cooler for cooling an exothermic member arranged in a case, including an air compressor configured to compress adiabatically air in the case to an elevated temperature. Also included is a heat pipe configured to discharge heat from the air adiabatically compressed to the elevated temperature to an outside of said case, and an expansion turbine configured to expand adiabatically the air having heat discharged by the heat pipe to a reduced temperature.