Abstract: The present disclosure relates to the field of electrical connection of cables and the like, for all industries and in particular in the aeronautic or automotive industry. A single pass-through connector for connecting first cables and second cables disposed in respective first area and second area of a vehicle, the single pass-through connector having a frame body and a plurality of first communication network connectors for receiving portions of the first cables and of the second cables, each first communication network connector has a back portion and a front portion, and wherein each first communication network connector is arranged for receiving the corresponding first cable from the back portion, and for receiving the corresponding second cable from the front portion, so as to connect the corresponding first cable and the corresponding second cable together and pass-through a separation between the two areas.

Abstract: A rack assembly unit for mounting a control unit to a vehicle rack system is provided; a rack chassis and a tray are configured to receive the control unit for coupling to a vehicle system. The tray is movably coupled to the rack chassis at a coupling mechanism, which provides for movement of the tray relative to the rack chassis between open and closed positions. At the open position, the tray is spaced apart from rack chassis to facilitate user access to the tray and receiving the control unit therein. At the closed position, the tray is located fully inserted relative to the rack chassis and such that the control unit located in the tray is provided at a control unit operating position thermally coupled to a cold plate of a cooling system to provide for cooling of components of the control unit.

Abstract: An apparatus or system can act as a cooling device configured for cooling a plurality of high-power electronic components mounted on a circuit board. The apparatus includes a plurality of cooling plate assemblies, the cooling plate assemblies each including a cooling plate for mating to one of the high-power electronic components and an enclosure mounted to the cooling plate for defining a coolant transport path over at least part of a surface thereof. The apparatus further includes one or more flexible conduits that connect between the cooling plate assemblies for fluid communication between their respective coolant transport paths.

Abstract: A cooling device for cooling a plurality of electronic components mounted on a circuit board. The device includes a contact sheet shaped for conforming to the plurality of electronic components and comprising a mating face for mating against the plurality of electronic components and a cooled face. An enclosure is mounted to the cooled face and defines a coolant transport circuit for circulating coolant liquid there thorough. A coupling may be provided for biassing the mating face toward the plurality of electronic components.